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FULL DESCRIPTION of Item 238644

in Other Wafer Fabrication Equipment
Item ID: 238644

Offered 1 Offered at Best Price


Multi-Chip Die Bonder

Operations and Maintenance Manuals available.

Multi-Chip Die Bonder
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Unit Price Unstated
Number of Units 1
Manufacturer Datacon
Model 2200 apm
Description Multi-Chip Die Bonder
Condition Very Good
Year of Manufacture 2007
Serial Number(s)95022151776

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment