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Item ID |
Short Description |
Product Type / Details |
#
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Price |
Notes |
Make |
Model |
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247751
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Driverless transport system |
in ALL CATEGORIES
Driverless transport system:Manufacturer: ATAP-IHC, Model: CX-01 Manufacturing date: Jul 05 Condition: good, complete, no damages Sales incl. reflectors and spare package Dimensions 1,2x0,6x0,5m Weight: 192 kg Anschluss: 230V-L1-N-PE Strom:16A Sicherung: C16A Nutzlast: 90kg
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2
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N* |
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236443
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DS-TEST 3sets X-Ray Machine scrap |
in ALL CATEGORIES
DS-TEST 3sets X-Ray Machine scrap:Based on VRFC2212 scraped plan, these machines already shortage for key parts and cannot support for normal production
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3
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240604
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Axcelis/Eaton |
NV8250P |
in Ion Implantation Equipment
EATON NV8250P :Retrofits/Upgrade: - Z-Blok Gasbox (only 1 Gas string available) - Vaporizer - Metal Reduction Kit - AMU Xantrex PS - Parallel Lens NV8250P - oneDoseCup - reduced surface Aligner - Cryo Compressor 9600V - timeline for sale: beginning of 2024 - without pre-vaccuum pumps
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1
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242526
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Edax |
TEC. 12T/20T/20ST, 136-5 |
in ALL CATEGORIES
EDAX-EDS PV9761 / 70 :30 mm^2 Detektorfläche inkl. Steuerrechner
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1
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248130
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EKRA |
Serio4000 |
in Semiconductor / Hybrid Assembly Equipment
EKRA Serio 4000:- Equipment for automated stencil printing
- Designed for automated input and output
- Printing format min 80x50mm, max 510x510
- Not suitable for manual loading and unloading
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1
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N* |
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236879
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ESEC 3200 WIRE BOND |
in ALL CATEGORIES
ESEC 3200 WIRE BOND:GT line scrap 5x ESEC 3200 WIRE BOND Internal Equipment ID :E32-001, E32-002, E32-003, E32-004, E32-005
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5
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236878
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ESEC3100 WIRE BONDER |
in ALL CATEGORIES
ESEC3100 WIRE BONDER:GT line scrap,9 sets of ESEC3100
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9
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210404
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Suss MicroTec |
Falcon Polyimid Developer |
in Photoresist Develop Track Systems
Fairchild Developer Ent3C:Developer with 2 chambers for spray developing.
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1
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244623
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FICO AMS-11-MR1 FC-17 scrap |
in ALL CATEGORIES
FICO AMS-11-MR1 FC-17 scrap: Cost Centre | Asset | SNo. | Asset name | 9F554 | 10005738 | 0 | FICO AMS-11-MR MOLDING | 9F554 | 10005739 | 1 | FICO MOLD DIE |
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1
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221096
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BESI Holland |
MK-1 |
in ALL CATEGORIES
FICO, Auto Mold System (AMS 24) 2p, MK-1:machine is Functioning
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1
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$ 54,000.00 |
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244703
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Nitto Denko |
PFM5 |
in Production Equipment
FOLIERANLAGE NITTO DR - 8500 / PFM5:foiling system
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1
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221743
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Mitutoyo |
QVT1-X606P1L-D |
in Optical Test & Measurement Equipment
For Sale! Mitutoyo CNC Vision Measuring Machine :In use until October 2020, when it was phased out from production. Since then, it's stored in a dry and heated environment. Besides minor marks and scratches caused by trolleys, it's in an excellent condition. It was maintained regularly by site maintenance, and went through yearly inspection by OEM, including calibration. Standard machine, with special adapter plates used at Infineon. It's with software for series production, able to measure multiple modules in row. Saves date to local CSV file format and writing measurement data to Orbit system., Possibility to upgrade tactile measuring function!
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1
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€ 55,000.00 |
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240586
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ASM |
Advance 400 |
in Diffusion Furnaces
Furnance:Furnance will be sold without Reactor 2 Parts for sale: WIP Reactor 1 Poly Cassetteheater Robot Housing Power Cabinet
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1
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231620
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Bruce (BTI) |
DSVA 24 |
in Diffusion Furnaces
Furnance BDF-41 Ofen 28B:Diffusion Furnance for atmospheric oxid processes. Tool is productive in use until 27.06.2022
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1
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244705
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Disco |
DISCO9 |
in Production Equipment
Grinder DFG850 Disco 9:Fully automatic grinder
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1
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238965
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Accretech |
PG200RM |
in Wafer Fabrication Equipment
Grinder/Polisher:2 of 4 Chucks are broken (vaacuum channels) PC is repaired poorly Spindle Z1 broken, Z2 is ok Chuckcleaning is only partly functional Robots 1 and 2 OK Pump of the Vaccuum unit is broken USV is broken Tool was only used for polishing! Tool will be sold with many spareparts
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1
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244953
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THA Germany |
THA |
in ALL CATEGORIES
HANDLER_ELECTRICAL THA_ET-03:HANDLER_ELECTRICAL THA_ET-03
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1
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244894
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Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I01:HANDLER_ISMECA NX32W_T-I01
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1
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244946
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Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I04:HANDLER_ISMECA NX32W_T-I04
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1
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244947
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Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I05:HANDLER_ISMECA NX32W_T-I05
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1
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244888
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Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I06:HANDLER_ISMECA NX32W_T-I06
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1
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244893
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Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I07:HANDLER_ISMECA NX32W_T-I07
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1
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244890
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Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I12:HANDLER_ISMECA NX32W_T-I12 |
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1
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244952
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THA Germany |
THA |
in ALL CATEGORIES
HANDLER_THA ELECTRICAL_ET-10:HANDLER_THA ELECTRICAL_ET-10
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1
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244886
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THA Germany |
THA Handler |
in ALL CATEGORIES
HANDLER_THA ELECTRICAL_ET-11:HANDLER_THA ELECTRICAL_ET-11
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1
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244849
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Siemens |
8BK80 |
in ALL CATEGORIES
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10
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238643
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PVA TePla |
TWIN |
in Wafer Fabrication Equipment
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1
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242276
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Inliner Machine scrap |
in ALL CATEGORIES
Inliner Machine scrap:SOT23 2upless project already implemented from Aug’22 onwards. The capacity of this line were removed as well. Below EQs can be scrapped. Cost Centre | Asset | SNo. | Asset name | Asset name (PO information) | Serial no. | Cap.date | Age of EQ | Curr.acq. value (PMB) | Curr.net book.value. (PMB) | 9F373 | 10006606 | 0 | Inliner Machine | 8500018761;transfer from IFMY; 6JM/MAL11-073696 | IL-17 | 2011/12/27 | 11.6 | 3,241,431.51 | 0.00 | 9F373 | 10006606 | 1 | freight: Inliner Machine | 8500018761;transfer from IFMY; 6JM/MAL11-073696 | IL-17 | 2011/12/27 | 11.6 | 0.01 | 0.00 |
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1
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244317
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Innolas GmbH |
C3000DPS |
in Production Equipment
Innolas Wafermarker:Wafermarker C3000DPS Marking for 300mm Wafers
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1
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€ 30,000.00 |
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248937
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Kardex |
Shuttle XP |
in ALL CATEGORIES
Kardex Shuttle Xp:2 pieces Kardex Shuttle XP
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1
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N* |
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248938
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Kardex |
Shuttle XP |
in ALL CATEGORIES
Kardex Shuttle Xp:Kardex Shuttle XP with many Trays
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1
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N* |
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221102
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BESI |
X-Eye SF160 SL |
in ALL CATEGORIES
KETECA, X-Eye SF160 SL, A-SFS16FDAL170N2D735, XRAY:Function , needed motor vacuum to up this machine |
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1
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$ 22,800.00 |
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242857
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KLA |
eS32 |
in Test & Measurement Equipment
KLA eS32 E-beam Wafer Inspection 200mm:eS32 is a top-of-the-line mask and wafer inspection equipment that is designed to meet the most stringent quality standards for semiconductor product manufacturing. This system provides comprehensive, high-resolution inspection of both masks and wafers with unparalleled accuracy. The unit uses a proprietary optical probe to scan masks and wafers to detect defects and irregularities with a resolution reaching down to 1 micron. This high-precision scanning allows for comprehensive inspection of the entire surface of both the mask and wafer. The machine also includes powerful image processing and analysis algorithms which automatically detect defects, categorize them, and track their locations. KLA eS32 also includes a suite of automated defect correction tools which can rapidly repair standard and complex defects. In addition to its exhaustive defect detection capabilities, this tool also allows for statistical process control (SPC) analysis to ensure production processes maintain consistent quality and accuracy over time. TENCOR ES 32 also includes a user-friendly interface that makes it easy to operate and manage the asset. This user interface is highly customizable, allowing users to quickly change model settings, view detailed inspection reports, and receive real-time notifications of detected defects. In summary, KLA ES 32 is a high-performance mask and wafer inspection equipment that offers superior detection accuracy, automated defect correction, comprehensive statistical process control (SPC) analysis, and an easy-to-use user interface. This system can be used to monitor production lines, resulting in improved manufacturing quality, increased yield, and cost savings.
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1
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239542
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P & P TECH SDN BHD |
Lab Handler |
in Automatic Test Equipment
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1
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241409
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Thermo Scientific |
FT 6060 |
in Laboratory Equipment
Labor-Frischluft-Wärmeschrank Typ FT6060 (2020):Laboratory ovens, fresh-air with explosion protected chambers, FT 6060 (2020) Extras: - airflow breaker - exhaust air fan - fresh air filter Heat treatment processes in which combustible solvents are released can produce potentially explosive mixtures when they come into contact with air. FT 6060 ovens prevent the build up of hazardous conditions during heat treatment by passing air through the chamber. Designed for use in electrical engineering, chemical, pharmaceutical and paint industries, for the heat treatment of finished or semi finished products. - Can be used with unrestricted quantities of solvent, the FT 6060 offers a high degree of safety for routine operations
- Designed for use where combustible solvents of temperature classes T1, T2, T3 and T4 as well as explosion classes IIA and IIB are used or released in unknown quantities
- Straightforward arrangement of the control elements in the switching unit enables safe and easy operation
- Continuous current of fresh air flows through the cabinet so the released solvent vapours are carried away immediately
- Microprocessor temperature controller, independent upper temperature limit protection, visual error signal and adjustable door
The system is unused and in original packing. If there is a seriously buying interest, an extended selection of technical specifications (only german language) could be send.
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1
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239809
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LAM Research Corp. |
2300 |
in Plasma Processing Equipment
LAM 2300 Mainframe:›1 x AC Rack ›1 x Atmospheric transfer module ›1 x Vacuum transfer module ›3 x Loadports (Ergo 200mm)
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1
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244197
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Hanmi Semiconductor |
Laser Cleaning 1.0 |
in ALL CATEGORIES
LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001:LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001
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1
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244796
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EO Technics |
BSM363G |
in ALL CATEGORIES
LASER MARK_EO TECHNICS BSM363_LM04:LASER MARK_EO TECHNICS BSM363_LM04
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1
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242433
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Keteca |
Keteca PP200 |
in ALL CATEGORIES
LASER MARK_P&P KETECA PP200_LM08:LASER MARK_P&P KETECA PP200_LM07
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1
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238364
|
Trumpf |
HL 101 P |
in Production Equipment
Laser-Silicon-Cutting System with CNC-cutting table and cabin:Complete Silicon cutting system with laser source, CNC-cutting-table and safety cabine. The system was in use until February 2023 and is currently placed into stock.
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1
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238310
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Trumpf |
HL101P |
in Production Equipment
Laser-Silicon-Cutting System with CNC-Table and Cabin:Complete Silicon cutting system with Laser source, cutting table and safety cabine. The system is still in use until March 2023.
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1
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238362
|
Trumpf |
HL 101 P |
in Production Equipment
Laser-Silicon-Cutting System with cutting table and cabin:Complete Silicon cutting system with Laser source, cutting table and safety cabine. The system is still in use until March 2023. Therefore there is the possibility for a sale on inspection.
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1
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237802
|
Trumpf |
HL 101 P |
in Production Equipment
Laser-Silicon-Cutting System with Cuttingtable and Cabin:Complete Silicon cutting system with Laser source, cutting table and safety cabine. The system was in use until March 2023 and is currently placed into stock.
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1
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205912
|
Matrix Corp |
Matrix X3 |
in Metrology Equipment
Matrix X3 X-Ray System:high speed X-Ray system
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1
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224568
|
Mechatronic 300mm Sorter |
in Wafer Fabrication Equipment
Mechatronic 300mm Sorter:Sort-05 Mechatronic Sorter for 200 and 300mm With bernoulli Aligner for 8 and 12 inch and IOSS Camera. And greenlight inspection. With 4 Synfoniy 300mm Loadports, 2 on the front side and 2 on the backside.
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1
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242031
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Mechatronics Systemt |
TWS 150/200 |
in ALL CATEGORIES
Mechatronics TWS 150/200:no damages, but EOL tool complete last time in production: 27.07.2023 CM Sorter 8"TWS150/200 technical data: Maße | | Gewicht | | Anschluss | | Strom | | Sicherung | |
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1
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245141
|
Hitachi |
REM-S 9380-2 |
in Wafer Manufacturing Metrology Equipment
METV34-01 (REM-S 9380-2):Microscope for Critical Dimension
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1
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244797
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FICO,NETHERLANDS. |
FICO AMSi-204 |
in ALL CATEGORIES
MOLD_BESI FICO AMS-I90-204_MP77:MOLD_BESI FICO AMS-I90-204_MP77
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1
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238960
|
Rudolph Technologies |
MPC 200XCu |
in Film Thickness Testers
MP200:Rudolph MetaPulse 200 non copper / double delay stage with 5" Chuck. 2 Loadports for 6/8 inch Laser is broken!
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1
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244540
|
Rudolph Technologies |
MP200 |
in Film Thickness Testers
MP200 double path tool :non copper tool; double path tool delay stage; 6 inch chuck
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1
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238644
|
Datacon |
2200 apm |
in Wafer Fabrication Equipment
Multi-Chip Die Bonder:Operations and Maintenance Manuals available.
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1
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207180
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Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
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1
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241914
|
Nikon |
MM-200 |
in Laboratory Equipment
Nikon Mikroskop MM-200 / Kamerasteuergerät DS-L2 / Kamerakopf DS-xx:Nikon Mikroskop MM-200 / Kamerasteuergerät DS-L2 / Kamerakopf DS-xx (2010) Complete Nikon microscope-system. The system is still in use, therefor there is the possibility for a sale on inspection. You can see the components on the pictures attached, there are also user manuals available (as paper books).
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1
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247203
|
Nissan Motor |
UM02L20U |
in ALL CATEGORIES
Nissan Forklift (Battery) for Sale:Nissan Forklift acquired in year 1995 (29 years) by IFMY LOG. Currently this forklift undergoing yearly maintenance and still in working condition. It is battery operated. IFMY LOG decided to let go this forklift as it is, please refer to the pictures attached.
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1
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€ 0.00 |
N* |
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244701
|
Nitto Denko |
PFP3 |
in Production Equipment
NITTO HR - 8500 / PFP3:Delaminator
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1
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246546
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Nitto Denko |
DR8500-II |
in Production Equipment
Nitto Taper DR8500-II:Nitto Taper DR8500-II
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1
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240450
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NITTO Wafer Laminator 2018 |
in Wafer Fabrication Equipment
NITTO Wafer Laminator 2018:NITTO Wafer Laminator 2018 Nel System Type: DR8500iii
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1
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223074
|
Novellus Systems |
Concept Two SPEED |
in Chemical Vapor Deposition Equipment
Novellus Concept Two SPEED (shrink):1 Mainframe w/ 3 Chambers Damages/Deficites: Chamber Turbo Pumps & HF/LF Generators EOL: Turbo Pumps no significant failures between last 3 years
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1
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243581
|
Olympus |
Olympus BH-2II |
in Laboratory Equipment
OM Olympus BH-2II:completeness: partial
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1
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243683
|
Olympus |
BH2 |
in Laboratory Equipment
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1
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243582
|
Zeiss |
Zeiss 475052 |
in Laboratory Equipment
OM Zeiss 475052:Completeness: Partial
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1
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192280
|
Over Head Transport System (OHT) SRC320 |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320:
A high quantity of SRC 320 parts.
- SRC320 Vehicles (~50 pc.)
- SRC320 SCPS-ZCU
- SRC320 ICC
- SRC320 PDU
- SRC320 Rail parts
- Foup Handler Stocker
Please get in touch with the Equipment Trade Category Manager to get more information or price lists.
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1
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238827
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
P5000:From Chamber B following Parts are missing: - RF Generator
- RF Match
- Baratron
- Turbo/Controller
Chamber B,C,D are universal CVD etch chambers.
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1
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242656
|
Applied Materials |
P5000 |
in Production Tools
P5000:CHAMBER A | Universal CVD | Teos | CHAMBER B | Universal CVD | Teos | CHAMBER C | Mark2 | Etch | CHAMBER D | Mark2 | Etch |
The Tool is sold with 4 chambers and was productiv until August 2023
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1
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242682
|
Applied Materials |
P5000 |
in Production Tools
P5000:CHAMBER A | x | | Universal CVD | Teos | CHAMBER B | x | | Universal CVD | Teos | CHAMBER D | x | | Universal CVD | Teos |
Tool is sold with three chambers and was used in cleanroom until August 2023
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1
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240853
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
P5000:4x Standard SNIT Chambers
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1
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242852
|
KVA GmbH |
automatisierte Si-Pellets Ätzbank |
in Wafer Cleaners
Pellet Edge Batch Etch Tool:Automtic dip-etch bench (2014) Complete dip acid etching unit manufactured by KVA, Austria. The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing semiconductor devices (Diode, Thyristor) up to 58 mm, delivery of additional accessories is possible. If there is a seriously buying interest, the technical specifications could be send
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1
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246288
|
Suki Technology Sdn. |
|
in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI001:POST MOLD INSPECTION_SUKI TECH_PMI001
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1
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246289
|
Suki Technology Sdn. |
|
in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI002:POST MOLD INSPECTION_SUKI TECH_PMI002
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1
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246290
|
Suki Technology Sdn. |
|
in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI003:POST MOLD INSPECTION_SUKI TECH_PMI003
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1
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239644
|
Ramgraber |
SST |
in Wafer Cleaners
Ramgraber SST:Used Configuration: Tank 1: EKC Tank 2: P1331 Tank 3 and 4: DMF Tank 5: IPA Known errors: Filter from tank 4 is leaking Heater 1 from tank 4 is broken Heater 3 from tank 4 is broken
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1
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F* |
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244510
|
ESSEM TEC |
Convection Reflow Oven |
in Ovens
REFLOW OVEN soldering station_essemtec RO06:REFLOW OVEN soldering station
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1
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€ 15,530.00 |
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233939
|
BTU |
PY98N2 |
in Ovens
REFLOW OVEN_PY98N2:REFLOW OVEN_PY98N2
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1
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F* |
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244853
|
TAMCO |
GR1 |
in ALL CATEGORIES
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1
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239567
|
TAMCO |
GR1 |
in ALL CATEGORIES
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1
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239568
|
RMU |
in ALL CATEGORIES
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1
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245221
|
Tencor |
RS75-01 |
in Wafer Manufacturing Metrology Equipment
RS75-01:wafer sheet resistance measurement system, Tool in production
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1
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241426
|
Rudolph Research |
Scale |
in Test & Measurement Equipment
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1
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235316
|
Scarp VOSTCH Salt Spray Chamber VSC450 |
in ALL CATEGORIES
Scarp VOSTCH Salt Spray Chamber VSC450:Not functioning
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1
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216407
|
Schmid |
Combi Line |
in ALL CATEGORIES
|
1
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€ 50,000.00 |
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239375
|
Scrap 1x ??? NX-7001 |
in ALL CATEGORIES
Scrap 1x ??? NX-7001:Asset | SNo. | Asset name | 10007609 | 0 | ??? NX-7001 |
withdraw parts from scrapped machine, currently worn out
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1
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235315
|
Scrap 3x mini buffers (10011500,10011501,10011502) |
in Semiconductor / Hybrid Assembly Equipment
Scrap 3x mini buffers (10011500,10011501,10011502):These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped 2: function isn't complete
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3
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F* |
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245537
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scrap 4x inker machine |
in ALL CATEGORIES
scrap 4x inker machine:Die Sorter Machine Release to instead inker machine, scrap 4x ink-02/07/08/09. Asset | SNo. | Asset name | 10006748 | 0 | Wafer Inker Machine | 10006748 | 1 | freight: Wafer Inker Machine | 10008003 | 0 | Wafer Inker Machine | 10008003 | 1 | ????? | 10008881 | 0 | Inker/2001X | 10008881 | 1 | freight | 10008881 | 2 | ????? | 10008882 | 0 | Inker/2001CX | 10008882 | 1 | freight |
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4
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243278
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EKRA |
XM |
in Semiconductor / Hybrid Assembly Equipment
Screen & Stencil Printer Ekra (Asys Group):The XM is a manual screen and stencil printer dedicated to small batch size production and prototyping purposes. The sideways guided squeegee traverse and the adjustable squeegee pressure ensure a constant, high quality print. Simple operation and short set-up times all belong to the application oriented concept. Stiff as well as flexible materials such as PCBs, glass, ceramic or metal up to a thickness of 30 mm can be printed. Due to these characteristics the XM print system is the ideal application for small batch series and for prototyping.
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1
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218857
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Rapiscan Systems |
620XR-W |
in Semiconductor Manufacturing Facilities Equipment
Security X-ray scanning machine:Rapiscan® Systems Hand luggage X-ray solutions for the most difficult baggage and parcel inspection.
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1
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248147
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Semi-Tool |
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in Production Equipment
Semitool Raider:- Tool is not fully functional and not in the original condition - Tool can be used as donor tool only - No pictures available but tool inspection is possible
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1
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N* |
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240589
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Semitool |
see attached type lable |
in Wafer Cleaners
Semitool Spin Rinser Dryer (2010):Single Spin Rinser Dryer as tabletop unit (s. attached picture). The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing up to 6" wafers, delivery of additional accessories possible (p.e. wafercarriers and adapters)
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1
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239810
|
Siebec GmbH |
P50-52527 |
in ALL CATEGORIES
Siebec P50-52527 :Detailed Configuration/Specification of the tool: Filter without pump, Polypropylen, max. 25m³/h Manual existing Originally packed, never used
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1
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246568
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Ramgraber |
see attached type lable |
in Wet Processing Equipment
Single-Wafer Spin Etch machine (2008):Complete single-wafer spin etching unit manufactured by Ramgraber Company (Germany). The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing up to 6" wafers, delivery of additional accessories is possible.
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1
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242030
|
SPA wafer inspection scrap |
in ALL CATEGORIES
SPA wafer inspection scrap:transfer from OP1 and finally no need this EQ Cost Centre | Asset | SNo. | Asset name | Asset name (PO information) | Serial no. | Cap.date | Today | Age of EQ | Curr.acq. value (PMB) | Curr.net book.value. (PMB) | Asset Location | 3041-9S330 | 304110601355 | 0 | SPA wafer inspection | 8500131291;23560646;IC FA transfer from 5903 | 2014-01 | 2022/6/29 | 2023-07-05 | 10.0 | 2,428,702.44 | 0.00 | EASY LINE |
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1
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248949
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SPEA C320MX Tester &Needle card Scrap |
in ALL CATEGORIES
SPEA C320MX Tester &Needle card Scrap : Asset | SNo. | Asset name | 304008003280 | 0 | SPEA C320MX Tester | 304008003239 | 0 | SPEA C320MX Tester | 304008003293 | 2 | Modul CPU 66MHz/32MB | 304008003293 | 3 | PC PCI Karte PCINT01 | 304008003293 | 1 | Performance boards;Load board;PO5630 item10,11 | 304008003293 | 0 | SPEA C320MX Tester | 304008003149 | 0 | Needle card M2,14.25pitch(4 pcs) | 304008003150 | 0 | Needle card M3,9.5pitch(2 pcs) |
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3
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N* |
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211901
|
Speedline Tech |
8000-1 |
in ALL CATEGORIES
Speedline Camalot 8000-1 Solder Dispenser:Speedline Camalot 8000-1 Solder Dispenser
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1
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241408
|
Ramgraber |
Inline-Sprühätzanlage |
in Wafer Cleaners
Spray acid etching system (2008):Complete spray acid etching unit manufactured by Ramgraber Company (Germany). The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing up to 6" wafers, delivery of additional accessories is possible. If there is a seriously buying interest, the technical specifications could be send.
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1
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€ 30,000.00 |
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218898
|
Unaxis |
CLC200 |
in Single Wafer Sputtering Tools
Sputtertool Clusterline Unaxis:CL-MET-04 Sputtertool with 6 chambers
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1
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F* |
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244401
|
MBL |
RAM 100 |
in ALL CATEGORIES
TAPER_MBL RAM-100_PST001:TAPER_MBL RAM-100_PST001
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1
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244631
|
INFINEON TECHNOLOGIES AG |
THA |
in ALL CATEGORIES
TAPER_THA_ETAP006:TAPER_THA_ETAP006
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1
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236302
|
Teradyne |
Catalyst Mixed Signal |
in Device Testers
Teradyne Catalyst:TESTER ID : CAT-004 Model : CATALYST MIXED SIGNAL Manufacturer : Teradyne Serial No. : 0027H256 Date Released : 15/09/00 COMPUTER HW/SW: Tester Computer : Suns ULTRA60 / 256 MB RAM User Computer : Suns ULTRA5 / 256 MB RAM HD : 8.5 GB Software : Solaris –OS rev. 5.5.1 IMAGE Rev. : 7.0 D8 Tester DIG: Data rate : 200 MHZ DP CH : 256 CH Tester DC: DC SRC Matrix : 4 CH DC DUT SRC : 8 CH AAPU PIN : 48 CH STORED DATA BITS : 48 CH System PPMU : 1 CH TESTER AC: PLFS/PLFD : 4CH VHF AWG400 : 1CH VHF DIG : 2CH PAC Card Cage : 3 VREG : 2 CH DOCKING/MANIPULATOR: Docking : SNR DOCKING Manipulator : UNIVERSAL Manipulator Input Power: Power Supply : 380 VAC, / 48 Amp 50/60Hz, 3 phase Power Consumption Rate : 31.6 KVA (Max)
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1
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241153
|
TESCAN |
TS5136XM |
in Laboratory Equipment
TESCAN TS5136XM Scanning Electron Microscope c/w OXFORD EDS:TESCAN TS5136XM Scanning Electron Microscope c/w OXFORD INCA ENERGY 200 Energy Dispersive X-Ray
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1
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246053
|
TEAM AUTOMATION SYST |
MC300B |
in ALL CATEGORIES
Test Equipment_MC300B:Test Equipment_MC300B
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1
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200892
|
Multitest |
MT2168 |
in ALL CATEGORIES
Test Tool ABC development project: Test Tool from multitest was rarely used for development project ABC
- Excellent Condition (Basically new) - Complete (no missing parts) - No Damages
LOCATION: Tijuana Mexico
Description: - Fully testing COOLiR2DIE at high current and voltage presents challenges for a test system and handler > Test team chose the LEMSYS test solution > Tester capability: 2000A/2000V for static and 2000A/1500V for dynamic testing - The handler choice was limited due to the package size and exposed die - Multitest with vertically docked pick & place handlers > A custom manipulator from ESMO was required to provide a working interface on a “headless” LEMSYS tester
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1
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$ 98,000.00 |
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Displaying 101-200 of 243 Page 1 2 3 |