ALL CATEGORIES

Manufacturer: ATAP-IHC, Model: CX-01

Manufacturing date: Jul 05

Condition: good, complete, no damages

Sales incl. reflectors and spare package

Dimensions 1,2x0,6x0,5m

Weight: 192 kg

Anschluss: 230V-L1-N-PE

Strom:16A

Sicherung: C16A

Nutzlast: 90kg

Burn In Oven System

30 mm^2 Detektorfläche

inkl. Steuerrechner

The XM is a manual screen and stencil printer
dedicated to small batch size production and
prototyping purposes. The sideways guided squeegee
traverse and the adjustable squeegee pressure
ensure a constant, high quality print. Simple
operation and short set-up times all belong to the
application oriented concept.
Stiff as well as flexible materials such as PCBs,
glass, ceramic or metal up to a thickness of 30 mm
can be printed. Due to these characteristics the
XM print system is the ideal application for small
batch series and for prototyping.

GT line scrap 5x ESEC 3200 WIRE BOND

Internal Equipment ID :E32-001, E32-002, E32-003, E32-004, E32-005

REFLOW OVEN  soldering station

MOLD_BESI FICO AMS-I90-204_MP77

• Technic special customized for Infineon? no
• Any damages/deficits known? no
• Manuals existing? yes
• Last time in production/function? 2022
• Any upgrades / extensions? no
• Any consumables at end of lifetime? not known
• Any refurbishments done? no
• Was there a significant system failure in the last three years? no
• Used: only for test
• Any contaminations known? Siliciumdioxid

SOT23 2upless project already implemented from Aug’22 onwards. The capacity of this line were removed as well. Below EQs can be scrapped.

Stainless steel workbench with ultrasonic bath for the removing of photoresisted silicon-wafers. The bench was built as custom-made product. The system is still in use, therefore there is the possibility for a sale on inspection.

Capable of processing up to 6" wafers, delivery of additional accessories is possible.

If there is a seriously buying interest, the technical specifications could be send.

HANDLER_ISMECA NX32W_T-I01

HANDLER_ISMECA NX32W_T-I05

Kardex Shuttle XP with  many Trays

eS32 is a top-of-the-line mask and wafer inspection equipment that is designed to meet the most stringent quality standards for semiconductor product manufacturing. This system provides comprehensive, high-resolution inspection of both masks and wafers with unparalleled accuracy. The unit uses a proprietary optical probe to scan masks and wafers to detect defects and irregularities with a resolution reaching down to 1 micron. This high-precision scanning allows for comprehensive inspection of the entire surface of both the mask and wafer. The machine also includes powerful image processing and analysis algorithms which automatically detect defects, categorize them, and track their locations. KLA eS32 also includes a suite of automated defect correction tools which can rapidly repair standard and complex defects. In addition to its exhaustive defect detection capabilities, this tool also allows for statistical process control (SPC) analysis to ensure production processes maintain consistent quality and accuracy over time. TENCOR ES 32 also includes a user-friendly interface that makes it easy to operate and manage the asset. This user interface is highly customizable, allowing users to quickly change model settings, view detailed inspection reports, and receive real-time notifications of detected defects. In summary, KLA ES 32 is a high-performance mask and wafer inspection equipment that offers superior detection accuracy, automated defect correction, comprehensive statistical process control (SPC) analysis, and an easy-to-use user interface. This system can be used to monitor production lines, resulting in improved manufacturing quality, increased yield, and cost savings.

Complete dip acid etching unit manufactured by Kufner, Germany. The system is still in use, therefore there is the possibility for a sale on inspection.

Capable of processing si-wafers after grinding (KOH). Delivery of additional accessories is possible.

If there is a seriously buying interest, the technical specifications could be send

Automtic dip-etch bench (2014)

Complete dip acid etching unit manufactured by KVA, Austria. The system is still in use, therefore there is the possibility for a sale on inspection.

Capable of processing semiconductor devices (Diode, Thyristor)

up to 58 mm, delivery of additional accessories is possible.

If there is a seriously buying interest, the technical specifications could be send

high speed X-Ray system 

Sort-05

Mechatronic Sorter for 200 and 300mm

With bernoulli Aligner for 8 and 12 inch and IOSS Camera.

And greenlight inspection.

With 4 Synfoniy 300mm Loadports, 2 on the front side and 2 on the backside.

In use until October 2020, when it was phased out from production. Since then, it's stored in a dry and heated environment. Besides minor marks and scratches caused by trolleys, it's in an excellent condition. It was maintained regularly by site maintenance, and went through yearly inspection by OEM, including calibration.

Standard machine, with special adapter plates used at Infineon. It's with software for series production, able to measure multiple modules in row. Saves date to local CSV file format and writing measurement data to Orbit system.,

Possibility to upgrade tactile measuring function!

Nissan Forklift acquired in year 1995 (29 years) by IFMY LOG. 

Currently this forklift undergoing yearly maintenance and still in working condition. It is battery operated. 

IFMY LOG decided to let go this forklift as it is, please refer to the pictures attached. 

foiling system

Delaminator

DIMA DR 060 Dispenser

Simple, Intelligent, Powerful

Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production.

Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time.

Benefits

• High throughput and superior detection with minimal number of false calls
• Especially designed for inspection of the finest lines down to 10μm
• Quick set-up even for the most complicated jobs for higher productivity
• Automation ready
• Very high uptime

• SIP Technology^TM

  Push-to-Scan^®:

  • A ‘no set-up’ process
  • Top AOI results with minimal effort or training
  • The easiest, user-friendly interface (GUI)
  • Full ‘Step and Repeat’ functions

  Visual Intelligence:

  Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want.

  Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects.

  Visual Intelligence:

  • Full panel understanding, context-based detection engine
  • Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed

     

A high quantity of SRC 320 parts.

• SRC320 Vehicles (~50 pc.)
• SRC320 SCPS-ZCU
• SRC320 ICC
• SRC320 PDU
• SRC320 Rail parts
• Foup Handler Stocker

Please get in touch with the Equipment Trade Category Manager to get more information or price lists.

KLA-Tencor - Tool in production

- Measures Film Thickness, Refractive Index (RI) and Extinction Coefficient of Single and Multi-Layer Thin Film Stacks Simultaneously without Referencing

Complete spray acid etching unit manufactured by Ramgraber Company (Germany). The system is still in use, therefore there is the possibility for a sale on inspection.

Capable of processing up to 6" wafers, delivery of additional accessories is possible.

If there is a seriously buying interest, the technical specifications could be send.

Used Configuration:

Tank 1: EKC

Tank 2: P1331

Tank 3 and 4: DMF

Tank 5: IPA

Known errors:

Filter from tank 4 is leaking

Heater 1 from tank 4 is broken

Heater 3 from tank 4 is broken

RMU TRANSFORMER 66

non copper tool; double path tool delay stage; 6 inch chuck

Not functioning

withdraw parts from scrapped machine, currently worn out

Die Sorter Machine Release to instead inker machine, scrap 4x  ink-02/07/08/09.

Single Spin Rinser Dryer as tabletop unit (s. attached picture). The system is still in use, therefore there is the possibility for a sale on inspection.

Capable of processing up to 6" wafers, delivery of additional accessories possible (p.e. wafercarriers and adapters)

WB_SHINKAWA ACB1000_ACB46

WB_SHINKAWA ACB1000SUPER_ACB05

SW116:UTC2000:Gold wire bonder

Detailed Configuration/Specification of the tool: Filter without pump, Polypropylen, max. 25m³/h

Manual existing

Originally packed, never used

transfer from OP1 and finally no need this EQ

Speedline Camalot 8000-1 Solder Dispenser

POST MOLD INSPECTION_SUKI TECH_PMI002

RMU TAMCO