Physical Vapor Deposition Equipment

  1. Nexx Apollo PVD

    Horizontal Sputterers

    Nexx Apollo PVD

    The Nexx Apollo PVD system is a fully automated Physical Vapor Deposition (PVD) tool using a multiple wafer multiple chamber design. The system deposits thin metal films used in interconnect metallization on wafers. It uses a staged vacuum system that allow short pump down time to achieve ultra high vacuum. The multi chamber design allows for precise control over all process parameters.

  2. AMAT Endura HP PVD

    Cluster Sputtering Tools

    AMAT Endura HP PVD

    It’s an AMAT Endura 5500 HP PVD Tool. Equipped with 2 Degas-Orienter, one Preclean II Chamber, 3 Narrow Body PVD Chambers and two Wide-Body PVD Chambers. For 6’’ Wafersize.

    The Tool has been upgraded to a Vita Controller in March 2023.

  3. CLN 200 II

    Cluster Sputtering Tools

    CLN 200 II

    It’s a Clusterline 200 II CW with 3 PVD Chambers (Pos3/4/5) and 1 Degass Chamber (Pos1). PM5 is configured with a hot Chuck and a Pyrometer. The transport was upgraded in 2025 with a new Brooks control system, which includes a new aligner.

     This upgrade consists of:

    • 1 piece of magnetically driven dual pan handling robot, BROOKS
    • Magnatran MAG 7.1 with an extension capability of up to 860mm, equipped with BROOKS control system (non-Berkeley), including CDM
    • 2 pieces of new load lock elevators
    • Adapter flange for AWC (Active Wafer Centering)

       Additionally, a cooler on the transport is included.

      Available: end of September 2026