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Semiconductor / Hybrid Assembly Equipment


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Group Offers into sub-categories under Semiconductor / Hybrid Assembly EquipmentGroup Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment

List all 51 product types under Semiconductor / Hybrid Assembly EquipmentList all 51 product types under Semiconductor / Hybrid Assembly Equipment

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 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
203803

Shinkawa  

ACB35 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

3 sets of SHINKAWA ACB35 WIRE BOND:

SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052

3 lot ¥ 2,443,263.00
213293

ASM  

Siplace CA4 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

 

 

1  
211895

P&P TECH  

PP.103 

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in Semiconductor / Hybrid Assembly Equipment

1   F*
211896

P&P TECH  

PP.103 

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in Semiconductor / Hybrid Assembly Equipment

1  
211696

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211698

tosok  

Tosok DBD3550R 

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in Eutectic Die Bonders

1  
211699

tosok  

Tosok DBD3550R 

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in Eutectic Die Bonders

1  
211697

tosok  

Tosok DBD3550R 

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in Eutectic Die Bonders

1  
204177

ESEC  

ESEC 3006 

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in Wire Bonders

ESEC 3006 Wire Bonder:

ESEC 3006 Wire Bonder_EW024

1  
204178

ESEC  

ESEC 3006 

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in Wire Bonders

ESEC 3006 Wire Bonder:

ESEC 3006 Wire Bonder_EW123

1  
204179

ESEC  

ESEC 3006 

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in Wire Bonders

ESEC 3006 Wire Bonder:

ESEC 3006 Wire Bonder_EW127

1  
213366
ESEC 3088 Wire Bonder 

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in Wire Bonders

ESEC 3088 Wire Bonder:
ESEC 3088 Wire BonderPO5627
ESEC 3088 Wire BonderPO5627
ESEC 3088 Wire BonderTransfer AG
ESEC 3088 Wire Bonder200810209;transfer in from IFAG
ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W
ESEC 3088 Wire BonderTransfer AG
ESEC 3088 wirebonder8500043290;transfer from IFAG;661001544

 

7  
200489

ESEC  

ESEC3088 

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ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2  
207622
FICO AMS-11-MR MOLDING 

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in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING:
AssetSNo.Asset nameAsset name2Physical LocationSerial no.
100060730FICO AMS-11-MR MOLDING201010012;Mal transfer DS line;inv#6JM/00883108 1FASSY5133182FC18
1 ¥ 4,910,590.66
210403
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING 

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in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING:
100052340FICO AMS-11-MR MOLDING200810208;IFMAL#6JM/00360;with NBV transferin
100052341Fico Mold Die201010233;Mal transfer DS line;inv#6JM/00771
100053430FICO AMS-11-MR2 MOLDING200810443;transfer in from IFMY
100073251FICO MOLD DIE8500040046;transfer from IFMY; 6JM/00109
100073252CIQ & Freight: FICO AMS-11-MR2 MOLDING8500040046;transfer from IFMY; 6JM/00109
100057320FICO AMS-11-MR MOLDING201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057321Fico Mold Die201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057322CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057323CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057324SCD80 M2 FICO Molding-upgrade SOT343201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100075920FICO AMS-11-MR MOLDING8500045354;transfer from IFMY; 6JM/00645
100075921Fico Mold Die8500045354;transfer from IFMY; 6JM/00645
100075922CURING OVEN8500045354;transfer from IFMY; 6JM/00645
100075923CIQ & freight: FICO AMS-11-MR MOLDING8500045354;transfer from IFMY; 6JM/00645

 

4   F*
203804
Heraeus Oven & Oven Table 

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Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot ¥ 31,003.00
204631
Lauffer Mold Press  

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in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 ¥ 2,526,419.44
208162

FICO  

AMS-11-MR2 

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Multiplunger AMS-11-MR2 :

Multiplunger AMS-11-MR2     

1  
158359

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1  
158364

Shinkawa  

ACB35 

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in Ball Bonders

1   F*
207381
SHINKAWA ACB35 WIRE BOND 

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in Wire Bonders

SHINKAWA ACB35 WIRE BOND:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110006475SHINKAWA ACB35 WIRE BOND8500018759;transfer from IFMY;inv# 6JM/00925108 1F ASSYF0-36534 S23

 

1 ¥ 932,760.30
204719
SHINKAWA ACB35 Wire Bond 

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in Wire Bonders

SHINKAWA ACB35 Wire Bond:
100060530SHINKAWA ACB35 Wire Bond
100068240VISUAL INSPECTION SYSTEM
100068241hookup: VISUAL INSPECTION SYSTEM
100073050VISION INSPECTION MACHINE
3 ¥ 1,368,926.41
199782

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi

4  
203821

Shinkawa  

ACB400 

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SHINKAWA ACB400 WIRE BOND:

SHINKAWA WIRE BOND ACB400 10007322

WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT


LOCATION: Wuxi
1 ¥ 953,057.50
210121
SHINKAWA WIRE BOND ACB35 

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SHINKAWA WIRE BOND ACB35:
SHINKAWA WIRE BOND ACB358500045110;transfer from IFMY; 6JM/00582
COPPER WIRE KIT8500046709;A-12-3040-37-D035-A-01;17019553
4  
210122
SHINKAWA WIRE BOND ACB400 

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in Wire Bonders

SHINKAWA WIRE BOND ACB400:
SHINKAWA WIRE BOND ACB4008500033675;transfer asset from IFMY; 6JM/01022
COPPER WIRE KIT8500028533/31676/35022;A-12-3040-37-D006-A-01;2301

 


LOCATION: Wuxi
4  
207382
TOSOK DBD 3280/3310 Die Bond 

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in Eutectic Die Bonders

TOSOK DBD 3280/3310 Die Bond:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110005747TOSOK DBD3280 Die Bond.201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747CIQ inspect fee in Malacca201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747Conversion key1(X-Y wafer holder unit)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key4(loader-unloader)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37510006006TOSOK DBD3310 Die Bond .8500008995;Mal transfer DS line;inv# 6JM/00057/65108 1F ASSY295 T25
9F37510006006Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606108 1F ASSY295 T25
9F37510005536TOSOK DBD3310 Die Bond .PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536CIQ import inspection charge for TOSOK DBD3310 DiePO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536freight: TOSOK DBD3310 Die Bond 161 T26.PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F57010006036TOSOK DBD3310 DIE BOND8500007255;Mal transfer DS line;inv# 6JM/00884108 2F ASSY182-T86

 

4 ¥ 8,799,723.91
192458

tosok  

 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3200 Die Bond 161 T38 Training:

Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38

1  
204630
TOSOK DBD3310 3280 DIE BOND 

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TOSOK DBD3310 3280 DIE BOND:

TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748

4 ¥ 6,569,652.00
210405
TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND:
100041150TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100041160TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100041170TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100041180TOSOK DBD3310 DIE BONDPO 200510184 BNE A-05-3040-41-D004-T-05
100055240TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100055250TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100055260TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100055270TOSOK DBD3310 DIE BONDPO#201010016/Inv:6JM/00231
100053300TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100053310TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100053320TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100053323Freight fee200810444;transfer in from IFMY
100053330TOSOK DBD3310 DIE BOND200810444;transfer in from IFMY
100060050TOSOK DBD3310 DIE BOND8500008995;Mal transfer DS line;inv# 6JM/00057/65
100060051Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606
100074050TOSOK DIE BOND DBD42008500041396;transfer from IFMY;INV# 6JM/00233

 

14   F*
199781

tosok  

3310 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi

4  
207602
TRIM FORM MACHINE 

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in Semiconductor / Hybrid Assembly Equipment

TRIM FORM MACHINE:
AssetAsset nameAsset name2Serial no.
10007004TRIM FORM MACHINE8500033677;transfer asset from IFMY; 6JM/00758TF-17
1 ¥ 1,368,171.00
206540

Shinkawa  

UTC1000 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW025

1  
206541

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW027

1  
206542

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW034

1  
206543

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW035

1  
206544

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW037

1  
206545

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW038

1  
206546

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW039

1  
206547

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW040

1  
206565

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW051

1  
206566

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW061

1  
206567

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW065

1  
206568

Shinkawa  

UTC1000 

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UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW021

1  
206569

Shinkawa  

UTC1000 

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in Ball Bonders

UTC1000 SHINKAWA Wire Bonder:

WB_SHINKAWA UTC1000_SW052

1  
207601
Wafer inker machine 

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in Semiconductor / Hybrid Assembly Equipment

Wafer inker machine:
AssetAsset nameAsset name2Serial no.
10009379Wafer Inker MachineA-17-3040-37-D019-T-01; 85000803450211-3296 INK-11
10006598Wafer inker machine8500022900;transfer from IFMY; 6JM/01085APR-WX-001

 

2 ¥ 1,024,300.00
211868

Orthodyne  

M360C 

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in Wire Bonders

1  
211869

Orthodyne  

M360C 

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in Wire Bonders

1  
211872

Orthodyne  

M360C 

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in Wire Bonders

2  
211873

Orthodyne  

M360C 

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in Wire Bonders

2  
211867

Orthodyne  

M360C 

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in Wire Bonders

1  
211870

Orthodyne  

M360C 

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in Wire Bonders

1  
211871

Orthodyne  

M360C 

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in Wire Bonders

2  
211874

Orthodyne  

M360C 

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2  


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.