 |
Item ID |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
Make |
Model |
|
|
|
|
 |
203803
|
Shinkawa |
ACB35 |
in Wire Bonders
3 sets of SHINKAWA ACB35 WIRE BOND:SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052
|
3
|
lot
|
¥ 2,443,263.00 |
|
|
 |
213293
|
ASM |
Siplace CA4 |
in Flip Chip Bonders
ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20
|
1
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 |
|
 |
211895
|
P&P TECH |
PP.103 |
in Semiconductor / Hybrid Assembly Equipment
|
1
|
|
|
 |
|
 |
211896
|
P&P TECH |
PP.103 |
in Semiconductor / Hybrid Assembly Equipment
|
1
|
|
|
 |
|
 |
216983
|
Automatic wafer sorter model |
in Semiconductor / Hybrid Assembly Equipment
Automatic wafer sorter model:10006965 | 0 | Automatic wafer sorter model | 8500024818;A-12-3040-37-D001-A-02 |
|
1
|
|
|
 |
|
 |
211696
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
|
|
|
 |
|
 |
211698
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
|
|
|
 |
|
 |
211699
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
|
|
|
 |
|
 |
211697
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
|
|
|
 |
|
 |
213366
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:ESEC 3088 Wire Bonder | PO5627 | ESEC 3088 Wire Bonder | PO5627 | ESEC 3088 Wire Bonder | Transfer AG | ESEC 3088 Wire Bonder | 200810209;transfer in from IFAG | ESEC 3088 Wire Bonder | PO NO 200410327 BNE NO 20040009W | ESEC 3088 Wire Bonder | Transfer AG | ESEC 3088 wirebonder | 8500043290;transfer from IFAG;661001544 |
|
7
|
|
|
|
|
 |
217537
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:9F392100030150ESEC 3088 Wire BonderPO56279F399100039170ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W LOCATION: Wuxi
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2
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|
|
 |
|
 |
200489
|
ESEC |
ESEC3088 |
in Wire Bonders
ESEC3088 WireBonder 2 sets:ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823 LOCATION: Wuxi
|
2
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|
|
|
|
 |
207622
|
FICO AMS-11-MR MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING:Asset | SNo. | Asset name | Asset name2 | Physical Location | Serial no. | 10006073 | 0 | FICO AMS-11-MR MOLDING | 201010012;Mal transfer DS line;inv#6JM/00883 | 108 1FASSY | 5133182FC18 |
|
1
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|
¥ 4,910,590.66 |
|
|
 |
210403
|
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING:10005234 | 0 | FICO AMS-11-MR MOLDING | 200810208;IFMAL#6JM/00360;with NBV transferin | 10005234 | 1 | Fico Mold Die | 201010233;Mal transfer DS line;inv#6JM/00771 | 10005343 | 0 | FICO AMS-11-MR2 MOLDING | 200810443;transfer in from IFMY | 10007325 | 1 | FICO MOLD DIE | 8500040046;transfer from IFMY; 6JM/00109 | 10007325 | 2 | CIQ & Freight: FICO AMS-11-MR2 MOLDING | 8500040046;transfer from IFMY; 6JM/00109 | 10005732 | 0 | FICO AMS-11-MR MOLDING | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 10005732 | 1 | Fico Mold Die | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 10005732 | 2 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 10005732 | 3 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 10005732 | 4 | SCD80 M2 FICO Molding-upgrade SOT343 | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 10007592 | 0 | FICO AMS-11-MR MOLDING | 8500045354;transfer from IFMY; 6JM/00645 | 10007592 | 1 | Fico Mold Die | 8500045354;transfer from IFMY; 6JM/00645 | 10007592 | 2 | CURING OVEN | 8500045354;transfer from IFMY; 6JM/00645 | 10007592 | 3 | CIQ & freight: FICO AMS-11-MR MOLDING | 8500045354;transfer from IFMY; 6JM/00645 |
|
4
|
|
|
 |
|
 |
203804
|
Heraeus Oven & Oven Table |
in Wire Bonders
Heraeus Oven & Oven Table:Heraeus Oven & Oven Table 10002755 Oven | 10004959 Oven Table |
|
2
|
lot
|
¥ 31,003.00 |
|
|
 |
217534
|
Inliner Machine |
in Semiconductor / Hybrid Assembly Equipment
Inliner Machine:9F587 | 10007477 | 0 | Inliner Machine | 8500043739;transfer from IFMY; 6JM/00486 | 9F587 | 10007477 | 1 | fright: Inliner Machine | 8500043739;transfer from IFMY; 6JM/00486 |
|
1
|
|
|
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|
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204631
|
Lauffer Mold Press |
in Semiconductor / Hybrid Assembly Equipment
Lauffer Mold Press :Lauffer Mold Press/100050250 Mold-Die, 5% Mark up from MY/100050251 CURING OVEN/100050260
|
2
|
|
¥ 2,526,419.44 |
 |
|
 |
158359
|
Shinkawa |
ACB35 |
in Ball Bonders
|
1
|
|
|
 |
|
 |
158364
|
Shinkawa |
ACB35 |
in Ball Bonders
|
1
|
|
|
F* |
|
 |
217318
|
SHINKAWA ACB35 &ACB400 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 &ACB400 WIRE BOND:SHINKAWA WIRE BOND ACB400 | 8500040046;transfer from IFMY; 6JM/00109 | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup |
|
12
|
|
|
 |
|
 |
218841
|
SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:9F570 | 10005437 | 0 | SHINKAWA ACB35 WIRE BOND | 200910266;transfer assets from IFMY | 9F570 | 10005438 | 0 | SHINKAWA ACB35 WIRE BOND | 200910266;transfer assets from IFMY |
|
2
|
|
|
 |
|
 |
207381
|
SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | 9F371 | 10006475 | SHINKAWA ACB35 WIRE BOND | 8500018759;transfer from IFMY;inv# 6JM/00925 | 108 1F ASSY | F0-36534 S23 |
|
1
|
|
¥ 932,760.30 |
 |
|
 |
204719
|
SHINKAWA ACB35 Wire Bond |
in Wire Bonders
SHINKAWA ACB35 Wire Bond:100060530 | SHINKAWA ACB35 Wire Bond | 100068240 | VISUAL INSPECTION SYSTEM | 100068241 | hookup: VISUAL INSPECTION SYSTEM | 100073050 | VISION INSPECTION MACHINE |
|
3
|
|
¥ 1,368,926.41 |
 |
|
 |
199782
|
Shinkawa |
ACB35 |
in Ball Bonders
SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851 LOCATION: Wuxi
|
4
|
|
|
 |
|
 |
203821
|
Shinkawa |
ACB400 |
in Wire Bonders
SHINKAWA ACB400 WIRE BOND:SHINKAWA WIRE BOND ACB400 10007322 WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT LOCATION: Wuxi
|
1
|
|
¥ 953,057.50 |
 |
|
 |
210121
|
SHINKAWA WIRE BOND ACB35 |
in Wire Bonders
SHINKAWA WIRE BOND ACB35:SHINKAWA WIRE BOND ACB35 | 8500045110;transfer from IFMY; 6JM/00582 | COPPER WIRE KIT | 8500046709;A-12-3040-37-D035-A-01;17019553 |
|
4
|
|
|
 |
|
 |
210122
|
SHINKAWA WIRE BOND ACB400 |
in Wire Bonders
SHINKAWA WIRE BOND ACB400:SHINKAWA WIRE BOND ACB400 | 8500033675;transfer asset from IFMY; 6JM/01022 | COPPER WIRE KIT | 8500028533/31676/35022;A-12-3040-37-D006-A-01;2301 |
LOCATION: Wuxi
|
4
|
|
|
 |
|
 |
217317
|
SHINKAWA WIRE BOND ACB400 |
in Wire Bonders
SHINKAWA WIRE BOND ACB400:9F371 | 10007321 | 0 | SHINKAWA WIRE BOND ACB400 | 8500040046;transfer from IFMY; 6JM/00109 | 9F371 | 10007321 | 1 | WIRE CLAMPER | 8500042621;A-12-3040-37-D035-A-03;17594392 | 9F371 | 10007321 | 2 | TRANSDUCER UST-200-1 | 8500042621;A-12-3040-37-D035-A-02;17594395/96 | 9F371 | 10007321 | 3 | COPPER WIRE KIT | 8500028533/31676/35022;A-12-3040-37-D006-A-01;2301 |
|
1
|
|
|
 |
|
 |
207382
|
TOSOK DBD 3280/3310 Die Bond |
in Eutectic Die Bonders
TOSOK DBD 3280/3310 Die Bond:Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | 9F371 | 10005747 | TOSOK DBD3280 Die Bond. | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 108 1F ASSY | 169 T13 | 9F371 | 10005747 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 108 1F ASSY | 169 T13 | 9F371 | 10005747 | Conversion key1(X-Y wafer holder unit) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | 9F371 | 10005747 | Conversion key4(loader-unloader) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | 9F375 | 10006006 | TOSOK DBD3310 Die Bond . | 8500008995;Mal transfer DS line;inv# 6JM/00057/65 | 108 1F ASSY | 295 T25 | 9F375 | 10006006 | Ceramic heater(NRQ00010R) | 8500015375;A-11-3040-37-D030-A-01;inv#EG20110606 | 108 1F ASSY | 295 T25 | 9F375 | 10005536 | TOSOK DBD3310 Die Bond . | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | 9F375 | 10005536 | CIQ import inspection charge for TOSOK DBD3310 Die | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | 9F375 | 10005536 | freight: TOSOK DBD3310 Die Bond 161 T26. | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | 9F570 | 10006036 | TOSOK DBD3310 DIE BOND | 8500007255;Mal transfer DS line;inv# 6JM/00884 | 108 2F ASSY | 182-T86 |
|
4
|
|
¥ 8,799,723.91 |
 |
|
 |
192458
|
tosok |
|
in Eutectic Die Bonders
TOSOK DBD3200 Die Bond 161 T38 Training:Unfunctional, unable to repair, spare parts removed LOCATION: Wuxi SERIAL NUMBER(S): 161T38
|
1
|
|
|
 |
|
 |
204630
|
TOSOK DBD3310 3280 DIE BOND |
in Eutectic Die Bonders
TOSOK DBD3310 3280 DIE BOND:TOSOK DBD3310 DIE BOND 10005730/10006037/10006038 TOSOK DBD3280 Die Bond 10005748
|
4
|
|
¥ 6,569,652.00 |
 |
|
 |
217765
|
TOSOK DBD3310 DIE BOND |
in Eutectic Die Bonders
TOSOK DBD3310 DIE BOND:9F570 | 10005831 | 0 | TOSOK DBD3310 DIE BOND | 201010229;A-10-3040-37-D008-T-07;Inv#6JM/00638 | 9F570 | 10005726 | 0 | TOSOK DBD3310 DIE BOND | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 9F570 | 10005726 | 1 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | 9F434 | 10005236 | 0 | LINKING BUFFER SYSTEM | 200810323;IFMAL#6JM/00360;5% markup | 9F570 | 10006007 | 0 | TOSOK DBD3310 DIE BOND | 8500008995;Mal transfer DS line;inv# 6JM/00057/65 | 9F570 | 10006007 | 1 | Ceramic heater(NRQ00060R) | 8500015375;A-11-3040-37-D030-A-01;inv#EG20110606 | 9F570 | 10005745 | 0 | TOSOK DBD3310 DIE BOND | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 9F570 | 10005745 | 1 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 9F570 | 10005746 | 0 | TOSOK DBD3310 DIE BOND | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 9F570 | 10005746 | 1 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 |
|
6
|
|
|
 |
|
 |
210405
|
TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND |
in Eutectic Die Bonders
TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND:10004115 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | 10004116 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | 10004117 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | 10004118 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | 10005524 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | 10005525 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | 10005526 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | 10005527 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | 10005330 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | 10005331 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | 10005332 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | 10005332 | 3 | Freight fee | 200810444;transfer in from IFMY | 10005333 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | 10006005 | 0 | TOSOK DBD3310 DIE BOND | 8500008995;Mal transfer DS line;inv# 6JM/00057/65 | 10006005 | 1 | Ceramic heater(NRQ00010R) | 8500015375;A-11-3040-37-D030-A-01;inv#EG20110606 | 10007405 | 0 | TOSOK DIE BOND DBD4200 | 8500041396;transfer from IFMY;INV# 6JM/00233 |
|
14
|
|
|
 |
|
 |
199781
|
tosok |
3310 |
in Epoxy Die Bonders
TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229 LOCATION: Wuxi
|
4
|
|
|
 |
|
 |
207602
|
TRIM FORM MACHINE |
in Semiconductor / Hybrid Assembly Equipment
TRIM FORM MACHINE:Asset | Asset name | Asset name2 | Serial no. | 10007004 | TRIM FORM MACHINE | 8500033677;transfer asset from IFMY; 6JM/00758 | TF-17 |
|
1
|
|
¥ 1,368,171.00 |
 |
|
 |
217766
|
Tsf_Wafer Prober_APR-024(old) |
in Semiconductor / Hybrid Assembly Equipment
Tsf_Wafer Prober_APR-024(old):10011067 0 Tsf_Wafer Prober_APR-024(old) 8500110549-02;INV#8820000333;ECCN:EAR99
|
1
|
|
|
 |
|
 |
206540
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW025
|
1
|
|
|
 |
|
 |
206541
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW027
|
1
|
|
|
 |
|
 |
206542
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW034
|
1
|
|
|
 |
|
 |
206543
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW035
|
1
|
|
|
 |
|
 |
206544
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW037
|
1
|
|
|
 |
|
 |
206545
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW038
|
1
|
|
|
 |
|
 |
206546
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW039
|
1
|
|
|
 |
|
 |
206547
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW040
|
1
|
|
|
 |
|
 |
206565
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW051
|
1
|
|
|
 |
|
 |
206566
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW061
|
1
|
|
|
 |
|
 |
206567
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW065
|
1
|
|
|
 |
|
 |
206568
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW021
|
1
|
|
|
 |
|
 |
206569
|
Shinkawa |
UTC1000 |
in Ball Bonders
UTC1000 SHINKAWA Wire Bonder:WB_SHINKAWA UTC1000_SW052
|
1
|
|
|
 |
|
 |
207601
|
Wafer inker machine |
in Semiconductor / Hybrid Assembly Equipment
Wafer inker machine:Asset | Asset name | Asset name2 | Serial no. | 10009379 | Wafer Inker Machine | A-17-3040-37-D019-T-01; 8500080345 | 0211-3296 INK-11 | 10006598 | Wafer inker machine | 8500022900;transfer from IFMY; 6JM/01085 | APR-WX-001 |
|
2
|
|
¥ 1,024,300.00 |
 |
|