 |
Item ID |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
| Make |
Model |
| |
|
|
|
 |
203808
|
2 SET FICO AMS-11-MR MOLDING |
in ALL CATEGORIES
2 SET FICO AMS-11-MR MOLDING:| FICO AMS-11-MR MOLDING 10005450/10006825 |
|
2
|
lot
|
¥ 8,775,312.00 |
|
|
|
203088
|
2 set of inline tester |
in Automatic Test Equipment
2 set of inline tester:2 set of inline tester asset no:10005027 & 10005029 LOCATION: Wuxi
|
2
|
|
¥ 5,787,004.00 |
 |
|
|
209845
|
200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
|
1
|
|
€ 1,000.00 |
N* |
|
|
203803
|
Shinkawa |
ACB35 |
in Wire Bonders
3 sets of SHINKAWA ACB35 WIRE BOND:SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052
|
3
|
lot
|
¥ 2,443,263.00 |
|
|
|
208756
|
FET/TEST,INC MADE IN |
3600 |
in Device Testers
|
1
|
|
|
F* |
|
|
208757
|
FET/TEST,INC MADE IN |
3602E |
in Device Testers
|
1
|
|
|
|
|
|
173938
|
Aixtron G4 SPARE PARTS |
in ALL CATEGORIES
Aixtron G4 SPARE PARTS:Various spare items for Aixtron G4 (see Excel list attached)
excellent condition
-new/unused-
Location: Villach - Austria
|
1
|
|
|
|
|
|
204578
|
Orbotech |
Ultra Discovery VM |
in Metrology Equipment
AOI Orbotech Ultra Discovery VM:Simple, Intelligent, Powerful Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production. Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time. Benefits - High throughput and superior detection with minimal number of false calls
- Especially designed for inspection of the finest lines down to 10μm
- Quick set-up even for the most complicated jobs for higher productivity
- Automation ready
- Very high uptime
SIP TechnologyTM Push-to-Scan®: - A ‘no set-up’ process
- Top AOI results with minimal effort or training
- The easiest, user-friendly interface (GUI)
- Full ‘Step and Repeat’ functions
Visual Intelligence: Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want. Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects. Visual Intelligence: - Full panel understanding, context-based detection engine
- Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed
|
1
|
|
$ 24,900.00 |
F* |
|
|
208202
|
ASM |
Epsilon 3200 |
in Epitaxial Reactors
ASM Epsilon 3200 (Infineon EPI42):ASM Epsilon 3200 build in 2010 with Asyst Handler Tool in excellent condition Still installed in a cleanroom in our site Villach/Austria. Full inspection possible. Was used with Arsen and will decontaminated before de-Installation. This is one of two available tools Please feel free to arrange an inspection date for both. Infineon internal ID: EPI 42 Please note kindly the ET Item ID: 208202 Sale is offered on condition as and where is
|
1
|
|
|
|
|
|
208203
|
ASM |
Epsilon 3200 |
in Epitaxial Reactors
ASM Epsilon 3200 (Infineon EPI44):ASM Epsilon 3200 build in September 2011 with Spartan handler Tool in excellent condition Still installed in a cleanroom in our site Villach/Austria. Full inspection possible Was used with Arsen and will decontaminated before de-Installation This is one of two available tools Please feel free to arrange an inspection date for both Infineon internal ID: EPI 44 Please note kindly the ET Item ID: 208203 Sale is offered on condition as and where is
|
1
|
|
|
|
|
|
205023
|
Axcelis Technologies |
Fusion PS3 |
in Lithography Equipment
Axcelis Fusion PS3: UV Bake, UV Harden / Photostabalizer With 2 Chambers UV bake.
|
1
|
|
€ 125,000.00 |
|
|
|
204380
|
Infineon |
Bruchless Motor bench |
in Test & Measurement Equipment
Bruchless Motor bench:Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).For more informations please refer to the enclosed diagram and the motor description below. Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)This three-phase motor works with the Kelly controller (described below) • Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts) • Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center. • This is a 4 pole motor (8 magnets). • The Phase to Phase winding resistance is 0.013 Ohms. • The maximum recommended rotor speed is 5000 RPM. • Voltages from 0 to 96 VDC input to the control. • Torque constant of 0.15 Nm per Amp • The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase. • Armature Inertia is 45 Kg Cm Squared. • Continuous current of 125 Amps AC (180 Amps DC into the motor control). • Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control). • Weight of 35 pounds. • Peak Stall Torque of 90 Nm (66 ft). • This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise). Kelly KBL72301,24-72V,300A,BLDC Controller/With RegenKelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control. Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily. Features: • Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency. • Electronic reversing. • Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V. • Current sense on all 3 motor phases.Current control loop. • Hardware over current protection.Hardware over voltage protection. • Support torque mode, speed mode, and balanced mode operation. • Configurable limit for motor current and battery current. • Low EMC.LED fault code. • Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage. • Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal. • Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.
|
1
|
lot
|
|
|
|
|
197661
|
Canon |
FPA-1550 M4-W |
in Wafer Steppers
Canon Stepper Mark4 :with many additional spare parts
|
1
|
|
|
F* |
|
|
166465
|
Oxford Instruments |
CMI 950 |
in Spectrometers
CMI 950 - Xray fluorescence spectrometer:X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc. Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag). System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
|
1
|
|
|
F* |
|
|
207199
|
ASYS |
BC0 01 |
in ALL CATEGORIES
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
|
1
|
|
|
|
|
|
207198
|
ASYS |
TRM02 |
in ALL CATEGORIES
Conveyor ASYS TRM02:Conveyor ASYS TRM02
|
1
|
|
|
|
|
|
204220
|
Cyberscan CT350T Dual non-contact double-sided optical profilometer |
in ALL CATEGORIES
Cyberscan CT350T Dual non-contact double-sided optical profilometer:2 Tools - DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE Tools are still running in production. Available from May/June 2019 Inspection already possible! The tools are pretty new and rarely used. Vintage 2018 and 2015 The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken. Please be invited to take a look at the pictures.
|
2
|
|
|
F* |
|
|
207363
|
Datacon |
2206 amp+ |
in Flip Chip Bonders
DATACON Flip Chip Bonder 2206 amp+:Correct Maintained Complete. No parts missing
|
1
|
|
€ 32,900.00 |
|
|
|
195189
|
Drilling machine bernhard steinel |
in Laboratory Equipment
Drilling machine bernhard steinel:Already damaged loses function, was unable to repair.
LOCATION: Wuxi
|
1
|
|
€ 0.00 |
|
|
|
207727
|
ECA Advance Automati |
EC328FP |
in Device Handlers
|
1
|
|
|
|
|
|
202651
|
Aixtron |
Aixtron AIX2800G4 |
in Epitaxial Reactors
EPI Aixtron G4:With many spare parts.
|
1
|
|
|
|
|
|
209404
|
Applied Materials |
HTF Atmospheric |
in Epitaxial Reactors
EPI Centura HTF:3 Chambers Atmospheric Logitex Wafer Handling Control Cooling Circuit with digital Flowmeters Controlled by PLC Door Interlocks also controlled by PLC Tool in fully production
|
1
|
|
|
F*N* |
|
|
200489
|
ESEC |
ESEC3088 |
in Wire Bonders
ESEC3088 WireBonder 2 sets:ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823 LOCATION: Wuxi
|
2
|
|
|
|
|
|
202692
|
EVG820 Dry Film Lamination System |
in ALL CATEGORIES
EVG820 Dry Film Lamination System:The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.
|
1
|
|
$ 55,000.00 |
|
|
|
206584
|
Fico AMS-11-MR Molding |
in ALL CATEGORIES
Fico AMS-11-MR Molding:| Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 10004762 | Inline VI WorkStation | Transfer AG | CC LINE 21 | VIF-19 | | 10004924 | Fico AMS-11-MR Molding | Transfer AG, PO#200710494 | CC LINE 21 | INF6312182 | | 10005047 | Buffer | 200710495;A-07-3040-37-C017-T-01;IFAG#633451493 | CC LINE 21 | BF-048 | | 10004763 | Inline VI WorkStation | Transfer AG | CC LINE 21 | VIB-19 |
|
4
|
|
¥ 4,052,063.00 |
F* |
|
|
207622
|
FICO AMS-11-MR MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING:| Asset | SNo. | Asset name | Asset name2 | Physical Location | Serial no. | | 10006073 | 0 | FICO AMS-11-MR MOLDING | 201010012;Mal transfer DS line;inv#6JM/00883 | 108 1FASSY | 5133182FC18 |
|
1
|
|
¥ 4,910,590.66 |
|
|
|
207724
|
Iwashita Instruments |
IWASHITA MG Inline 3030 |
in ALL CATEGORIES
|
1
|
|
|
|
|
|
203804
|
Heraeus Oven & Oven Table |
in Wire Bonders
Heraeus Oven & Oven Table:Heraeus Oven & Oven Table | 10002755 Oven | | 10004959 Oven Table |
|
2
|
lot
|
¥ 31,003.00 |
|
|
|
210120
|
Axcelis Technologies |
Axcelis GSD 200E |
in Ion Implantation Equipment
High Currant Implanter HS10:
Axcelis GSD 200E
|
1
|
|
|
N* |
|
|
202596
|
INGERSOLL RAND heat reactivated regenerative air dryers |
in ALL CATEGORIES
INGERSOLL RAND heat reactivated regenerative air dryers:INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846 LOCATION: Wuxi
|
1
|
|
¥ 391,740.00 |
|
|
|
207726
|
Ismeca Europe Semico |
NX32 |
in Device Handlers
|
1
|
|
|
|
|
|
200487
|
Kaeser Compressor |
in Semiconductor Manufacturing Facilities Equipment
|
1
|
|
|
|
|
|
203166
|
ESI |
Model 9350 |
in Laser Based Tools
Laser Cutter ESI 9350:Redundanz activation system
|
1
|
|
|
|
|
|
204631
|
Lauffer Mold Press |
in Semiconductor / Hybrid Assembly Equipment
Lauffer Mold Press :Lauffer Mold Press/100050250 Mold-Die, 5% Mark up from MY/100050251 CURING OVEN/100050260
|
2
|
|
¥ 2,526,419.44 |
|
|
|
204582
|
Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine |
in ALL CATEGORIES
|
1
|
|
|
F* |
|
|
205912
|
Matrix Corp |
Matrix X3 |
in Metrology Equipment
Matrix X3 X-Ray System:high speed X-Ray system
|
1
|
|
|
|
|
|
155055
|
Hitachi |
VP-1500 |
in Laboratory Equipment
MONOCHROME COPIER:MONOCHROME COPIERMONOCHROME COPIERLOCATION: Malacca SERIAL NUMBER(S): TA0101513
|
1
|
|
€ 2,662.70 |
|
|
|
209427
|
Multitest |
MT8589 |
in Device Handlers
|
1
|
|
|
N* |
|
|
209428
|
Multitest |
MT8589 |
in Device Handlers
|
1
|
|
|
F*N* |
|
|
147228
|
Multitest |
MT8502 |
in Device Handlers
Multitest MT8502 TriTemp gravity Handler:Multitest MT8502 TriTemp gravity HandlerMultitest MT8502 TriTemp gravity HandlerLOCATION: MchC SERIAL NUMBER(S): na
|
1
|
|
|
F* |
|
|
198620
|
Nabertherm Furnance |
in ALL CATEGORIES
Nabertherm Furnance:Furnance PLC controlled with touch screen
|
1
|
|
|
|
|
|
207180
|
Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
|
1
|
|
€ 50,000.00 |
F* |
|
|
203189
|
NexGen Technologies |
Nexgen Prober 2013 Model |
in Wafer Probers
NEXGEN SEMI AUTOMATIC PROBER:NexGen semi-automatic proberfor 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.More information available below and on the enclosed flyer : Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec ZStage/Chuck - Range : 0.200" (other configurations available) - Speed : 11 ms Loader (Wafer Handler)- Cassette capacity : 2 Standard; 1 sender, 1 receiver - Wafer handling : Belt and vacuum arm - Fine alignment : CCD Image Processing - Hard Disk Drive : 60 -250 gig - Disk Drives : USB, CD/RW, DVD Writer - Display : 22" Color Screen Monitor - Power consumption (included) : 1.5 KVA Facilities Required- Air : 75 PSI @ 3 CFM - Vacuum : 25in/hg - Dimensions | Inches | Cm | | 48"w x 32"d x 60"h | 115 (L) x 80 (l) x 140 (h) |
- Weight
|
1
|
|
|
|
|
|
202453
|
Nitto Denko |
Nitto MSA840 |
in Production Equipment
Nitto MSA840 Mounting Machine 10004095:Nitto MSA840 Mounting Machine
|
1
|
|
€ 53,281.00 |
|
|
|
192280
|
Over Head Transport System (OHT) SRC320 / SRC300 / LIM |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320 / SRC300 / LIM :
A high quantity of straigths, curves, course taker and other tracks
Please get in touch with the Equipment Trade Commodity Manager to get more information or price lists.
|
1
|
|
|
|
|
|
199832
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
P5000 Deposition Tool:4 Chambers
CVD standard Chambers
SNIT
|
1
|
|
|
|
|
|
199833
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
P5000 Deposition Tool:3 Chambers
A,B and D, CVD universal Chambers
SNIT
|
1
|
|
|
|
|
|
209403
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool :CVD Tool with 4 Chambers
2 Chambers Etch, 2 Chambers CVD
SILAN
|
1
|
|
|
F*N* |
|
|
209423
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500045:4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos
|
1
|
|
|
N* |
|
|
209424
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500046:4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos
|
1
|
|
|
N* |
|
|
209425
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500049:4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos
|
1
|
|
|
N* |
|
|
209426
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500052:3 Chambers
A,B and D, CVD Universal Chambers
SNIT
|
1
|
|
|
F*N* |
|
|
191902
|
Diener |
Diener Tetra 30-LF-PC |
in ALL CATEGORIES
Plasma Clean Machine:LOCATION: MALACCA
|
1
|
|
|
F* |
|
|
204583
|
Process Photonics LaserDrilling/Cutting Tool |
in ALL CATEGORIES
|
1
|
|
|
|
|
|
204584
|
PPI Systems Inc. |
FP-C2 |
in ALL CATEGORIES
|
1
|
|
|
|
|
|
196680
|
Rasco |
SO2000 |
in Device Handlers
Rasco SO2000:Rasco SO2000Specifications- Handling, Inspection, Packing System
- Throughput up to 16,000 ICs/hour
- Index time down to 0.45 s
- Conversion kits for all SO and QFN devices down to 1.5 mm, incl. QFN thin
- Full split kit capability
- Ambient/hot/tri-temp -60°C ... +175°C
- Large variety of contactors: Kelvin, RF, Pogo, ECT, Johnstech, Yamaichi, C-Type
- MEMS applications for magnetic, optical, pressure and acoustic sensors
- Multiple input and output modules:
Tube, bowl (SOT and QFN), metal magazine, bulk, tape and reel - Rasco Vision System: Mark/3D-lead/intape inspection
|
1
|
|
|
F* |
|
|
208138
|
Sanyo |
MDF-U5411 |
in ALL CATEGORIES
|
1
|
|
|
|
|
|
158359
|
Shinkawa |
ACB35 |
in Ball Bonders
|
1
|
|
|
|
|
|
158364
|
Shinkawa |
ACB35 |
in Ball Bonders
|
1
|
|
|
F* |
|
|
207381
|
SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F371 | 10006475 | SHINKAWA ACB35 WIRE BOND | 8500018759;transfer from IFMY;inv# 6JM/00925 | 108 1F ASSY | F0-36534 S23 |
|
1
|
|
¥ 932,760.30 |
|
|
|
204719
|
SHINKAWA ACB35 Wire Bond |
in Wire Bonders
SHINKAWA ACB35 Wire Bond:| 100060530 | SHINKAWA ACB35 Wire Bond | | 100068240 | VISUAL INSPECTION SYSTEM | | 100068241 | hookup: VISUAL INSPECTION SYSTEM | | 100073050 | VISION INSPECTION MACHINE |
|
3
|
|
¥ 1,368,926.41 |
|
|
|
199782
|
Shinkawa |
ACB35 |
in Ball Bonders
SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi
|
4
|
|
|
|
|
|
203821
|
Shinkawa |
ACB400 |
in Wire Bonders
SHINKAWA ACB400 WIRE BOND:SHINKAWA WIRE BOND ACB400 10007322 WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT LOCATION: Wuxi
|
1
|
|
¥ 953,057.50 |
|
|
|
207183
|
Siemens |
Siemens Siplace F4 |
in ALL CATEGORIES
Siemens Siplace F4 pick and place mounter:Siemens Siplace F4 pick and place mounter
|
1
|
|
|
|
|
|
207184
|
Siemens |
Siemens Siplace HS 50 |
in ALL CATEGORIES
Siemens Siplace HS 50 pick and place mounter:Siemens Siplace HS 50 pick and place mounter
|
1
|
|
|
|
|
|
203807
|
SIENMENS Backside Laser Machine |
in ALL CATEGORIES
SIENMENS Backside Laser Machine:| SIENMENS Backside Laser Machine 10004655 |
|
1
|
|
¥ 554,552.00 |
|
|
|
209844
|
Applied Materials |
Centura Polygen |
in Diffusion Furnaces
SiN (Polygen Chamber, AMAT Centura):SiN (Polygen Chamber, AMAT Centura) with 1 complete chamber, but not working do to "water leak detect" - cooling water leak 1 gas cabinet 1 remote cabinet
|
1
|
|
|
N* |
|
|
200885
|
Hanmi Semiconductor |
Sawing & Placement 3800LD |
in ALL CATEGORIES
Singulation Tool ABC development project:
Singulation Tool from Hanmi with disco saw was rarely used for development project ABC
- Excellent Condition (Basically New)
- Complete (no missing parts)
- No Damages
LOCATION: Tijuana Mexico
Process description:
Sawing of substrate and inspection and placement of devices
Features:
- Magazine load and offloading to Jedec tray
- Dual pick & place mechanism
- Dual chuck design and dual spindle, one blade / spindle
- Vision system with reject units sorting function
- Inspection includes (but no limited to): substrate orientation and substrate 2D code reader, device marking quality, broken devices, inked dot, package size X-Y, solder bumps quality Substrate size: 178 x 127 mm (MAXIMUM)
|
1
|
|
$ 185,000.00 |
F* |
|
|
207181
|
EKRA |
E4 |
in ALL CATEGORIES
Solder Paste Printer Ekra E4:Solder Paste Printer Ekra E4
|
1
|
|
|
|
|
|
207182
|
EKRA |
Solder Paste Printer Ekra X5 |
in ALL CATEGORIES
Solder Paste Printer Ekra X5:Solder Paste Printer Ekra X5
|
1
|
|
|
|
|
|
207356
|
SPEA Tester |
in ALL CATEGORIES
SPEA Tester:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F405 | 10004286 | SPEA C320MX Tester | PO 200510501 BNE A-05-3040-41-P005-T-02 | CC FCOS | RAE074CC | | 9F405 | 10004379 | SPEA C320MX Tester | 200610235 a-06-3040-37-c004-a-01 | CC FCOS | RAG087CC | | 9F405 | 10004379 | freight for SPEA comptest 320-MX-32 | 200610235 a-06-3040-37-c004-a-01 | CC FCOS | 0 | | 9F405 | 10004602 | SPEA C320MX Tester | Transfer AG, PO#200710213 | CC FCOS | RAE076CC | | 9F405 | 10004646 | SPEA C320MX Tester | Transfer AG | CC FCOS | RAE077CC |
|
4
|
|
¥ 7,488,255.14 |
|
|
|
208137
|
Hanmi Semiconductor |
SPLITTING SYSTEM |
in ALL CATEGORIES
|
1
|
|
|
|
|
|
202601
|
Teradyne |
J971-61 SML 256CH1TH |
in Device Testers
Teradyne J971:Tool in good condition. Stored in Warehouse. Tool will be released from Infineon for sale by end of 2020.
|
1
|
|
|
|
|
|
209422
|
Terradyne |
CAT-004 |
in Test & Measurement Equipment
Terradyne Catalyst Tester:CAT-004 Catalyst Mixes Signal Tool still continuously running in production After the tester was not in use 2015 (1-yr cold steel), it was refurbished at ATP. For Details please take a look to the pictures
|
1
|
|
|
N* |
|
|
206570
|
TEST EQUIPMENT(QS) OQA related |
in ALL CATEGORIES
TEST EQUIPMENT(QS) OQA related:| Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 10003427 | 4395A-RS/RF TESTER | PO 200210136 BNE 20020006W | 117 1F OQA ROOM | 0 | | 10008752 | ITC55100 Avalanche Tester | 8500065361;6JM/00741 | DS 117 1F OQA | 10113 | | 10006360 | RF/RS 2-TEST EQUIPMENT(QS) (OLD)4195A | 8500013980;transfer line from IFMY;inv#6JM/00859 | 117 1F OQA ROOM | 2904J01823 | | 10006305 | Test Fixture (OLD) | 8500016782;TRANSFER FROM IFMY;inv# 6JM/00494-496 | 117 1F OQA ROOM | DS-TSFP4-CL |
|
4
|
|
¥ 1,661,793.74 |
|
|
|
200892
|
Multitest |
MT2168 |
in ALL CATEGORIES
Test Tool ABC development project:
Test Tool from multitest was rarely used for development project ABC
- Excellent Condition (Basically new) - Complete (no missing parts)
- No Damages
LOCATION: Tijuana Mexico
Description: - Fully testing COOLiR2DIE at high current and voltage presents challenges for a test system and handler > Test team chose the LEMSYS test solution > Tester capability: 2000A/2000V for static and 2000A/1500V for dynamic testing - The handler choice was limited due to the package size and exposed die - Multitest with vertically docked pick & place handlers > A custom manipulator from ESMO was required to provide a working interface on a “headless” LEMSYS tester
|
1
|
|
$ 98,000.00 |
|
|
|
207382
|
TOSOK DBD 3280/3310 Die Bond |
in Eutectic Die Bonders
TOSOK DBD 3280/3310 Die Bond:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F371 | 10005747 | TOSOK DBD3280 Die Bond. | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key1(X-Y wafer holder unit) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key4(loader-unloader) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F375 | 10006006 | TOSOK DBD3310 Die Bond . | 8500008995;Mal transfer DS line;inv# 6JM/00057/65 | 108 1F ASSY | 295 T25 | | 9F375 | 10006006 | Ceramic heater(NRQ00010R) | 8500015375;A-11-3040-37-D030-A-01;inv#EG20110606 | 108 1F ASSY | 295 T25 | | 9F375 | 10005536 | TOSOK DBD3310 Die Bond . | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | | 9F375 | 10005536 | CIQ import inspection charge for TOSOK DBD3310 Die | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | | 9F375 | 10005536 | freight: TOSOK DBD3310 Die Bond 161 T26. | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | | 9F570 | 10006036 | TOSOK DBD3310 DIE BOND | 8500007255;Mal transfer DS line;inv# 6JM/00884 | 108 2F ASSY | 182-T86 |
|
4
|
|
¥ 8,799,723.91 |
|
|
|
192458
|
tosok |
|
in Eutectic Die Bonders
TOSOK DBD3200 Die Bond 161 T38 Training:Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38
|
1
|
|
|
|
|
|
204630
|
TOSOK DBD3310 3280 DIE BOND |
in Eutectic Die Bonders
TOSOK DBD3310 3280 DIE BOND:TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748
|
4
|
|
¥ 6,569,652.00 |
|
|
|
199781
|
tosok |
3310 |
in Epoxy Die Bonders
TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi
|
4
|
|
|
|
|
|
207602
|
TRIM FORM MACHINE |
in Semiconductor / Hybrid Assembly Equipment
TRIM FORM MACHINE:| Asset | Asset name | Asset name2 | Serial no. | | 10007004 | TRIM FORM MACHINE | 8500033677;transfer asset from IFMY; 6JM/00758 | TF-17 |
|
1
|
|
¥ 1,368,171.00 |
|
|
|
180602
|
Ultratech, Inc. |
1500 |
in Wafer Steppers
Ultratech 1500 - Wafer Stepper - 6":Used Ultratech 1500 - 6" Wafer Stepper
|
1
|
|
|
F* |
|
|
207196
|
VacuMit |
EST60 |
in ALL CATEGORIES
Vacuum packing machine VecuMit EST60:Vacuum packing machine VecuMit EST60, without N2 floating
|
1
|
|
|
|
|
|
199806
|
Vision Inspection Machine 2 sets |
in Optical Inspection Equipment
Vision Inspection Machine 2 sets:Vision Inspection Machine 2 setsAsset no. 10006671/7305
LOCATION: Wuxi
|
2
|
|
|
|
|
|
207601
|
Wafer inker machine |
in Semiconductor / Hybrid Assembly Equipment
Wafer inker machine:| Asset | Asset name | Asset name2 | Serial no. | | 10009379 | Wafer Inker Machine | A-17-3040-37-D019-T-01; 8500080345 | 0211-3296 INK-11 | | 10006598 | Wafer inker machine | 8500022900;transfer from IFMY; 6JM/01085 | APR-WX-001 |
|
2
|
|
¥ 1,024,300.00 |
|
|
|
207197
|
Kulicke&Soffa |
Powerfusion |
in ALL CATEGORIES
Wire Bonder K&S Powerfusion Alu Wedge Bonder:Wire Bonder K&S Powerfusion Alu Wedge Bonder
|
1
|
|
|
|
|
|
207362
|
Wire Bonder UTC-3000 |
in Wire Bonders
Wire Bonder UTC-3000:Serial number: 66330 Correct maintained Complete. No parts missing
|
1
|
|
|
|
|
|
203806
|
Yamato NDB-4 CO2 Bubbler |
in ALL CATEGORIES
Yamato NDB-4 CO2 Bubbler :Yamato NDB-4 CO2 Bubbler 10005165
|
1
|
|
¥ 290,277.00 |
|
|
View 
Search-by-Specs
reference document attached
Log in
Group Offers into sub-categories