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Semiconductor / Hybrid Assembly Equipment


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Group Offers into sub-categories under Semiconductor / Hybrid Assembly EquipmentGroup Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment

List all 51 product types under Semiconductor / Hybrid Assembly EquipmentList all 51 product types under Semiconductor / Hybrid Assembly Equipment
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 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
255419

ESEC  

2007 ESEC 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

2007 ESEC Die Bonder:
Serial NumberModelManufacture
2059402007ESEC
 1  
255584

ESEC  

2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

2007 ESEC Die Bonder:
Serial NumberModelManufacturer
2084242007ESEC
 1  
255585

ESEC  

2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

2007 ESEC Die Bonder:
Serial NumberModelManufacturer
209377
2007ESEC
 1  
255586

ESEC  

2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

2007 ESEC Die Bonder:
Serial NumberModel

Manufacturer

2048822007ESEC
 1  
255587

ESEC  

2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

 1  
255588

ESEC  

2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

 1  
256626

ESEC  

2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

2007 ESEC Die Bonder:

2007 ESEC Die Bonder

 1  
255416

fujiwa  

250-70 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

250-70 FUJIWA / Mold Press:
Serial NumberModelManufacturer
2534250-70FUJIWA
 1  
255589

Orthodyne  

360C 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

360C ORTHODYNE Wire Bonder:

360C ORTHODYNE Wire Bonder

 1  
256653

Orthodyne  

360C 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

360C ORTHODYNE WIRE BONDER:

360C ORTHODYNE WIRE BONDER

 1  
256655

hull  

4216LP-D 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

4216LP-D HULL_FINMAC DEFLASH:

4216LP-D HULL_FINMAC DEFLASH

 1  
256654

hull  

BT4216LP 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

BT4216LP HULL_FINMAC DEFLASH:

BT4216LP HULL_FINMAC DEFLASH

 1  
256629

Soft View Technology  

SVDS 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Die Sorter (Pick & Place):

Transferring die from sawn wafer (mounted frame) to die plate or tape and reel.

Location is at Infineon Penang.

 1  
257578

Disco  

DISCO_DFD6340 

List all items of this typeDicing Saws

in Dicing Tools

DISCO WAFER SAW DISCO_DFD6340:

DISCO WAFER SAW DISCO_DFD6340

 1  
248130

EKRA  

Serio4000 

List all items of this typeScreen Printers

in Semiconductor / Hybrid Assembly Equipment

EKRA Serio 4000:
  • Equipment for automated stencil printing 
  • Designed for automated input and output
  • Printing format min 80x50mm, max 510x510
  • Not suitable for manual loading and unloading
 1  
255417

ESEC  

ESEC 2007 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ESEC 2007 DIE BONDER:
Serial NumberModelManufacturer
2059402007ESEC
 1  
257527

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257528

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS :

ESEC DIE ATTACH ESEC_2100HS 

 1  
257568

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257569

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257570

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257571

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257572

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257573

ESEC  

ESEC_2100HS 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100HS:

ESEC DIE ATTACH ESEC_2100HS

 1  
257526

ESEC  

ESEC_2100XP 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

ESEC DIE ATTACH ESEC_2100XP:

ESEC DIE ATTACH ESEC_2100XP

 1  
256642

FUSEI  

FMTM250-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM250-7HS-32P FUSEI MOLD PRESS:

FMTM250-7HS-32P FUSEI MOLD PRESS

 1  
256643

FUSEI  

FMTM250-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM250-7HS-32P FUSEI MOLD PRESS:

FMTM250-7HS-32P FUSEI MOLD PRESS

 1  
256645

FUSEI  

FMTM250-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS:

FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS

 1  
256649

FUSEI  

FMTM300-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM300-7HS-32P FUSEI MOLD PRESS:

FMTM300-7HS-32P FUSEI MOLD PRESS

 1  
256650

FUSEI  

FMTM300-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM300-7HS-32P FUSEI MOLD PRESS:

FMTM300-7HS-32P FUSEI MOLD PRESS

 1  
256651

FUSEI  

FMTM300-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM300-7HS-32P FUSEI MOLD PRESS:

FMTM300-7HS-32P FUSEI MOLD PRESS

 1  
256648

FUSEI  

FMTM300-7HS-32P 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS:

FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS

 1  
257562

Tazmo Co.,Ltd.  

Loadport for Tazmo 

List all items of this typeFilm/Wafer Mounters

in Dicing Tools

Loadport Tazmo:
 Tool PlatformHerstellerModelnummerKonfiguration
     
Loadport 1TazmoTazmoS048513B000112"
     
Loadport 2TazmoRight MFG.co.LtdRP25008/12"
     
Loadport 3TazmoRight MFG.co.LtdRP25008/12"
     
Loadport 4TazmoRight MFG.co.LtdRP25008/12"
     
Loadport 5TazmoRight MFG.co.LtdRP25008/12"
     
Loadport 6TazmoRight MFG.co.LtdRP25008/12"
     
Loadport 7TazmoRight MFG.co.LtdRP25008/12"
     
 1  
257577

Longhill Industries  

LONGHILL_LH-860 

List all items of this typeFilm/Wafer Mounters

in Dicing Tools

LONGHILL WAFER MOUNT LONGHILL_LH-860:

LONGHILL WAFER MOUNT LONGHILL_LH-860LONGHILL WAFER MOUNT LONGHILL_LH-860

 1  
254740

Tazmo Co.,Ltd.  

Mounter 2 Glass  

List all items of this typeFilm/Wafer Mounters

in Dicing Tools

 1  
235315
Scrap 3x mini buffers (10011500,10011501,10011502) 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Scrap 3x mini buffers (10011500,10011501,10011502):

These 3 mini buffers (10011500,10011501,10011502) will be scrap because

1: linked machines were already scrapped 

2: function isn't complete

 3   F*
256639

fujiwa  

SD250 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

SD250 FUJIWA MOLD PRESS:

SD250 FUJIWA MOLD PRESS

 1  
256630

Alphasem  

SL9001 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Swissline Die Sorter (Pick & Place):

Transferring die from sawn wafer (mounted frame) to tape and reel.

Location is at Infineon Penang.

 1  
256344

Tazmo Co.,Ltd.  

Tazmo Mounter 4 

List all items of this typeFilm/Wafer Mounters

in Dicing Tools

 1  
256638

fujiwa  

TEP-200-70 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TEP-200-70 FUJIWA MOLD PRESS:

TEP-200-70 FUJIWA MOLD PRESS

 1  
257110

fujiwa  

TEP-200-70 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TEP-200-70 FUJIWA MOLD PRESS:

TEP-200-70 FUJIWA MOLD PRESS

 1  
255415

fujiwa  

TEP-250 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TEP-250 FUJIWA / MOLD PRESS:
Serial NumberModelManufacturer
2562TEP-250FUJIWA
 1  
256640

fujiwa  

TEP-250-70 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TEP-250-70 FUJIWA MOLD PRESS:

TEP-250-70 FUJIWA MOLD PRESS

 1  


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.