Item ID: 244540 1 Offered at Best Price MP200 double path tool non copper tool; double path tool delay stage; 6 inch chuck ... other images Unit Price Unstated Number of Units 1 Manufacturer Rudolph Technologies Model MP200 Description Contactless metal thickness measurement Wafer Size Range Minimum 150 mm Maximum 200 mm Multi-Layer Film Capacity YES Micro Spot Optics YES Wafer Mapping YES Controller Type PC Controller Type External Cooling Water Cooled Cooling Water Required Minimum Flow: 0.79 GPM (3.00 l/m) Minimum Temperature: 12 ºC (54 ºF, 285.00 ºK) Maximum Temperature: 20 ºC (68 ºF, 293 ºK) Operating Air Pressure 14.00 PSI (96,534.20 N/sq m) Vacuum Required 0.98 in Hg (24.89 mm Hg) Condition Good Year of Manufacture 2006 Serial Number(s)1-00-MPC-1505-AK-09 Shipping & Handling:All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment. Payment:100% downpayment Make OFFERSend QUESTIONS
non copper tool; double path tool delay stage; 6 inch chuck
All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment.
ALL CATEGORIES Metrology Eq Film Thickness
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