Item ID: 237233 1 Offered at Best Price CD200 bonding chamber ... other images Unit Price Unstated Number of Units 1 Manufacturer Suss MicroTec Model CB200 Description High Pressure Bonding Chamber Wafer Size Range Maximum 200 mm Condition Like New Year of Manufacture 2012 Serial Number(s)CB200-0012 Shipping & Handling:All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment. Payment:100% downpayment Make OFFERSend QUESTIONS
All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment.