 |
Item ID |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
| Make |
Model |
| |
|
|
|
 |
255419
|
ESEC |
2007 ESEC |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacture | | 205940 | 2007 | ESEC |
|
1
|
|
|
|
|
|
255584
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacturer | | 208424 | 2007 | ESEC |
|
1
|
|
|
|
|
|
255585
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacturer | | 2007 | ESEC |
|
1
|
|
|
|
|
|
255586
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacturer | | 204882 | 2007 | ESEC |
|
1
|
|
|
|
|
|
255587
|
ESEC |
2007 |
in Flip Chip Bonders
|
1
|
|
|
|
|
|
255588
|
ESEC |
2007 |
in Flip Chip Bonders
|
1
|
|
|
|
|
|
256626
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:2007 ESEC Die Bonder
|
1
|
|
|
|
|
|
209845
|
200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
|
1
|
|
|
|
|
|
255416
|
fujiwa |
250-70 |
in Semiconductor / Hybrid Assembly Equipment
250-70 FUJIWA / Mold Press:| Serial Number | Model | Manufacturer | | 2534 | 250-70 | FUJIWA |
|
1
|
|
|
|
|
|
257348
|
AMAT |
DXZ/CXZ Chamber |
in Production Tools
3 DXZ/CXZ Chambers for Centura/P5000:3 DXZ/CXZ Chambers for Centura/P5000
Mainframe is transport rack
|
1
|
|
|
|
|
|
256653
|
Orthodyne |
360C |
in Wire Bonders
360C ORTHODYNE WIRE BONDER:360C ORTHODYNE WIRE BONDER
|
1
|
|
|
|
|
|
255589
|
Orthodyne |
360C |
in Wire Bonders
360C ORTHODYNE Wire Bonder:360C ORTHODYNE Wire Bonder
|
1
|
|
|
|
|
|
256655
|
hull |
4216LP-D |
in Semiconductor / Hybrid Assembly Equipment
4216LP-D HULL_FINMAC DEFLASH:4216LP-D HULL_FINMAC DEFLASH
|
1
|
|
|
|
|
|
257112
|
Tesec |
4330IH |
in Wafer Testers
4330IH TESEC HOT & COLD TEST:4330IH TESEC HOT & COLD TEST
|
1
|
|
|
|
|
|
257113
|
Tesec |
4330IH |
in Wafer Testers
4330IH TESEC HOT & COLD TEST:4330IH TESEC HOT & COLD TEST
|
1
|
|
|
|
|
|
236797
|
ACB35 scrap |
in Other Semiconductor
ACB35 scrap:S128-S131 machine Fix Asset scrap, based on OPC scrap plan,UTC5100 replace ACB35 machine
|
4
|
|
|
|
|
|
254741
|
Veeco |
AFM-2 (METV44-1) |
in Wafer Manufacturing Metrology Equipment
AFM-2 (METV44-1) :Atomic Force Microscope (AFM)
An Atomic Force Microscope (AFM) measures topography, feature size, defects, and properties of solid surfaces. The Dimension X AFM provides depth metrology solutions.
|
1
|
|
|
|
|
|
256339
|
Varian |
|
in Ion Implantation Equipment
Amat E500:-Back end medium current Implanter - 100002956
|
1
|
|
|
|
|
|
259241
|
AMAT |
Back end Implanter Amat E500 |
in Ion Implantation Equipment
AMAT E500:| › Original Equipment Manufacturer? (Yes/No, if no please state the details ) | Yes | | › Exact Model Type? (Yes/No, if no please state the details ) | E500 EHP | | › OEM Serial ID? | ES193741 U2 | | › Completeness: Total/partial/Donor tool? Please list missing parts. | Total | | › Date of first usage? | NA | | › Technic special customized for Infineon? | NA | | › Correct maintained? | Yes | | › Any damages/deficits known? | No | | › Manuals existing? | No | | › Crated: If yes…/ professional with protocol / partly / simple? | No | | › Detailed Configuration/Specification of the tool | | | › Any upgrades / extensions? | Thin Wafer handling kit, Hydrogen implant, LX upgrade, Windown 7 OS | | › Useable for which products? | 8" Thin Taiko wafers | | › Wafer size (if applicable)? | 200mm | | › Any consumables at end of lifetime? | Yes (source, electrode) | | › Procured from OEM or from second hand? | From IR Singapore | | › Any refurbishments done? | No | | › Any doubts that the tool is failure free useable for the next three years? | Yes | | › Was there a significant system failure in the last three years? | No | | › Any contaminations known? | BF3, H2 | | › IFX inventory | 200016809 | | location | INFINEON KULIM FAB 2 LEVEL 3 PRODUCTION AREA CLEANROOM |
|
1
|
|
|
|
|
|
261956
|
Applied Materials |
Endura |
in Physical Vapor Deposition Equipment
AMAT Endura-Copper Chamber:no ESC, no PSUs, No Evs, no MFS´s, No whole lower assambly where the ESC is installed beside this complete
|
1
|
|
|
|
|
|
261957
|
Applied Materials |
Endura |
in Physical Vapor Deposition Equipment
AMAT Endura-Copper Chamber:no Chuck, no PSUs, No Evs beside this complete
|
1
|
|
|
|
|
|
265543
|
Applied Materials |
Centura HDP |
in Production Tools
AMAT HDP Centura (#615):Software: Win 10 OR 4000 WTM Controller 3x ENI Generator Racks Chiller INR-498-011D 2x Remote Monitor High Density Plasma Process; Process Chambers: A,B,C; Orienter chamber F Software: Win 10 OR 4000 WTM Controller 3x ENI Generator Racks, Chiller INR-498-011D 2x Remote Monitor High Density Plasma Process Process Chambers: A,B,C Orienter chamber F System: 1x Mainframe 3x process chamber 1x Controller Rack 1x Chiller 3x ENI Generator Racks (Converted to separate water supply each Generator) 1x Controller Rack x Chiller 3x ENI Generator Racks (Converted to separate water supply each Generator) AMAT Vita/Delphin Controller Tool will be sold without Software
|
1
|
|
|
N* |
|
|
265095
|
Applied Materials |
P5000 XT |
in Cluster Plasma Tools
AMAT P5000 XT (Poly - Trench):The tool offered is already in storage. The three images are from an identical system that is still in operation. The tool in storage was dismantled correctly and is stored optimally.The tool offered is already in storage. The three images are from an identical system that is still in operation. The tool in storage was dismantled correctly and is stored optimally. Tool facts: Applied Material P5000XT -top mount elektronics and He backing -2 Chamber Narrow Gap tool -installed pos. Chamber A/B -Standard Phase 3 Robot -15 slot storage elevator -ZA Slit Valves pos. A/B -Wafer Positioning Sensor (WPS) -Cassette loadport with 2 stages -2 Monitor -System SSD -CF card Floppy emulator -MXP Unibody chamber with Narrow Gap lid -Turbo Seiki STP-301CVB -Controller Seiki SCU-350D -MKS Manometer -7 Gas Sticks / Brooks GF 100 MFCs -Gas: Hbr, NF3, NF3-2, N2, He/O2, Ar, CF4 -2x AMAT 1 heat exchanger / Stainless Steel hoses (50ft) -2x ENI OEM 12B RF generators -AC Box at RF Rack
|
1
|
|
|
N* |
|
|
255422
|
Hewlett Packard |
AOT |
in Wafer Testers
AOT3 Bundle :-Tester AOT, Bundle sale preferred | AOT3-06 | AOT3-07 | AOT3-08 | AOT3-20 | | 3444A40234 | 3607A40332 | 3527A40287 | 30451 |
| AOT3-29 | AOT3-33 | AOT3-36 | AOT3-38 | | 30705 | 37978 | 40117 | 40128 |
|
8
|
lot
|
|
|
|
|
255502
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Advance - OFENV06C:ASM Furnace Vertical - Advance 400 2 Reactors atmospheric
|
1
|
|
|
|
|
|
255501
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Vertical - OFENV05C:ASM Furnace Vertical - Advance 400 2 Reactor atmospheric Robot defect and need service
|
1
|
|
|
|
|
|
255504
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Vertical OFENV07C:ASM Furnace Vertical 2 Reactor atmospheric Reactor 1 is missing heater cassette, Motor driver, Board and loader arm
|
1
|
|
|
|
|
|
264463
|
ASML |
AT1250 |
in Lithography Equipment
ASML-AT1250 DUV193nm:Equipment according the age in good in good shape, however only one wafer stage is currently working 2003: "ASML's new generation TWINSCAN system patterns for 65 nm node" Equipment inspection virtual or physical possible
|
1
|
|
|
|
|
|
262655
|
DNS |
SS-80BWAR |
in Wafer Cleaners
Automated WET Benches – DNS Wet Station:DNS NANOSPRAY
|
1
|
|
|
|
|
|
252684
|
AXCELIS NV8200P |
in Ion Implantation Equipment
AXCELIS NV8200P:-MCINV8201 › Original Equipment Manufacturer? Axcelis › Exact Model Type? AXCELIS MEDIUM CURRENT NV8200 › OEM Serial ID? › Current Condition: Excellent/Very good/Good/poor/Very poor : Good. Just is the tool already cold steel. Power cut off to the tool. › Completeness: Total/partial/Donor tool? Please list missing parts. 95 percent complete. Only few items were taken example the turbo pump controllers. › Manufacturing date of the Equipment ? › Date of first usage? 2006 › Technic special customized for Infineon? We don’t use water cool for the platen. › Correct maintained? Yes. › Any damages/deficits known? No › Manuals existing? Yes. › Crated: If yes…/ professional with protocol / partly / simple? Not yet crated. Tool still not dissembled. › Any upgrades / extensions? No. › Useable for which products? 8 inch product › Wafer size (if applicable)? 8 inch › Any consumables at end of lifetime? Yes. Few pars already end of lifetime as per Manufacturer. › Procured from OEM or from second hand? Second hand. › Any refurbishments done? No. › Any doubts that the tool is failure free useable for the next three years? No. › Was there a significant system failure in the last three years? No. › Any contaminations known? No › IFX Inventory number? 100000605
|
1
|
|
|
|
|
|
252685
|
AXCELIS NV8200P |
in Ion Implantation Equipment
AXCELIS NV8200P:MCINV8202 › Original Equipment Manufacturer? Axcelis › Exact Model Type? AXCELIS MEDIUM CURRENT NV8200 › A pictures say more as 1.000 words. Any pictures available? Please provide as much as possible. › Current Condition: Excellent/Very good/Good/poor/Very poor : Good. Just is the tool already cold steel. Power cut off to the tool. › Completeness: Total/partial/Donor tool? Please list missing parts. 95 percent complete. Only few items were taken example the turbo pump controllers. › Date of first usage? 2006 › Technic special customized for Infineon? We don’t use water cool for the platen. › Correct maintained? Yes. › Any damages/deficits known? No › Manuals existing? Yes. › Crated: If yes…/ professional with protocol / partly / simple? Not yet crated. Tool still not dissembled. › Any upgrades / extensions? No. › Useable for which products? 8 inch product › Wafer size (if applicable)? 8 inch › Any consumables at end of lifetime? Yes. Few pars already end of lifetime as per Manufacturer. › Procured from OEM or from second hand? Second hand. › Any refurbishments done? No. › Any doubts that the tool is failure free useable for the next three years? No. › Was there a significant system failure in the last three years? No. › Any contaminations known? No › IFX Inventory number? 100001850
|
1
|
|
|
|
|
|
256469
|
Axcelis/Eaton |
NV8250HT |
in Ion Implantation Equipment
Axcelis NV8250HT #941:| Equipment Konfiguration: | | | Type: | NV8250HT | | Energy Config: | 0 - 250Kv Midcurrent | | Serialnumber: | 908 | | Build Year: | 2002 | | Date of first usage: | buyed new from vendor | | Current Condition: | Good | | CE-Conformity: | Yes | | Location: | greyroom | | Voltage: | 208V | | Cryo-Pumps: | 3x CTI/Edwards Onboard: OB-8 | | Cryo-Kompressor: | CTI 9650 Low-Voltage | | Turbo-Pumps: | Seiko/Edwards: STP1003C, STP-301C, STP-1003C | | Rough-Pumps: | Edwards: without QDP40, not included | | Endstation Rough-Pump: | not included | | Wafersize: | 8inch(200mm) | | Clamp-Type: | E-Chuck green with Non-µC Controller | | Wafer-Cooling: | Galden HT110 with Affinity PWC-020K-BE35CBD2 (R507) (condition unclear) | | Gasbox: | Modular 5-String, 4x 2,0L Size | | String1: | Argon Carriergas; MFC Unit-1662 2sccm BF3 | | String2: | BF3 SDS-Low-Pressure Type VCR 1/4"; MFC Unit-1662 2sccm BF3 | | String3: | condition unclear, Type VCR 1/4" MFC Unit-1662 2sccm BF3 | | String4: | AsH3 SDS-Low-Pressure Type VCR 1/2"; MFC Unit-1662 2sccm BF3 | | String5: | PH3 SDS-Low-Pressure Type VCR 1/2"; MFC Unit-1662 2sccm BF3 | | Beam-Profiler Type: | Belt-Drive | | Gear-Type's: | Scan: Planetary Tilt: Planetary | | Source-Type: | ELS4 IHC-Source without Vaporizer | | HV-Transformer: | Silicon-Oil | | Light-Tower: | red/yellow/green; no buzzer | | Main-Workstation | Solaris SUN AXI 4HE PH: 200978 | | Second-Workstation | Solaris SUN Sparc5 | | Software-Version: | 5.1.4.1 | | Network: | 24port 100MB Ethernet with Cisco Router-Kit | | Cell-Controller: | 177 Type | | Notes: | Upper-Rack Panel missing | | | Clean-Room Table missing on frontside | | | all 4 wheels on oil-isolation transformer are broken | | | Minor modifications on tool | | | No Manual-Set/ no Spares include | | | tool was used 24/7 full in production between 15 and 230kv Energy | | | If required, tool can be inspected on site, but no Power |
|
1
|
|
|
|
|
|
250598
|
Axcelis Technologies |
OPTIMA_HD |
in Ion Implantation Equipment
|
1
|
|
|
|
|
|
254465
|
Brooks EEPC Transponder RS232/Ethernet |
in Other Semiconductor
Brooks EEPC Transponder RS232/Ethernet:Brooks EEPC Transponder frequency: 13.56MHz TR5: 500mA (T) Interface: 1200 Bd - 57600 Bd Protocol: ASCII/SSEC/HSMS Protection: IP40 Impedance: 50 Ohm Interface: 10/100BaseT
|
152
|
|
|
|
|
|
256654
|
hull |
BT4216LP |
in Semiconductor / Hybrid Assembly Equipment
BT4216LP HULL_FINMAC DEFLASH:BT4216LP HULL_FINMAC DEFLASH
|
1
|
|
|
|
|
|
236798
|
Buffer controller LS19 scrap |
in Other Semiconductor
Buffer controller LS19 scrap:LINKING BUFFER SYSTEM LS19 scrap together with S128-S131 machine Fix Asset
|
1
|
|
|
|
|
|
241354
|
EDA Industries (Asia |
SM-24 FH150C |
in Other Semiconductor
Burn In Oven System:Burn In Oven System
|
1
|
|
|
|
|
|
244542
|
EDA Industries (Asia |
SM 24 FH 150 |
in Other Semiconductor
Burn In Oven System:Burn In Oven System
|
1
|
|
|
|
|
|
259153
|
Canon |
CAI519 |
in Production Equipment
CAI519 Canon FPA 3000 i5+:Canon FPA 3000 i5+ General Configuration: - FPA 3000 - i5(+)
- Manufactured in June / 1997
- 8“ Wafer Chuck, Notch PA unit
- 6“ Nikon-type Reticle Changer
- Reticle Barcode-Reader = yes
- Cassette Barcode Reader = yes
- Pellicle Particle Checker = yes
- Online - ESPA = yes
- Interface type: right
- Standard flys eye lens
- Chamber type: CD80
|
1
|
|
|
|
|
|
265101
|
Canon |
FPA-3000EX5 |
in Exposure Tools
CANON - FPA-3000EX5 - DUV-Stepper:no missing parts, no damage
|
1
|
|
|
N* |
|
|
259649
|
Canon |
5500iz |
in Lithography Equipment
CANON 5500iZ - Stepper:'- 12" Standard Wafer Chuck and 12" wafer handling system
- SMIF type reticle loading ports and reticle changer unit
- Pellicle Particle checker installed - Hg-lamp will be rmoved prior shipping
- Coolant will be removed prior shipping
- all batteries will be removed prior shipping
|
1
|
|
|
|
|
|
255826
|
CDE |
CDE80/2 Plasma Etch |
in Production Equipment
CDE80/2 Plasma Etch:The system was in production until February 2025.
|
1
|
|
|
|
|
|
255825
|
CDE |
CDE80/3 Plasma Etch |
in Production Equipment
CDE80/3 Plasma Etch:The system was in production until February 2025.
|
1
|
|
|
|
|
|
252763
|
INGERSOLL-RAND AIR |
2CV26MX3 |
in Other Semiconductor
Centrifugal Compressor:Centrifugal Compressor 11-1 & 11-2 320008009463
|
2
|
|
|
|
|
|
250877
|
CeraCon GmbH |
CeraTHERM stack M |
in Other Semiconductor
CeraCon Ofen CeraTHERM stack M:
|
1
|
|
|
|
|
|
257675
|
Canon |
LITVC1-02 |
in Production Equipment
Cluster Tool: Canon FPA- 5500iZ:300mm + LITVC1-02 Sale without Clean track Act12 possible. Can be seperated.
|
1
|
|
|
|
|
|
207199
|
ASYS |
BC0 01 |
in Other Semiconductor
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
|
1
|
|
|
|
|
|
207200
|
ASYS |
BC0 02 |
in Other Semiconductor
Conveyor ASYS BC0 02:Conveyor ASYS BC0 02
|
1
|
|
|
|
|
|
207198
|
ASYS |
TRM02 |
in Other Semiconductor
Conveyor ASYS TRM02:Conveyor ASYS TRM02
|
1
|
|
|
|
|
|
261033
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261032
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261024
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261023
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261025
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261029
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261031
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261030
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261028
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261027
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
261026
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
|
|
|
257576
|
DEK International Gm |
DEK_HORIZON-OZI |
in Other Semiconductor
DEK PRESOLDER DEK_HORIZON-OZI:DEK PRESOLDER DEK_HORIZON-OZI
|
1
|
|
|
|
|
|
254729
|
Yushin |
Demount - 7 |
in Production Equipment
|
1
|
|
|
|
|
|
255039
|
Yushin |
Demount-2 |
in Production Equipment
|
1
|
|
|
|
|
|
257579
|
Despatch |
DESPATCH_LCC-14NV-2 |
in Ovens
DESPATCH EPOXY-CURE DESPATCH_LCC-14NV-2:DESPATCH EPOXY-CURE DESPATCH_LCC-14NV-2
|
1
|
|
|
|
|
|
257580
|
Despatch |
DESPATCH_LCD2-14NV-3 |
in Ovens
DESPATCH EPOXY-CURE DESPATCH_LCD2-14NV-3:DESPATCH EPOXY-CURE DESPATCH_LCD2-14NV-3
|
1
|
|
|
|
|
|
257574
|
Despatch |
DESPATCH_LCD2-14N-5 |
in Ovens
DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5:DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5
|
1
|
|
|
|
|
|
257575
|
Despatch |
DESPATCH_LV2N |
in Ovens
DESPATCH PASSIVATION-DRY DESPATCH_LV2N:DESPATCH PASSIVATION-DRY DESPATCH_LV2NDESPATCH PASSIVATION-DRY DESPATCH_LV2N
|
1
|
|
|
|
|
|
256665
|
Mitutoyo |
|
in Test & Measurement Equipment
Dial gauge:Measure wafer/tape thickness. Location is at Infineon Penang.
|
2
|
|
|
|
|
|
256629
|
Soft View Technology |
SVDS |
in Semiconductor / Hybrid Assembly Equipment
Die Sorter (Pick & Place):Transferring die from sawn wafer (mounted frame) to die plate or tape and reel. Location is at Infineon Penang.
|
1
|
|
|
|
|
|
239777
|
Hiller GmbH |
DP484/11012/FD HILLER DECAPRESS DP |
in Other Semiconductor
DP484/11012/FD HILLER DECAPRESS DP: - Technic special customized for Infineon? no
- Any damages/deficits known? no
- Manuals existing? yes
- Last time in production/function? 2022
- Any upgrades / extensions? no
- Any consumables at end of lifetime? not known
- Any refurbishments done? no
- Was there a significant system failure in the last three years? no
- Used: only for test
- Any contaminations known? Siliciumdioxid
|
1
|
|
|
|
|
|
256632
|
Exclusive Master |
DRIR 2000 |
in Optical Inspection Equipment
DRIR 2000:Die level inspection on tape & reel. Location at Infineon Penang.
|
1
|
|
|
|
|
|
247751
|
Driverless transport system |
in Other Semiconductor
Driverless transport system:Manufacturer: ATAP-IHC, Model: CX-01 Manufacturing date: Jul 05 Condition: good, complete, no damages Sales incl. reflectors and spare package Dimensions 1,2x0,6x0,5m Weight: 192 kg Anschluss: 230V-L1-N-PE Strom:16A Sicherung: C16A Nutzlast: 90kg
|
2
|
|
|
|
|
|
236443
|
DS-TEST 3sets X-Ray Machine scrap |
in Other Semiconductor
DS-TEST 3sets X-Ray Machine scrap:Based on VRFC2212 scraped plan, these machines already shortage for key parts and cannot support for normal production
|
3
|
|
|
|
|
|
250661
|
DYNAUDIO |
EMIT50 |
in Laboratory Equipment
DYNAUDIO Emit 50 Loudspeakers (2pcs.):
|
1
|
|
|
|
|
|
261044
|
ACA Integration |
AQN2D2 |
in Semiconductor / Hybrid Assembly Equipment
|
1
|
|
|
|
|
|
257523
|
AMAT |
AMAT EPI CENTURA |
in Epitaxial Reactors
EPI 39 - AMAT EPI CENTURA :Software Ver: B6.50 CB1 Amps: 300A Vita Controller Flow Point Model: Nano Valve Gas Panel Type: Configurable Wafer Size: 200mm (with conversion kit 150mm is possible) M-Monitor: CRT 3 Chambers ATM EPI With digital Flow-Control of the cooling systems with interlock and passphrase (Simens PLC) Standard pneumatic waferlift Center Finding System: OTF Buffer robot: HP+ Piezocon sensor: No VSB: Yes Wide Body LL Tool called "EPI39"
|
1
|
|
|
|
|
|
257176
|
AMAT |
EPI Centura ACP |
in Epitaxial Reactors
EPI Centura ACP 300mm "Yu Shan":Brand new and unused EPI Centura ACP 300 mm 4 Chambers; Chamber code RH3, Lamp type BNA8 R3
Mainframe Configuration E4 Single, 4 Facet SC ENP BLK2, Loadport AMAT Standard 300mm, EPI Water Module LT Design. RP EPI Tool out of Project: "Yu Shan" The original rough IFX Equipment procurement value was ~10,3 M€ Will be now sold for an attractive price. Equipment is... ...brand new ...never used ...original packaged and crated ...located in Asia ...complete and fully functional ...professional stored in Warehouse
|
1
|
|
|
|
|
|
255417
|
ESEC |
ESEC 2007 |
in Flip Chip Bonders
ESEC 2007 DIE BONDER:| Serial Number | Model | Manufacturer | | 205940 | 2007 | ESEC |
|
1
|
|
|
|
|
|
257527
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257528
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS :ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257568
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257569
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257570
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257571
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257572
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257573
|
ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
|
1
|
|
|
|
|
|
257526
|
ESEC |
ESEC_2100XP |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100XP:ESEC DIE ATTACH ESEC_2100XP
|
1
|
|
|
|
|
|
236878
|
ESEC3100 WIRE BONDER |
in Other Semiconductor
ESEC3100 WIRE BONDER:GT line scrap,9 sets of ESEC3100
|
9
|
|
|
|
|
|
255150
|
SCHMID Group Gebr. S |
PremiumLine |
in Other Semiconductor
Etching Plant DES-PremiumLine:We offer a SCHMID DES-PremiumLine from inlet to outlet. Included in the offer is the complete DES-PremiumLine build of 14 individual modules, piping, wastewater buffer, pumps, valves, sensory, control cabinet, PC and spare parts. There are two wastewater buffer, one for the development/stripping modules and one for the etching modules.
|
14
|
lot
|
€ 80,000.00 |
|
|
|
259340
|
EVG |
EVG Lithoscale |
in Other Semiconductor
EVG Lithoscale - Maskless Exposure System:Up to 300mm, Low-Volume Manufacturing, automated substrate handling Brandnew and unsed System available for an attractive price! Out of package Hyperion Technical configuration: • For maskless exposure of wafer sizes up to 300 mm • High precision stage including contactless wedge error compensation • Self calibration via integrated sensors • Extensibility up to two (2) exposure heads in total for highest throughput • Separate control unit • EVG CIM Framework software • Self diagnostics during machine start up, automatic initialization of all motors, position end switches, sensors and pneumatic • Inspection available on request • PC controlled operating environment • Solid state drive and hard drive for high availability and reliability • Supported layout format: GDSII
|
1
|
|
|
|
|
|
221096
|
BESI Holland |
MK-1 |
in Other Semiconductor
FICO, Auto Mold System (AMS 24) 2p, MK-1:machine is Functioning
|
1
|
|
$ 54,000.00 |
|
|
|
256642
|
FUSEI |
FMTM250-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM250-7HS-32P FUSEI MOLD PRESS:FMTM250-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
|
|
|
256643
|
FUSEI |
FMTM250-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM250-7HS-32P FUSEI MOLD PRESS:FMTM250-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
|
|
|
256645
|
FUSEI |
FMTM250-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS:FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS
|
1
|
|
|
|
|
|
256649
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI MOLD PRESS:FMTM300-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
|
|
|
256650
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI MOLD PRESS:FMTM300-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
|
|
|
256651
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI MOLD PRESS:FMTM300-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
|
|
|
256648
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS:FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS
|
1
|
|
|
|
|
|
252846
|
Microcontrol |
Microcontrol 408 II |
in Production Equipment
Foil Peeling Tools / Detaper:Tools are under good condition. Tools are currently productive in Infineon Kulim. Bundle sale in 2 tools together = Euro 60k
|
1
|
|
€ 30,000.00 |
|
|
|
248948
|
Webomatic |
System-4000 |
in Other Semiconductor
foil sealer (Einschweißgerät) :
|
1
|
|
|
|
|
Displaying 1-100 of 289 Page  1 2 3   |
reference document attached
Log in
Group Offers into sub-categories