Contact Us  |  Terms  |  Imprint  |  Privacy     
 Fast  FIND      full search   tips    
  Specials  |  Listings:   Offered / Wanted / Both     |  Spare Parts Home     
Serving  Our Guest Log in    Register to speed trading
 MENU OF PRODUCT CATEGORIES   View   Search-by-Specs   
View All Offers Under

ALL CATEGORIES


» Switch Major Category
Click an item's ID# below for its full specifications , or:

Group Offers into sub-categories under ALL CATEGORIESGroup Offers into sub-categories under ALL CATEGORIES

List all 407 product types under ALL CATEGORIESList all 407 product types under ALL CATEGORIES


  • To sort on a column, click the column head; click it again to reverse the sort.
  • Click the links under the Product Type column head to see other like items of that type.
Displaying 1-100 of 166  Page  No Previous Page  Show Next Page
 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
208163

Ingenious Equipment  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

100% VI Station:

Motorized Indexer for  100%VI Station after Taping + PLC Controller

1  
208164

Ingenious Equipment  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

100% VI Station:

Motorized Indexer for  100%VI Station after Taping + PLC Controller

1  
208165

Ingenious Equipment  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

100% VI Station:

Motorized Indexer for  100%VI Station after Taping + PLC Controller

1  
212160

P & P Tech  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
203088
2 set of inline tester 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

2 set of inline tester:

2 set of inline tester

asset no:10005027 & 10005029


LOCATION: Wuxi
2 ¥ 5,787,004.00
209845
200mm THIN WAFER Loader NSX 

List all items of this typeTest & Measurement - Other

in Test & Measurement Equipment

200mm THIN WAFER Loader NSX:

200mm THIN WAFER Loader NSX

“NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“

1 € 1,000.00
203803

Shinkawa  

ACB35 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

3 sets of SHINKAWA ACB35 WIRE BOND:

SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052

3 lot ¥ 2,443,263.00
220089

Advantest  

T5371 

List all items of this typeMemory Test Systems

in Device Testers

Advantest T5371 Memory Tester:

Brand: Advantest

Model: T5371 

Serial No.: 310016752

MFG date: Feb’2001 

Asset : T-103132

DUT : 32

1  
219220

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

Amat P5000 CVD Tool:

P500051

Tool with 2 Etch Chambers and 2 Teos Chambers

1  
218746

Applied Materials  

P5000 

List all items of this typeChemical Vapor Deposition Equipment - Other

in Chemical Vapor Deposition Equipment

Amat P5000 CVD Tool:

P500048

8 inch tool with 4 CVD chambers.

1   F*
220613

Applied Materials  

Semvision 200CX 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

Amat Semvision 200CX:

SEM for particle -  review inspection.

 

1  
204578

Orbotech  

Ultra Discovery VM 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

AOI Orbotech Ultra Discovery VM:

Simple, Intelligent, Powerful

Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production.

Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time.

Benefits

  • High throughput and superior detection with minimal number of false calls
  • Especially designed for inspection of the finest lines down to 10μm
  • Quick set-up even for the most complicated jobs for higher productivity
  • Automation ready
  • Very high uptime
  • SIP TechnologyTM

    Push-to-Scan®:

    • A ‘no set-up’ process
    • Top AOI results with minimal effort or training
    • The easiest, user-friendly interface (GUI)
    • Full ‘Step and Repeat’ functions

    Visual Intelligence:

    Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want.

    Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects.

    Visual Intelligence:

    • Full panel understanding, context-based detection engine
    • Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed

       

 

1 $ 24,900.00
213293

ASM  

Siplace CA4 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

 

 

1  
221087

ASM Technologies  

ASM iHAWK Xpress GoCu 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Au/Cu Wire Bonder, ASM iHAWK Xpress GoCu:

Functioning

1 € 50,000.00
221085

ASM Technologies  

ASM iHAWK Xtreme 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Au/Cu Wire Bonder, ASM iHAWK Xtreme:

Functioning

2 € 35,000.00
221086

ASM Technologies  

ASM iHAWK Xtreme 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Au/Cu Wire Bonder, ASM iHAWK Xtreme:

Functioning

2 € 35,000.00
221084

ASM Technologies  

ASM iHAWK 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Au/Cu Wire Bonder, ASM iHAWK:Wire Bonder:

Functioning

1 € 35,000.00
211895

P&P TECH  

PP.103 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

1  
211896

P&P TECH  

PP.103 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

1  
216983
Automatic wafer sorter model 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Automatic wafer sorter model:
100069650Automatic wafer sorter model8500024818;A-12-3040-37-D001-A-02
1  
204380

Infineon  

Bruchless Motor bench 

List all items of this typeTest & Measurement - Other

in Test & Measurement Equipment

Bruchless Motor bench:

Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).

For more informations please refer to the enclosed diagram and the motor description below. 

Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)

This three-phase motor works with the Kelly controller (described below)

• Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts)

• Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center.

• This is a 4 pole motor (8 magnets).

• The Phase to Phase winding resistance is 0.013 Ohms.

• The maximum recommended rotor speed is 5000 RPM.

• Voltages from 0 to 96 VDC input to the control.

• Torque constant of 0.15 Nm per Amp

• The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase.

• Armature Inertia is 45 Kg Cm Squared.

• Continuous current of 125 Amps AC (180 Amps DC into the motor control).

• Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control).

• Weight of 35 pounds.

• Peak Stall Torque of 90 Nm (66 ft).

• This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise).

 

Kelly KBL72301,24-72V,300A,BLDC Controller/With Regen

Kelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control.

Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily.

Features:

• Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency.

• Electronic reversing.

• Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V.

• Current sense on all 3 motor phases.Current control loop.

• Hardware over current protection.Hardware over voltage protection.

• Support torque mode, speed mode, and balanced mode operation.

• Configurable limit for motor current and battery current.

• Low EMC.LED fault code.

• Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage.

• Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal.

• Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.

1 lot  
220893

ESA ELECTRONICS PTE  

ATS12200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Burn In oven ATS12200:

Function ( MC already 2 years not running)

1  
220894

ESA ELECTRONICS PTE  

ATS12200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Burn In oven ATS12200:

Function ( MC already 2 years not running)

1  
220895

ESA ELECTRONICS PTE  

ATS12200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Burn In oven ATS12200:

Function ( MC already 2 years not running)

1  
220896

ESA ELECTRONICS PTE  

ATS12200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Burn In oven ATS12200:

Function ( MC already 2 years not running)

1  
222293

EDA Malaysia Industr  

SM-24FH 

List all items of this typeBurn-In Ovens

in Ovens

1   N*
222294

EDA Malaysia Industr  

SM-24FH 

List all items of this typeBurn-In Ovens

in Ovens

1   N*
220879

UCT TECHNOLOGY PTE.L  

UCT-CDWJ-600/800-D2:CHEMICAL DEFLASH SYSTEM 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

CD#02:UCT-CDWJ-600/800-D2:CHEMICAL DEFLASH SYSTEM:

Conditionally Functioning, require completing some parts (Part list is available)

1  
166465

Oxford Instruments  

CMI 950 

List all items of this typeXray Fluorescence Spectrometers

in Spectrometers

CMI 950 - Xray fluorescence spectrometer:
X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc.
Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag).

System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
1   F*
217146

Silicon Valley Group  

SVG8600 

List all items of this typeSolvent Wet Stations

in Wafer Cleaners

1  
207199

ASYS  

BC0 01 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS BC0 01:

Conveyor ASYS BC0 01

1  
207198

ASYS  

TRM02 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS TRM02:

Conveyor ASYS TRM02

1  
204220
Cyberscan CT350T Dual non-contact double-sided optical profilometer 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Cyberscan CT350T Dual non-contact double-sided optical profilometer:

2 Tools

- DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE

Tools are still running in production. Available from May/June 2019

Inspection possible!

The tools are pretty new and rarely used. Vintage 2018 and 2015 

The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken.

Please be invited to take a look at the pictures.

2   F*
221066

BESI Switzerland  

ESEC 2008 xP 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

DA_GLUE, 2008xP, ESEC 2008 DIE BONDER:

Function

2 € 350,000.00
221286

BESI Switzerland  

ESEC 2007 SSI 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

DA_Ssi, 2007 SSI Plus, ESEC 2007 DIE BONDER:

Function

1  
221067

BESI Switzerland  

ESEC 2007 SSI plus 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

DA_Ssi, 2007 SSI Plus, ESEC 2007 DIE BONDER:

Function

2 € 200,000.00
211696

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211698

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211699

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
211697

tosok  

Tosok DBD3550R 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

1  
195189
Drilling machine bernhard steinel 

List all items of this typeMixed Lots of Lab and Other Technical Equipment

in Laboratory Equipment

Drilling machine bernhard steinel:

Already damaged loses function, was unable to repair.
LOCATION: Wuxi

1 € 0.00
207727

ECA Advance Automati  

EC328FP 

List all items of this typeSMD Handlers

in Device Handlers

1  
221535

ECA ADVANCE AUTOMATI  

EC 328N 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

1 € 50,000.00 N*
219804
Ergospeed2 Loadport 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Ergospeed2 Loadport:

~5 Years old 

full functional

1 € 5,999.00
213366
ESEC 3088 Wire Bonder 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC 3088 Wire Bonder:
ESEC 3088 Wire BonderPO5627
ESEC 3088 Wire BonderPO5627
ESEC 3088 Wire BonderTransfer AG
ESEC 3088 Wire Bonder200810209;transfer in from IFAG
ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W
ESEC 3088 Wire BonderTransfer AG
ESEC 3088 wirebonder8500043290;transfer from IFAG;661001544

 

7  
217537
ESEC 3088 Wire Bonder 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC 3088 Wire Bonder:
9F392100030150ESEC 3088 Wire BonderPO56279F399100039170ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W
LOCATION: Wuxi
2  
200489

ESEC  

ESEC3088 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2  
202692
EVG820 Dry Film Lamination System 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

EVG820 Dry Film Lamination System:

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.

1 $ 55,000.00
210404

Suss MicroTec  

Falcon Polyimid Developer 

List all items of this typeStandard Photoresist DevTracks

in Photoresist Develop Track Systems

Fairchild Developer Ent3C:

Developer with 2 chambers for spray developing.

 

1  
206584
Fico AMS-11-MR Molding 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Fico AMS-11-MR Molding:
AssetAsset nameAsset name2Physical LocationSerial no.
10004762Inline VI WorkStationTransfer AGCC LINE 21VIF-19
10004924Fico AMS-11-MR MoldingTransfer AG, PO#200710494CC LINE 21INF6312182
10005047Buffer200710495;A-07-3040-37-C017-T-01;IFAG#633451493CC LINE 21BF-048
10004763Inline VI WorkStationTransfer AGCC LINE 21VIB-19

 

4 ¥ 4,052,063.00 F*
207622
FICO AMS-11-MR MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING:
AssetSNo.Asset nameAsset name2Physical LocationSerial no.
100060730FICO AMS-11-MR MOLDING201010012;Mal transfer DS line;inv#6JM/00883108 1FASSY5133182FC18
1 ¥ 4,910,590.66
210403
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING:
100052340FICO AMS-11-MR MOLDING200810208;IFMAL#6JM/00360;with NBV transferin
100052341Fico Mold Die201010233;Mal transfer DS line;inv#6JM/00771
100053430FICO AMS-11-MR2 MOLDING200810443;transfer in from IFMY
100073251FICO MOLD DIE8500040046;transfer from IFMY; 6JM/00109
100073252CIQ & Freight: FICO AMS-11-MR2 MOLDING8500040046;transfer from IFMY; 6JM/00109
100057320FICO AMS-11-MR MOLDING201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057321Fico Mold Die201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057322CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057323CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057324SCD80 M2 FICO Molding-upgrade SOT343201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100075920FICO AMS-11-MR MOLDING8500045354;transfer from IFMY; 6JM/00645
100075921Fico Mold Die8500045354;transfer from IFMY; 6JM/00645
100075922CURING OVEN8500045354;transfer from IFMY; 6JM/00645
100075923CIQ & freight: FICO AMS-11-MR MOLDING8500045354;transfer from IFMY; 6JM/00645

 

4  
221096

BESI Holland  

MK-1 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

FICO, Auto Mold System (AMS 24) 2p, MK-1:

Functioning

1 € 90,000.00
221101

BESI Holland  

MK-1 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

FICO, Auto Mold System, MK-1:

Function ( MC already 6 months not running)

1 € 70,000.00
221099

BESI Netherland  

FCL 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

FICO, FCL, FORM SINGULATION(TF2):

Functioning

1 € 250,000.00
221097

BESI Netherland  

TFM UF 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

FICO, TFM UF, DEGATE DAMBAR CUTTING & ACCESSORY:

Functioning

1 € 150,000.00
221098

BESI Netherland  

TFM UF 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

FICO, TFM UF, FORM SINGULATION(TF2):

Functioning

1 € 250,000.00
207724

Iwashita Instruments  

IWASHITA MG Inline 3030 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
221743

Mitutoyo  

QVT1-X606P1L-D 

List all items of this typeOptical Test & Measurement Equipment - Other

in Optical Test & Measurement Equipment

For Sale! Mitutoyo CNC Vision Measuring Machine :

In use until October 2020, when it was phased out from production. Since then, it's stored in a dry and heated environment. Besides minor marks and scratches caused by trolleys, it's in an excellent condition. It was maintained regularly by site maintenance, and went through yearly inspection by OEM, including calibration.

Standard machine, with special adapter plates used at Infineon. It's with software for series production, able to measure multiple modules in row. Saves date to local CSV file format and writing measurement data to Orbit system.,

Possibility to upgrade tactile measuring function!

1 € 55,000.00 F*N*
211897

Fuji Seiki  

ECB 10016 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
218247

Bruce (BTI)  

BDF-41 

List all items of this typeHorizontal Diffusion Furnaces

in Diffusion Furnaces

Furnance BDF-41 Ofen 29B:

Diffusion Furnance for atmospheric oxid processes.

Tube 4 is LPCVD

1  
221078

SHINKAWA Ltd  

UTC-1000 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Gold wire bonder, SHINKAWA UTC 1000:

Functioning

2 € 50,000.00
221081

SHINKAWA Ltd  

UTC-1000 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Gold wire bonder, SHINKAWA UTC 1000:

Functioning

2 € 50,000.00
221079

SHINKAWA Ltd  

UTC-1000S 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Gold wire bonder, SHINKAWA UTC 1000S:

Functioning

2 € 10,000.00
221080

SHINKAWA Ltd  

UTC-1000S 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Gold wire bonder, SHINKAWA UTC 1000S:

Functioning

2 € 10,000.00
221082

SHINKAWA Ltd  

UTC-2000 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Gold wire bonder, SHINKAWA UTC 2000:

Functioning

3 € 10,000.00
221083

SHINKAWA Ltd  

UTC-2000S 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Gold wire bonder, SHINKAWA UTC 2000S:

Functioning

1 € 8,000.00
203804
Heraeus Oven & Oven Table 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot ¥ 31,003.00
216483

Nikon  

L200 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

High Power Microscope:

Used for wafer incoming inspection.

1  
216484

Nikon  

L200 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

High Power Microscope:

Used for wafer incoming inspection.

1  
216485

Nikon  

L200 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

High Power Microscope:

Used for wafer incoming inspection.

1  
214949
HMI E SCANLIGHT - EBEAM 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

HMI E SCANLIGHT - EBEAM:

200/300mm Bridge Tool, Last audit health status report available

1  
202596
INGERSOLL RAND heat reactivated regenerative air dryers 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

INGERSOLL RAND heat reactivated regenerative air dryers:

INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846

 

 


LOCATION: Wuxi
1 ¥ 391,740.00
217534
Inliner Machine 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Inliner Machine:
9F587100074770Inliner Machine8500043739;transfer from IFMY; 6JM/00486
9F587100074771fright: Inliner Machine8500043739;transfer from IFMY; 6JM/00486
1  
217557
Inliner Machine 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

Inliner Machine:
9F572100057340Inliner Machine201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
9F572100057341CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
9F572100057342freight : Inliner Machine201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
9F572100058380Inliner Machine201010229;A-10-3040-37-D008-T-07;Inv#6JM/00638

 

2  
212377
INLINER MACHINE,Trim & Form Machine 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

INLINER MACHINE,Trim & Form Machine:
100070530INLINER MACHINE8500035930;transfer asset from IFMY; 6JM/00922
100070531freight: INLINER MACHINE8500035930;transfer asset from IFMY; 04011117
100070532CIQ fee and freight: INLINER MACHINE8500035930;transfer asset from IFMY; 6JM/00922
100047060Trim & Form MachineTransfer MY
100047061Trim & Form Machine0
100047062Cut & Bending ToolTransfer MY
100066520TRIM&FORM MACHINE8500029675;transfer from IFMY;INV# 6JM/00192
100066521customs duty: TRIM&FORM MACHINE8500029675;transfer from IFMY;INV# 6JM/00192
100066522hookup: TRIM&FORM MACHINE8500029675;transfer from IFMY;INV# 6JM/00192

 

3  
221102

BESI  

X-Eye SF160 SL 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

KETECA, X-Eye SF160 SL, A-SFS16FDAL170N2D735, XRAY:

Function , needed motor vacuum to up this machine

1 € 80,000.00
222197

KLA Tencor  

2115 upgraded 2135 

List all items of this typePatterned Wafer Inspection

in Surface Inspection

KLA Tencor 2135:

KLA Tencor 2135 

This one was original a 2115 and experienced a upgrade to a 2135.

 Tool still  in cleanroom under power. The Equipment was under full KLA Service Contract up to now.

 

› Ready for delivery:

5 Weeks after mutual sales contract signature

› Current Condition:

Very good, in Production until now

› Completeness:

Tool complete, no parts missing

› Manufacturing date

May 1997

› Correct maintained?

In KLA Contract until 02/20

› Manuals existing?

YES

› Current location

Cleanroom until 08 2021

› Any upgrades / extensions?

Yes, KLA 2135

› Wafer size (if applicable)?

2x 8 inch

› Was there a significant system failure in the last three years?

No

› Used: 7_24 / 8 hours a working day / for development /rarely?

Used 24/7

› Any contaminations known?

No

 

1   N*
222573

KLA-Tencor  

KLA2365-IS 

List all items of this typePatterned Wafer Inspection

in Surface Inspection

KLA Tencor 2365:

2365 UV/Vis Ultra Broadband Brightfield Patterned Wafer Inspection System

The 2365 system is a generation ultra broadband bright-field patterned wafer inspector designed to meet the need of 90nm and 65nm production. Based on the success from the 235X series, the 2365 product increases the data rate of the proven platform from 800 MPPS to 1600 MPPS. The Equipment is like the 2360 in all respects and incorporates a faster image computer, brighter illuminator and faster sensor to achieve the higher throughputs. All of the valuable 2360 features like: multiple ultra-violet and visible wavelengths, 0.12 pixel, EC, WISE, Region Based Multi Threshold, are still available.

 

Wafer Size and Thickness: 200mm (8”) & 300mm (12”) wafer size and thickness for silicon wafers conforming to SEMI Standard dimensions

Cassette Boat/FOUP Compatibility: Various cassettes and FOUP’s are compatible. Contact WIN Division representative for compatibility.

ILM Compatibility: 2365 v10.0 software is compatible with the following KLA-Tencor Products: Impact ADC Manager v3.5, UDB, Klarity 

Electrical Input: 208 VAC 3 phase WYE nominal With Power Line Conditioner: 208, 240, 380, 416, or 480 VAC

Wafer handling:  Errors < 0.01% (1 in 10,000) of wafers inspected Damage < 0.001% (1 in 100,000) of wafers inspected

Cleanliness: Fed Standard 209E and ISO Class 2 for Dual FIMS handler

SEMI Guideline: The definitions of all reliability specifications are based on SEMI E10-96

Tool Serial ID: W23653234

1   N*
220612

KLA-Tencor  

CS920 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

KLA Tencor Candela CS920:

Defect density inspection for sic  and standard Wafer.

KLA service contract until now.

1  
222539

Brown & Sharpe  

Reflex 454 

List all items of this typeTest & Measurement - Other

in Test & Measurement Equipment

KMG Brown & Sharpe Reflex 454:

Coordinate measuring machine

 

Measuring area 457x508x406mm, additional measure Equipment available (measure head Renishaw MH8 and feeler TP2). Including printer, table, cabinet and documentations.

 

German describtion:

Taktiles Messgerät für Messbereich 457x508x406mm, mit Messzubehör (Messkopf Renishaw MH8 und Messtaster TP2), inkl. Nadeldrucker, inkl. Tischgestell und Unterschrank, inkl. deutsche Dokumentation (Bedienungsanleitung, Installationshandbuch, Software-Handbuch)

1   N*
204631
Lauffer Mold Press  

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 ¥ 2,526,419.44
204582
Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   F*
220811
LH800 Wafer Transfer Machine 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

LH800 Wafer Transfer Machine:

WPL2

LongHill Wafer Packing Machine for 6 and 8 inch Wafer.

1  
220881

TECHNIC Future Autom  

SP1000-1-A2:A2 Plating 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

M0903:Model:SP1000-1-A2:A2 Plating:

Functioning, still active

1 € 400,000.00
219376

Accretech EUROPE Gmb  

MHF 300L 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Manipulater for Accretech:

Manipulator for

Accretech UF200A Prober

 

1  
205912

Matrix Corp  

Matrix X3 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

Matrix X3 X-Ray System:

high speed X-Ray system 

1  
155055

Hitachi  

VP-1500 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

MONOCHROME COPIER:
MONOCHROME COPIER

MONOCHROME COPIER
LOCATION: Malacca
SERIAL NUMBER(S): TA0101513
1 € 2,662.70
209427

Multitest  

MT8589 

List all items of this typeSMD Handlers

in Device Handlers

1   F*
209428

Multitest  

MT8589 

List all items of this typeSMD Handlers

in Device Handlers

1  
147228

Multitest  

MT8502 

List all items of this typeDIP Handlers

in Device Handlers

Multitest MT8502 TriTemp gravity Handler:
Multitest MT8502 TriTemp gravity Handler

Multitest MT8502 TriTemp gravity Handler
LOCATION: MchC
SERIAL NUMBER(S): na
1   F*
207180
Nanofocus µsprint 3d inspection system with Baumann Handler 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

1 € 50,000.00
203189

NexGen Technologies  

Nexgen Prober 2013 Model 

List all items of this typeProbe Equipment - Other

in Wafer Probers

NEXGEN SEMI AUTOMATIC PROBER:

NexGen semi-automatic prober

for 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.

More information available below and on the enclosed flyer :

Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec

ZStage/Chuck 

- Range : 0.200" (other configurations available)

- Speed : 11 ms

Loader (Wafer Handler)

- Cassette capacity : 2 Standard; 1 sender, 1 receiver

- Wafer handling : Belt and vacuum arm

- Fine alignment : CCD Image Processing

- Hard Disk Drive : 60 -250 gig

- Disk Drives : USB, CD/RW, DVD Writer

- Display : 22" Color Screen Monitor

- Power consumption (included) : 1.5 KVA

Facilities Required

- Air : 75 PSI @ 3 CFM

- Vacuum : 25in/hg

- Dimensions 

InchesCm
48"w x 32"d x  60"h115 (L) x 80 (l) x 140 (h)

 - Weight 

LbKg
700317
1  
202453

Nitto Denko  

Nitto MSA840 

List all items of this typeWafer Production Equipment - Other

in Production Equipment

Nitto MSA840 Mounting Machine 10004095:

Nitto MSA840 Mounting Machine

1 € 53,281.00
221088

Orthodyne Electronic  

Orthodyne M7200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Orthodyne Wire Bonder, Orthodyne M7200:

Functioning

2 € 150,000.00
221089

Orthodyne Electronic  

Orthodyne M7200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Orthodyne Wire Bonder, Orthodyne M7200:

Functioning

2 € 200,000.00
221090

Orthodyne Electronic  

Orthodyne M7200 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Orthodyne Wire Bonder, Orthodyne M7200:

Functioning

2 € 200,000.00
192280
Over Head Transport System (OHT) SRC320 

List all items of this typeSemiconductor Facilities Equipment - Other

in Semiconductor Manufacturing Facilities Equipment

Over Head Transport System (OHT) SRC320:



A high quantity of SRC 320 parts.

  • SRC320 Vehicles (~50 pc.)
  • SRC320 SCPS-ZCU
  • SRC320 ICC
  • SRC320 PDU
  • SRC320 Rail parts
  • Foup Handler Stocker

 

 

Please get in touch with the Equipment Trade Category Manager to get more information or price lists.

 

1  
107821

Applied Materials  

P5000 

List all items of this typeAtmospheric Pressure CVD Tools

in Chemical Vapor Deposition Equipment

P5000:

P5000 CVD three chamber Teos tool

P500011 Teos
LOCATION: Villach
SERIAL NUMBER(S): 4571

1 $ 80,000.00
219065

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

P5000 Deposition Tool P500030:

P500030

Teos Prozess

We sell this tool without chambers.

1  
Displaying 1-100 of 166  Page  No Previous Page  Show Next Page


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.