Other Assembly / Hybrid
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Die Sorter (Pick & Place)
Transferring die from sawn wafer (mounted frame) to die plate or tape and reel.
Location is at Infineon Penang.
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Scrap 3x mini buffers (10011500,10011501,10011502)
These 3 mini buffers (10011500,10011501,10011502) will be scrap because
1: linked machines were already scrapped
2: function isn't complete
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Closing Date: Jun 30, 2026
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Closing Date: Jun 30, 2026
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Closing Date: Jun 30, 2026
IND IV-E (automatic wire bond inspection)
IND IV-E (automatic wire bond inspection)
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EAV_ACA AQN2D2_EAV003
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