TEPLA 300 PC_ TEPLA 1D
TEPLA 300 PC
Available: now
Wafer Size Range
Minimum: 150mm
Maximum: 150mm
Set Size: 150mm
Vacuum Process Equipment
-
-
Other Physical Vapor Deposition Equipment
AMAT Endura-Copper Chamber
no Chuck, no PSUs, No Evs
beside this complete
-
Other Physical Vapor Deposition Equipment
AMAT Endura-Copper Chamber
no ESC, no PSUs, No Evs, no MFS´s,
No whole lower assambly where the ESC is installed
beside this complete
Popular Manufacturers
Log in with your username/email address