Reliability Test Equipment

  1. Kokusai Furnace Vertron Revolution (Brand-New)

    Other Ovens

    Kokusai Furnace Vertron Revolution (Brand-New)

    Brand-New and absolute unused Kokusai large batch deposition equipment

    Useable for 

    • Thin film deposition

    • CVD/oxide film deposition

    • Platform V3J3N

    • Wafer size 200mm
    • Original planned (not used) process name: HQ-SiO
    • Product Wafer Load Size:100
    • Process Temperature Range: 600-750 C
    • Main Body ~ Utility Box (L): 2000 mm

    •  See also Kokusai Webpage

  4. ESPEC PG-2J Low Temp Chamber #722

    Other Chambers

    ESPEC PG-2J Low Temp Chamber #722

    Temp Chamber with N2 Purge. Temperatur Range: -70°C / +100°C

    Cryo Process, Chamber volume: 306 litre

    Chamber size: 600/850/600 

    adjustable N2 Purge 

    Controllertype: P-300

  8. DESPATCH PASSIVATION-DRY DESPATCH_LV2N

    Other Ovens

    DESPATCH PASSIVATION-DRY DESPATCH_LV2N

    DESPATCH PASSIVATION-DRY DESPATCH_LV2NDESPATCH PASSIVATION-DRY DESPATCH_LV2N

  9. DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5

    Other Ovens

    DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5

    DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5

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