Contact Us  |  Terms  |  Imprint  |  Privacy     
 Fast  FIND      full search   tips    
  Specials  |  Listings:   Offered / Wanted / Both     |  Spare Parts Home     
Serving  Our Guest Log in    Register to speed trading
ALL CATEGORIES   View   Search-by-Specs   
View All Offers Under

Semiconductor / Hybrid Assembly Equipment


» Switch Major Category
Click an item's ID# below for its full specifications , or:

Group Offers into sub-categories under Semiconductor / Hybrid Assembly EquipmentGroup Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment

List all 51 product types under Semiconductor / Hybrid Assembly EquipmentList all 51 product types under Semiconductor / Hybrid Assembly Equipment

 Download Equipment List (.xls)  See all our available offerings! 

  • To sort on a column, click the column head; click it again to reverse the sort.
  • Click the links under the Product Type column head to see other like items of that type.
 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
213293

ASM  

Siplace CA4 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

- excluding Loader

 

 

1  
245179

NGK FILTECH  

MEGCON 2 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006:
CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006
1  
245178

NGK FILTECH  

MEGCON 2 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003:
CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003
1  
235315
Scrap 3x mini buffers (10011500,10011501,10011502) 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Scrap 3x mini buffers (10011500,10011501,10011502):

These 3 mini buffers (10011500,10011501,10011502) will be scrap because

1: linked machines were already scrapped 

2: function isn't complete

3   F*
243278

EKRA  

XM 

List all items of this typeScreen Printers

in Semiconductor / Hybrid Assembly Equipment

Screen & Stencil Printer Ekra (Asys Group):

The XM is a manual screen and stencil printer
dedicated to small batch size production and
prototyping purposes. The sideways guided squeegee
traverse and the adjustable squeegee pressure
ensure a constant, high quality print. Simple
operation and short set-up times all belong to the
application oriented concept.
Stiff as well as flexible materials such as PCBs,
glass, ceramic or metal up to a thickness of 30 mm
can be printed. Due to these characteristics the
XM print system is the ideal application for small
batch series and for prototyping.

1  
245208

ASM Technology Singa  

Xpress GoCu 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire bond ASM IHAWK XPRESS GOCU:

Wire bond ASM IHAWK XPRESS GOCU with heat tunnel

1 € 0.00
245209

Shinkawa  

SKW_UTC2000 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire Bond UTC2000:

SW116:UTC2000:Gold wire bonder

1 € 0.00
245210

Shinkawa  

SKW_UTC2000 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire Bond UTC2000:

SW122:UTC2000:Gold wire bonder

1 € 0.00
245207

ASM  

Xpress GoCu 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire bond Xpress GoCu:

Wire bond ASM i-Hawk Xpress Go Cu: Heat Tunnel

1 € 0.00


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.