Contact Us  |  Terms  |  Imprint  |  Privacy     
 Fast  FIND      full search   tips    
  Specials  |  Listings:   Offered / Wanted / Both     |  Spare Parts Home     
Serving  Our Guest Log in    Register to speed trading
ALL CATEGORIES   Semi / Hybrid Assy   View   Search-by-Specs   
View All Offers Under

Die Bonders


» Switch Major Category
Click an item's ID# below for its full specifications , or:

Group Offers into sub-categories under Die BondersGroup Offers into sub-categories under Die Bonders

List all 6 product types under Die BondersList all 6 product types under Die Bonders


  • To sort on a column, click the column head; click it again to reverse the sort.
  • Click the links under the Product Type column head to see other like items of that type.
 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
213293

ASM  

Siplace CA4 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

 

 

1  
211696

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211698

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211699

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211697

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
207382
TOSOK DBD 3280/3310 Die Bond 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD 3280/3310 Die Bond:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110005747TOSOK DBD3280 Die Bond.201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747CIQ inspect fee in Malacca201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747Conversion key1(X-Y wafer holder unit)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key4(loader-unloader)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37510006006TOSOK DBD3310 Die Bond .8500008995;Mal transfer DS line;inv# 6JM/00057/65108 1F ASSY295 T25
9F37510006006Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606108 1F ASSY295 T25
9F37510005536TOSOK DBD3310 Die Bond .PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536CIQ import inspection charge for TOSOK DBD3310 DiePO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536freight: TOSOK DBD3310 Die Bond 161 T26.PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F57010006036TOSOK DBD3310 DIE BOND8500007255;Mal transfer DS line;inv# 6JM/00884108 2F ASSY182-T86

 

4 ¥ 8,799,723.91
192458

tosok  

 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3200 Die Bond 161 T38 Training:

Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38

1  
204630
TOSOK DBD3310 3280 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 3280 DIE BOND:

TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748

4 ¥ 6,569,652.00
210405
TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND:
100041150TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100041160TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100041170TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100041180TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100055240TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100055250TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100055260TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100055270TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100053300TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100053310TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100053320TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100053323Freight fee200810444;transfer in from IFMY
100053330TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100060050TOSOK DBD3310 DIE BOND8500008995;Mal transfer DS line;inv# 6JM/00057/65
100060051Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606
100074050TOSOK DIE BOND DBD42008500041396;transfer from IFMY;INV# 6JM/00233

 

14   F*
199781

tosok  

3310 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi

4  


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.