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Item ID |
Short Description |
Product Type / Details |
#
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Price |
Notes |
| Make |
Model |
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208163
|
Ingenious Equipment |
NA |
in ALL CATEGORIES
100% VI Station:Motorized Indexer for 100%VI Station after Taping + PLC Controller
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1
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208164
|
Ingenious Equipment |
NA |
in ALL CATEGORIES
100% VI Station:Motorized Indexer for 100%VI Station after Taping + PLC Controller
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1
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208165
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Ingenious Equipment |
NA |
in ALL CATEGORIES
100% VI Station:Motorized Indexer for 100%VI Station after Taping + PLC Controller
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1
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212160
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P & P Tech |
NA |
in ALL CATEGORIES
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1
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203088
|
2 set of inline tester |
in Automatic Test Equipment
2 set of inline tester:2 set of inline tester asset no:10005027 & 10005029 LOCATION: Wuxi
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2
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¥ 5,787,004.00 |
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209845
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200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
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1
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€ 1,000.00 |
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203803
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Shinkawa |
ACB35 |
in Wire Bonders
3 sets of SHINKAWA ACB35 WIRE BOND:SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052
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3
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lot
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¥ 2,443,263.00 |
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220089
|
Advantest |
T5371 |
in Device Testers
Advantest T5371 Memory Tester:Brand: Advantest Model: T5371 Serial No.: 310016752 MFG date: Feb’2001 Asset : T-103132 DUT : 32
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1
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219220
|
Applied Materials |
P5000 |
in Production Tools
Amat P5000 CVD Tool:P500051 Tool with 2 Etch Chambers and 2 Teos Chambers
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1
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218746
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
Amat P5000 CVD Tool:P500048 8 inch tool with 4 CVD chambers.
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1
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F* |
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220613
|
Applied Materials |
Semvision 200CX |
in Optical Inspection Equipment
Amat Semvision 200CX:SEM for particle - review inspection.
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1
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204578
|
Orbotech |
Ultra Discovery VM |
in Metrology Equipment
AOI Orbotech Ultra Discovery VM:Simple, Intelligent, Powerful Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production. Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time. Benefits - High throughput and superior detection with minimal number of false calls
- Especially designed for inspection of the finest lines down to 10μm
- Quick set-up even for the most complicated jobs for higher productivity
- Automation ready
- Very high uptime
SIP TechnologyTM Push-to-Scan®: - A ‘no set-up’ process
- Top AOI results with minimal effort or training
- The easiest, user-friendly interface (GUI)
- Full ‘Step and Repeat’ functions
Visual Intelligence: Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want. Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects. Visual Intelligence: - Full panel understanding, context-based detection engine
- Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed
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1
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$ 24,900.00 |
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213293
|
ASM |
Siplace CA4 |
in Flip Chip Bonders
ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20
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1
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221087
|
ASM Technologies |
ASM iHAWK Xpress GoCu |
in ALL CATEGORIES
Au/Cu Wire Bonder, ASM iHAWK Xpress GoCu:Functioning
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1
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€ 50,000.00 |
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221085
|
ASM Technologies |
ASM iHAWK Xtreme |
in ALL CATEGORIES
Au/Cu Wire Bonder, ASM iHAWK Xtreme:Functioning
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2
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€ 35,000.00 |
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221086
|
ASM Technologies |
ASM iHAWK Xtreme |
in ALL CATEGORIES
Au/Cu Wire Bonder, ASM iHAWK Xtreme:Functioning
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2
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€ 35,000.00 |
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221084
|
ASM Technologies |
ASM iHAWK |
in ALL CATEGORIES
Au/Cu Wire Bonder, ASM iHAWK:Wire Bonder:Functioning
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1
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€ 35,000.00 |
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211895
|
P&P TECH |
PP.103 |
in Semiconductor / Hybrid Assembly Equipment
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1
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211896
|
P&P TECH |
PP.103 |
in Semiconductor / Hybrid Assembly Equipment
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1
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216983
|
Automatic wafer sorter model |
in Semiconductor / Hybrid Assembly Equipment
Automatic wafer sorter model:| 10006965 | 0 | Automatic wafer sorter model | 8500024818;A-12-3040-37-D001-A-02 |
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1
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204380
|
Infineon |
Bruchless Motor bench |
in Test & Measurement Equipment
Bruchless Motor bench:Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).For more informations please refer to the enclosed diagram and the motor description below. Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)This three-phase motor works with the Kelly controller (described below) • Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts) • Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center. • This is a 4 pole motor (8 magnets). • The Phase to Phase winding resistance is 0.013 Ohms. • The maximum recommended rotor speed is 5000 RPM. • Voltages from 0 to 96 VDC input to the control. • Torque constant of 0.15 Nm per Amp • The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase. • Armature Inertia is 45 Kg Cm Squared. • Continuous current of 125 Amps AC (180 Amps DC into the motor control). • Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control). • Weight of 35 pounds. • Peak Stall Torque of 90 Nm (66 ft). • This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise). Kelly KBL72301,24-72V,300A,BLDC Controller/With RegenKelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control. Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily. Features: • Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency. • Electronic reversing. • Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V. • Current sense on all 3 motor phases.Current control loop. • Hardware over current protection.Hardware over voltage protection. • Support torque mode, speed mode, and balanced mode operation. • Configurable limit for motor current and battery current. • Low EMC.LED fault code. • Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage. • Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal. • Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.
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1
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lot
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220893
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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220894
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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220895
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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220896
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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222293
|
EDA Malaysia Industr |
SM-24FH |
in Ovens
|
1
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N* |
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222294
|
EDA Malaysia Industr |
SM-24FH |
in Ovens
|
1
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N* |
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220879
|
UCT TECHNOLOGY PTE.L |
UCT-CDWJ-600/800-D2:CHEMICAL DEFLASH SYSTEM |
in ALL CATEGORIES
CD#02:UCT-CDWJ-600/800-D2:CHEMICAL DEFLASH SYSTEM:Conditionally Functioning, require completing some parts (Part list is available)
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1
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166465
|
Oxford Instruments |
CMI 950 |
in Spectrometers
CMI 950 - Xray fluorescence spectrometer:X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc. Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag). System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
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1
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F* |
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217146
|
Silicon Valley Group |
SVG8600 |
in Wafer Cleaners
|
1
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207199
|
ASYS |
BC0 01 |
in ALL CATEGORIES
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
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1
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207198
|
ASYS |
TRM02 |
in ALL CATEGORIES
Conveyor ASYS TRM02:Conveyor ASYS TRM02
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1
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204220
|
Cyberscan CT350T Dual non-contact double-sided optical profilometer |
in ALL CATEGORIES
Cyberscan CT350T Dual non-contact double-sided optical profilometer:2 Tools - DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE Tools are still running in production. Available from May/June 2019 Inspection possible! The tools are pretty new and rarely used. Vintage 2018 and 2015 The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken. Please be invited to take a look at the pictures.
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2
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F* |
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221066
|
BESI Switzerland |
ESEC 2008 xP |
in ALL CATEGORIES
DA_GLUE, 2008xP, ESEC 2008 DIE BONDER:Function
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2
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€ 350,000.00 |
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221286
|
BESI Switzerland |
ESEC 2007 SSI |
in ALL CATEGORIES
DA_Ssi, 2007 SSI Plus, ESEC 2007 DIE BONDER:Function
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1
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221067
|
BESI Switzerland |
ESEC 2007 SSI plus |
in ALL CATEGORIES
DA_Ssi, 2007 SSI Plus, ESEC 2007 DIE BONDER:Function
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2
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€ 200,000.00 |
|
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211696
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
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211698
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
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211699
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
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211697
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
|
1
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195189
|
Drilling machine bernhard steinel |
in Laboratory Equipment
Drilling machine bernhard steinel:Already damaged loses function, was unable to repair.
LOCATION: Wuxi
|
1
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€ 0.00 |
|
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207727
|
ECA Advance Automati |
EC328FP |
in Device Handlers
|
1
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221535
|
ECA ADVANCE AUTOMATI |
EC 328N |
in ALL CATEGORIES
|
1
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€ 50,000.00 |
N* |
|
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219804
|
Ergospeed2 Loadport |
in ALL CATEGORIES
Ergospeed2 Loadport:~5 Years old full functional
|
1
|
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€ 5,999.00 |
|
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213366
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:| ESEC 3088 Wire Bonder | PO5627 | | ESEC 3088 Wire Bonder | PO5627 | | ESEC 3088 Wire Bonder | Transfer AG | | ESEC 3088 Wire Bonder | 200810209;transfer in from IFAG | | ESEC 3088 Wire Bonder | PO NO 200410327 BNE NO 20040009W | | ESEC 3088 Wire Bonder | Transfer AG | | ESEC 3088 wirebonder | 8500043290;transfer from IFAG;661001544 |
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7
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217537
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:9F392100030150ESEC 3088 Wire BonderPO56279F399100039170ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W LOCATION: Wuxi
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2
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200489
|
ESEC |
ESEC3088 |
in Wire Bonders
ESEC3088 WireBonder 2 sets:ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823 LOCATION: Wuxi
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2
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202692
|
EVG820 Dry Film Lamination System |
in ALL CATEGORIES
EVG820 Dry Film Lamination System:The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.
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1
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$ 55,000.00 |
|
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210404
|
Suss MicroTec |
Falcon Polyimid Developer |
in Photoresist Develop Track Systems
Fairchild Developer Ent3C:Developer with 2 chambers for spray developing.
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1
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206584
|
Fico AMS-11-MR Molding |
in ALL CATEGORIES
Fico AMS-11-MR Molding:| Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 10004762 | Inline VI WorkStation | Transfer AG | CC LINE 21 | VIF-19 | | 10004924 | Fico AMS-11-MR Molding | Transfer AG, PO#200710494 | CC LINE 21 | INF6312182 | | 10005047 | Buffer | 200710495;A-07-3040-37-C017-T-01;IFAG#633451493 | CC LINE 21 | BF-048 | | 10004763 | Inline VI WorkStation | Transfer AG | CC LINE 21 | VIB-19 |
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4
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|
¥ 4,052,063.00 |
F* |
|
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207622
|
FICO AMS-11-MR MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING:| Asset | SNo. | Asset name | Asset name2 | Physical Location | Serial no. | | 10006073 | 0 | FICO AMS-11-MR MOLDING | 201010012;Mal transfer DS line;inv#6JM/00883 | 108 1FASSY | 5133182FC18 |
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1
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¥ 4,910,590.66 |
|
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210403
|
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING:| 10005234 | 0 | FICO AMS-11-MR MOLDING | 200810208;IFMAL#6JM/00360;with NBV transferin | | 10005234 | 1 | Fico Mold Die | 201010233;Mal transfer DS line;inv#6JM/00771 | | 10005343 | 0 | FICO AMS-11-MR2 MOLDING | 200810443;transfer in from IFMY | | 10007325 | 1 | FICO MOLD DIE | 8500040046;transfer from IFMY; 6JM/00109 | | 10007325 | 2 | CIQ & Freight: FICO AMS-11-MR2 MOLDING | 8500040046;transfer from IFMY; 6JM/00109 | | 10005732 | 0 | FICO AMS-11-MR MOLDING | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 1 | Fico Mold Die | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 2 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 3 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 4 | SCD80 M2 FICO Molding-upgrade SOT343 | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10007592 | 0 | FICO AMS-11-MR MOLDING | 8500045354;transfer from IFMY; 6JM/00645 | | 10007592 | 1 | Fico Mold Die | 8500045354;transfer from IFMY; 6JM/00645 | | 10007592 | 2 | CURING OVEN | 8500045354;transfer from IFMY; 6JM/00645 | | 10007592 | 3 | CIQ & freight: FICO AMS-11-MR MOLDING | 8500045354;transfer from IFMY; 6JM/00645 |
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4
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221096
|
BESI Holland |
MK-1 |
in ALL CATEGORIES
FICO, Auto Mold System (AMS 24) 2p, MK-1:Functioning
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1
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€ 90,000.00 |
|
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221101
|
BESI Holland |
MK-1 |
in ALL CATEGORIES
FICO, Auto Mold System, MK-1:Function ( MC already 6 months not running) |
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1
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€ 70,000.00 |
|
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221099
|
BESI Netherland |
FCL |
in ALL CATEGORIES
FICO, FCL, FORM SINGULATION(TF2):Functioning
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1
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|
€ 250,000.00 |
|
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221097
|
BESI Netherland |
TFM UF |
in ALL CATEGORIES
FICO, TFM UF, DEGATE DAMBAR CUTTING & ACCESSORY:Functioning
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1
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€ 150,000.00 |
|
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221098
|
BESI Netherland |
TFM UF |
in ALL CATEGORIES
FICO, TFM UF, FORM SINGULATION(TF2):Functioning
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1
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€ 250,000.00 |
|
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207724
|
Iwashita Instruments |
IWASHITA MG Inline 3030 |
in ALL CATEGORIES
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1
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221743
|
Mitutoyo |
QVT1-X606P1L-D |
in Optical Test & Measurement Equipment
For Sale! Mitutoyo CNC Vision Measuring Machine :In use until October 2020, when it was phased out from production. Since then, it's stored in a dry and heated environment. Besides minor marks and scratches caused by trolleys, it's in an excellent condition. It was maintained regularly by site maintenance, and went through yearly inspection by OEM, including calibration. Standard machine, with special adapter plates used at Infineon. It's with software for series production, able to measure multiple modules in row. Saves date to local CSV file format and writing measurement data to Orbit system., Possibility to upgrade tactile measuring function!
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1
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|
€ 55,000.00 |
F*N* |
|
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211897
|
Fuji Seiki |
ECB 10016 |
in ALL CATEGORIES
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1
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218247
|
Bruce (BTI) |
BDF-41 |
in Diffusion Furnaces
Furnance BDF-41 Ofen 29B:Diffusion Furnance for atmospheric oxid processes. Tube 4 is LPCVD
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1
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221078
|
SHINKAWA Ltd |
UTC-1000 |
in ALL CATEGORIES
Gold wire bonder, SHINKAWA UTC 1000:Functioning
|
2
|
|
€ 50,000.00 |
|
|
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221081
|
SHINKAWA Ltd |
UTC-1000 |
in ALL CATEGORIES
Gold wire bonder, SHINKAWA UTC 1000:Functioning
|
2
|
|
€ 50,000.00 |
|
|
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221079
|
SHINKAWA Ltd |
UTC-1000S |
in ALL CATEGORIES
Gold wire bonder, SHINKAWA UTC 1000S:Functioning
|
2
|
|
€ 10,000.00 |
|
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221080
|
SHINKAWA Ltd |
UTC-1000S |
in ALL CATEGORIES
Gold wire bonder, SHINKAWA UTC 1000S:Functioning
|
2
|
|
€ 10,000.00 |
|
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221082
|
SHINKAWA Ltd |
UTC-2000 |
in ALL CATEGORIES
Gold wire bonder, SHINKAWA UTC 2000:Functioning
|
3
|
|
€ 10,000.00 |
|
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|
221083
|
SHINKAWA Ltd |
UTC-2000S |
in ALL CATEGORIES
Gold wire bonder, SHINKAWA UTC 2000S:Functioning
|
1
|
|
€ 8,000.00 |
|
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203804
|
Heraeus Oven & Oven Table |
in Wire Bonders
Heraeus Oven & Oven Table:Heraeus Oven & Oven Table | 10002755 Oven | | 10004959 Oven Table |
|
2
|
lot
|
¥ 31,003.00 |
|
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216483
|
Nikon |
L200 |
in ALL CATEGORIES
High Power Microscope:Used for wafer incoming inspection.
|
1
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216484
|
Nikon |
L200 |
in ALL CATEGORIES
High Power Microscope:Used for wafer incoming inspection.
|
1
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216485
|
Nikon |
L200 |
in ALL CATEGORIES
High Power Microscope:Used for wafer incoming inspection.
|
1
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214949
|
HMI E SCANLIGHT - EBEAM |
in Metrology Equipment
HMI E SCANLIGHT - EBEAM:200/300mm Bridge Tool, Last audit health status report available
|
1
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202596
|
INGERSOLL RAND heat reactivated regenerative air dryers |
in ALL CATEGORIES
INGERSOLL RAND heat reactivated regenerative air dryers:INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846 LOCATION: Wuxi
|
1
|
|
¥ 391,740.00 |
|
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217534
|
Inliner Machine |
in Semiconductor / Hybrid Assembly Equipment
Inliner Machine:| 9F587 | 10007477 | 0 | Inliner Machine | 8500043739;transfer from IFMY; 6JM/00486 | | 9F587 | 10007477 | 1 | fright: Inliner Machine | 8500043739;transfer from IFMY; 6JM/00486 |
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1
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217557
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Inliner Machine |
in Automatic Test Equipment
Inliner Machine:| 9F572 | 10005734 | 0 | Inliner Machine | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 9F572 | 10005734 | 1 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 9F572 | 10005734 | 2 | freight : Inliner Machine | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 9F572 | 10005838 | 0 | Inliner Machine | 201010229;A-10-3040-37-D008-T-07;Inv#6JM/00638 |
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212377
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INLINER MACHINE,Trim & Form Machine |
in Automatic Test Equipment
INLINER MACHINE,Trim & Form Machine:| 10007053 | 0 | INLINER MACHINE | 8500035930;transfer asset from IFMY; 6JM/00922 | | 10007053 | 1 | freight: INLINER MACHINE | 8500035930;transfer asset from IFMY; 04011117 | | 10007053 | 2 | CIQ fee and freight: INLINER MACHINE | 8500035930;transfer asset from IFMY; 6JM/00922 | | 10004706 | 0 | Trim & Form Machine | Transfer MY | | 10004706 | 1 | Trim & Form Machine | 0 | | 10004706 | 2 | Cut & Bending Tool | Transfer MY | | 10006652 | 0 | TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 | | 10006652 | 1 | customs duty: TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 | | 10006652 | 2 | hookup: TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 |
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3
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221102
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BESI |
X-Eye SF160 SL |
in ALL CATEGORIES
KETECA, X-Eye SF160 SL, A-SFS16FDAL170N2D735, XRAY:Function , needed motor vacuum to up this machine |
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1
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€ 80,000.00 |
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222197
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KLA Tencor |
2115 upgraded 2135 |
in Surface Inspection
KLA Tencor 2135:KLA Tencor 2135 This one was original a 2115 and experienced a upgrade to a 2135. Tool still in cleanroom under power. The Equipment was under full KLA Service Contract up to now. › Ready for delivery: 5 Weeks after mutual sales contract signature › Current Condition: Very good, in Production until now › Completeness: Tool complete, no parts missing › Manufacturing date May 1997 › Correct maintained? In KLA Contract until 02/20 › Manuals existing? YES › Current location Cleanroom until 08 2021 › Any upgrades / extensions? Yes, KLA 2135 › Wafer size (if applicable)? 2x 8 inch › Was there a significant system failure in the last three years? No › Used: 7_24 / 8 hours a working day / for development /rarely? Used 24/7 › Any contaminations known? No
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N* |
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222573
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KLA-Tencor |
KLA2365-IS |
in Surface Inspection
KLA Tencor 2365:2365 UV/Vis Ultra Broadband Brightfield Patterned Wafer Inspection System The 2365 system is a generation ultra broadband bright-field patterned wafer inspector designed to meet the need of 90nm and 65nm production. Based on the success from the 235X series, the 2365 product increases the data rate of the proven platform from 800 MPPS to 1600 MPPS. The Equipment is like the 2360 in all respects and incorporates a faster image computer, brighter illuminator and faster sensor to achieve the higher throughputs. All of the valuable 2360 features like: multiple ultra-violet and visible wavelengths, 0.12 pixel, EC, WISE, Region Based Multi Threshold, are still available. Wafer Size and Thickness: 200mm (8”) & 300mm (12”) wafer size and thickness for silicon wafers conforming to SEMI Standard dimensions Cassette Boat/FOUP Compatibility: Various cassettes and FOUP’s are compatible. Contact WIN Division representative for compatibility. ILM Compatibility: 2365 v10.0 software is compatible with the following KLA-Tencor Products: Impact ADC Manager v3.5, UDB, Klarity Electrical Input: 208 VAC 3 phase WYE nominal With Power Line Conditioner: 208, 240, 380, 416, or 480 VAC Wafer handling: Errors < 0.01% (1 in 10,000) of wafers inspected Damage < 0.001% (1 in 100,000) of wafers inspected Cleanliness: Fed Standard 209E and ISO Class 2 for Dual FIMS handler SEMI Guideline: The definitions of all reliability specifications are based on SEMI E10-96 Tool Serial ID: W23653234
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N* |
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220612
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KLA-Tencor |
CS920 |
in Optical Inspection Equipment
KLA Tencor Candela CS920:Defect density inspection for sic and standard Wafer. KLA service contract until now.
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1
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222539
|
Brown & Sharpe |
Reflex 454 |
in Test & Measurement Equipment
KMG Brown & Sharpe Reflex 454:Coordinate measuring machine Measuring area 457x508x406mm, additional measure Equipment available (measure head Renishaw MH8 and feeler TP2). Including printer, table, cabinet and documentations. German describtion: Taktiles Messgerät für Messbereich 457x508x406mm, mit Messzubehör (Messkopf Renishaw MH8 und Messtaster TP2), inkl. Nadeldrucker, inkl. Tischgestell und Unterschrank, inkl. deutsche Dokumentation (Bedienungsanleitung, Installationshandbuch, Software-Handbuch)
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1
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N* |
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204631
|
Lauffer Mold Press |
in Semiconductor / Hybrid Assembly Equipment
Lauffer Mold Press :Lauffer Mold Press/100050250 Mold-Die, 5% Mark up from MY/100050251 CURING OVEN/100050260
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2
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¥ 2,526,419.44 |
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204582
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Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine |
in ALL CATEGORIES
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1
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F* |
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220811
|
LH800 Wafer Transfer Machine |
in ALL CATEGORIES
LH800 Wafer Transfer Machine:WPL2 LongHill Wafer Packing Machine for 6 and 8 inch Wafer.
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1
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220881
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TECHNIC Future Autom |
SP1000-1-A2:A2 Plating |
in ALL CATEGORIES
M0903:Model:SP1000-1-A2:A2 Plating:Functioning, still active
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1
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€ 400,000.00 |
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219376
|
Accretech EUROPE Gmb |
MHF 300L |
in Wafer Probers
Manipulater for Accretech:Manipulator for Accretech UF200A Prober
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1
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205912
|
Matrix Corp |
Matrix X3 |
in Metrology Equipment
Matrix X3 X-Ray System:high speed X-Ray system
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1
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155055
|
Hitachi |
VP-1500 |
in Laboratory Equipment
MONOCHROME COPIER:MONOCHROME COPIERMONOCHROME COPIERLOCATION: Malacca SERIAL NUMBER(S): TA0101513
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1
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€ 2,662.70 |
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209427
|
Multitest |
MT8589 |
in Device Handlers
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1
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F* |
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209428
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Multitest |
MT8589 |
in Device Handlers
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1
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147228
|
Multitest |
MT8502 |
in Device Handlers
Multitest MT8502 TriTemp gravity Handler:Multitest MT8502 TriTemp gravity HandlerMultitest MT8502 TriTemp gravity HandlerLOCATION: MchC SERIAL NUMBER(S): na
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1
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F* |
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207180
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Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
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1
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€ 50,000.00 |
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203189
|
NexGen Technologies |
Nexgen Prober 2013 Model |
in Wafer Probers
NEXGEN SEMI AUTOMATIC PROBER:NexGen semi-automatic proberfor 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.More information available below and on the enclosed flyer : Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec ZStage/Chuck - Range : 0.200" (other configurations available) - Speed : 11 ms Loader (Wafer Handler)- Cassette capacity : 2 Standard; 1 sender, 1 receiver - Wafer handling : Belt and vacuum arm - Fine alignment : CCD Image Processing - Hard Disk Drive : 60 -250 gig - Disk Drives : USB, CD/RW, DVD Writer - Display : 22" Color Screen Monitor - Power consumption (included) : 1.5 KVA Facilities Required- Air : 75 PSI @ 3 CFM - Vacuum : 25in/hg - Dimensions | Inches | Cm | | 48"w x 32"d x 60"h | 115 (L) x 80 (l) x 140 (h) |
- Weight
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202453
|
Nitto Denko |
Nitto MSA840 |
in Production Equipment
Nitto MSA840 Mounting Machine 10004095:Nitto MSA840 Mounting Machine
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1
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€ 53,281.00 |
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221088
|
Orthodyne Electronic |
Orthodyne M7200 |
in ALL CATEGORIES
Orthodyne Wire Bonder, Orthodyne M7200:Functioning
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2
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€ 150,000.00 |
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221089
|
Orthodyne Electronic |
Orthodyne M7200 |
in ALL CATEGORIES
Orthodyne Wire Bonder, Orthodyne M7200:Functioning
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2
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€ 200,000.00 |
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221090
|
Orthodyne Electronic |
Orthodyne M7200 |
in ALL CATEGORIES
Orthodyne Wire Bonder, Orthodyne M7200:Functioning
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2
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€ 200,000.00 |
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192280
|
Over Head Transport System (OHT) SRC320 |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320:
A high quantity of SRC 320 parts.
- SRC320 Vehicles (~50 pc.)
- SRC320 SCPS-ZCU
- SRC320 ICC
- SRC320 PDU
- SRC320 Rail parts
- Foup Handler Stocker
Please get in touch with the Equipment Trade Category Manager to get more information or price lists.
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1
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107821
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
P5000:P5000 CVD three chamber Teos tool
P500011 Teos
LOCATION: Villach
SERIAL NUMBER(S): 4571
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1
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$ 80,000.00 |
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219065
|
Applied Materials |
P5000 |
in Production Tools
P5000 Deposition Tool P500030:P500030 Teos Prozess We sell this tool without chambers.
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1
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