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	View All Offers Under Semiconductor / Hybrid Assembly Equipment » Switch Major Category		Click an item's ID# below for its full specifications , or: Group Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment List all 51 product types under Semiconductor / Hybrid Assembly Equipment

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Item ID  Short Description Product Type / Details # Price Notes Make Model     255419 ESEC   2007 ESEC  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacture 205940 2007 ESEC 1   255584 ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 208424 2007 ESEC 1   255585 ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 209377 2007 ESEC 1   255586 ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 204882 2007 ESEC 1   255587 ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 1   255588 ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 1   256626 ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: 2007 ESEC Die Bonder 1   N* 255416 fujiwa   250-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment 250-70 FUJIWA / Mold Press: Serial Number Model Manufacturer 2534 250-70 FUJIWA 1   255589 Orthodyne   360C  Wire Bonding Equipment - Other in Wire Bonders 360C ORTHODYNE Wire Bonder: 360C ORTHODYNE Wire Bonder 1   256653 Orthodyne   360C  Wire Bonding Equipment - Other in Wire Bonders 360C ORTHODYNE WIRE BONDER: 360C ORTHODYNE WIRE BONDER 1   N* 256655 hull   4216LP-D  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment 4216LP-D HULL_FINMAC DEFLASH: 4216LP-D HULL_FINMAC DEFLASH 1   N* 256654 hull   BT4216LP  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment BT4216LP HULL_FINMAC DEFLASH: BT4216LP HULL_FINMAC DEFLASH 1   N* 256629 Soft View Technology   SVDS  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Die Sorter (Pick & Place): Transferring die from sawn wafer (mounted frame) to die plate or tape and reel. Location is at Infineon Penang. 1   N* 248130 EKRA   Serio4000  Screen Printers in Semiconductor / Hybrid Assembly Equipment EKRA Serio 4000: Equipment for automated stencil printing  Designed for automated input and output Printing format min 80x50mm, max 510x510 Not suitable for manual loading and unloading 1   255417 ESEC   ESEC 2007  Automatic Flip Chip Bonders in Flip Chip Bonders ESEC 2007 DIE BONDER: Serial Number Model Manufacturer 205940 2007 ESEC 1   256642 FUSEI   FMTM250-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI MOLD PRESS: FMTM250-7HS-32P FUSEI MOLD PRESS 1   N* 256643 FUSEI   FMTM250-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI MOLD PRESS: FMTM250-7HS-32P FUSEI MOLD PRESS 1   N* 256645 FUSEI   FMTM250-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS: FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS 1   N* 256649 FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS 1   N* 256650 FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS 1   N* 256651 FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS 1   N* 256648 FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS: FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS 1   N* 254740 Tazmo Co.,Ltd.   Mounter 2 Glass   Film/Wafer Mounters in Dicing Tools 1   235315 Scrap 3x mini buffers (10011500,10011501,10011502)  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Scrap 3x mini buffers (10011500,10011501,10011502): These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped  2: function isn't complete 3   F* 256639 fujiwa   SD250  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment SD250 FUJIWA MOLD PRESS: SD250 FUJIWA MOLD PRESS 1   N* 256630 Alphasem   SL9001  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Swissline Die Sorter (Pick & Place): Transferring die from sawn wafer (mounted frame) to tape and reel. Location is at Infineon Penang. 1   N* 256344 Tazmo Co.,Ltd.   Tazmo Mounter 4  Film/Wafer Mounters in Dicing Tools 1   N* 256638 fujiwa   TEP-200-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-200-70 FUJIWA MOLD PRESS: TEP-200-70 FUJIWA MOLD PRESS 1   N* 257110 fujiwa   TEP-200-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-200-70 FUJIWA MOLD PRESS: TEP-200-70 FUJIWA MOLD PRESS 1   N* 255415 fujiwa   TEP-250  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-250 FUJIWA / MOLD PRESS: Serial Number Model Manufacturer 2562 TEP-250 FUJIWA 1   256640 fujiwa   TEP-250-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-250-70 FUJIWA MOLD PRESS: TEP-250-70 FUJIWA MOLD PRESS 1   N*

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

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  N* if the item is newly added, and/or
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