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Item ID |
Short Description |
Product Type / Details |
#
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Price |
Notes |
| Make |
Model |
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230954
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Genmark Automation |
GB4P |
in Robotics
1x Waferhandlingsrobot Genmark GB4P telescopic for 200mm:complete, fully functional, inclusive integrated prealigner and notching, platform axis Z, cableset and controller used, working, frequently maintenance at Genmark office done Manual existing Decontamination Report existing refurbished
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1
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 N* |
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203088
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2 set of inline tester |
in Automatic Test Equipment
2 set of inline tester:2 set of inline tester asset no:10005027 & 10005029 LOCATION: Wuxi
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2
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¥ 5,787,004.00 |
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209845
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200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
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1
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€ 1,000.00 |
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203803
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Shinkawa |
ACB35 |
in Wire Bonders
3 sets of SHINKAWA ACB35 WIRE BOND:SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052
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3
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lot
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¥ 2,443,263.00 |
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230955
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Genmark Automation |
GB4P |
in Robotics
3x Waferhandlingsrobot Genmark GB4P telescopic for 200mm:complete, fully functional, inclusive integrated prealigner and notching, platform axis Z, cableset and controller used, working, frequently maintenance at Genmark office done Manual existing Decontamination Report existing used
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1
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N* |
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227363
|
NADAtech |
n47 |
in Wafer Fabrication Equipment
6"/8" Wafer Sorter / Barcode Reader:Nadatech n Series Wafer Sorter 6" and 8" 4 cassette stations with greenlight gyro station (front- and backside inspection) Moog robot (fast wafer centering on movement to aligner) 2x IOSS Wafer ID Reader (Barcode or Text) Manuals available
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1
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F* |
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231950
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Accretech |
UF200 |
in Wafer Probers
Accretech UF200:Tool is crated, last time in production March 2022
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1
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N* |
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231951
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Accretech |
UF200 |
in Wafer Probers
Accretech UF200:Tool is crated, last time in production Nov 2021
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1
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N* |
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231952
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Accretech |
UF200 |
in Wafer Probers
Accretech UF200:Tool is crated, last time in production May 2022
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1
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N* |
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231953
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Accretech |
UF200 |
in Wafer Probers
Accretech UF200:Tool is crated, last time in production Oct 2021
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1
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N* |
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231954
|
Accretech |
UF200 |
in Wafer Probers
Accretech UF200:Tool is crated, last time in production Jan 2016
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1
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N* |
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220089
|
Advantest |
T5371 |
in Device Testers
Advantest T5371 Memory Tester:Brand: Advantest Model: T5371 Serial No.: 310016752 MFG date: Feb’2001 Asset : T-103132 DUT : 32
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1
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227053
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Applied Materials In |
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in ALL CATEGORIES
AMAT P5000 Standard Mainframe with 2 Argon Sputter Chambers: Sales name "Argo" ET ID: 227053 - W X H X D in cm – 147.3 X 190.5 X 161.2
- Weight – Estimate 3050 kg
- maybe the tool need maintenance as it was under cool down > 3 years
- inspection possible
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1
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227054
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Applied Materials In |
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in ALL CATEGORIES
AMAT P5000. :Process Chamber : 3 units Mark II Univesal Chambers Process : PE TEOS (USG/PSG)
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1
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F* |
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227055
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Applied Materials In |
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in ALL CATEGORIES
AMAT P5000. :Process Chamber : 3 units Mark II Univesal Chambers Process : PE TEOS (USG/PSG)
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1
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227056
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AMAT P5000. |
in ALL CATEGORIES
AMAT P5000. :Chamber : 3 units Mark II Univesal Chambers Process : PE TEOS (USG/PSG)
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1
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220613
|
Applied Materials |
Semvision 200CX |
in Optical Inspection Equipment
Amat Semvision 200CX:SEM for particle - review inspection. Price reduced!
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1
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€ 220,000.00 |
F* |
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204578
|
Orbotech |
Ultra Discovery VM |
in Metrology Equipment
AOI Orbotech Ultra Discovery VM:Simple, Intelligent, Powerful Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production. Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time. Benefits - High throughput and superior detection with minimal number of false calls
- Especially designed for inspection of the finest lines down to 10μm
- Quick set-up even for the most complicated jobs for higher productivity
- Automation ready
- Very high uptime
SIP TechnologyTM Push-to-Scan®: - A ‘no set-up’ process
- Top AOI results with minimal effort or training
- The easiest, user-friendly interface (GUI)
- Full ‘Step and Repeat’ functions
Visual Intelligence: Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want. Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects. Visual Intelligence: - Full panel understanding, context-based detection engine
- Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed
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1
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$ 24,900.00 |
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223524
|
ASM A412 |
in Production Equipment
ASM A412:We are looking for a used ASM A412. Please call +49 941 202 2755 if you want to offer one.
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1
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213293
|
ASM |
Siplace CA4 |
in Flip Chip Bonders
ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20
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1
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216983
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Automatic wafer sorter model |
in Semiconductor / Hybrid Assembly Equipment
Automatic wafer sorter model:| 10006965 | 0 | Automatic wafer sorter model | 8500024818;A-12-3040-37-D001-A-02 |
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1
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204380
|
Infineon |
Bruchless Motor bench |
in Test & Measurement Equipment
Bruchless Motor bench:Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).For more informations please refer to the enclosed diagram and the motor description below. Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)This three-phase motor works with the Kelly controller (described below) • Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts) • Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center. • This is a 4 pole motor (8 magnets). • The Phase to Phase winding resistance is 0.013 Ohms. • The maximum recommended rotor speed is 5000 RPM. • Voltages from 0 to 96 VDC input to the control. • Torque constant of 0.15 Nm per Amp • The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase. • Armature Inertia is 45 Kg Cm Squared. • Continuous current of 125 Amps AC (180 Amps DC into the motor control). • Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control). • Weight of 35 pounds. • Peak Stall Torque of 90 Nm (66 ft). • This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise). Kelly KBL72301,24-72V,300A,BLDC Controller/With RegenKelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control. Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily. Features: • Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency. • Electronic reversing. • Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V. • Current sense on all 3 motor phases.Current control loop. • Hardware over current protection.Hardware over voltage protection. • Support torque mode, speed mode, and balanced mode operation. • Configurable limit for motor current and battery current. • Low EMC.LED fault code. • Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage. • Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal. • Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.
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1
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lot
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220896
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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$ 1,200.00 |
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220894
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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$ 1,320.00 |
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220895
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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$ 1,380.00 |
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220893
|
ESA ELECTRONICS PTE |
ATS12200 |
in ALL CATEGORIES
Burn In oven ATS12200:Function ( MC already 2 years not running)
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1
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$ 1,440.00 |
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231368
|
Nikon |
FPA-3000 i4 |
in Wafer Steppers
Canon Stepper FPA-3000 i4:Customer ID: CAI401 Customer inventory: 227214 S/N Machine: 504 456 Type: FPA-3000 i4 Reticle: Size 6" square t=? (Nikon Style or Canon Style reticle loader?): 6” Reticle / t= 0,25” / Nikon Type Reticle Changer Stage Type: ABS
Chamber Type: TBW-CD-80 (Compact Chamber Model)
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1
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N* |
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231451
|
Trane |
550 RT Chiller (CVHE 660) |
in ALL CATEGORIES
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1
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N* |
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226710
|
Trane |
CVHE 550 |
in ALL CATEGORIES
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1
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166465
|
Oxford Instruments |
CMI 950 |
in Spectrometers
CMI 950 - Xray fluorescence spectrometer:X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc. Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag). System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
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1
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F* |
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229481
|
Ebara |
FREX300S |
in Chemical Mechanical Planarization Equipment
CMP Ebara FREX300S:Still installed - ready for inspection. Available for de-installation ~ August Tool called "Wolfram Ebara" 12" CMP tool, 2 polish tracks à 2 platen, 3x roll roll cleaner, 4x G3 AI head, eddy current endpoint on pol A + C, spin rinse dryer
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1
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207199
|
ASYS |
BC0 01 |
in ALL CATEGORIES
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
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1
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207198
|
ASYS |
TRM02 |
in ALL CATEGORIES
Conveyor ASYS TRM02:Conveyor ASYS TRM02
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1
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226711
|
DEVICEENG |
DE Korean Benches |
in Wafer Cleaners
DEVICEENG - WET Clean Strip Benches :Our technical wet clean ID: WETANCL10 We have 3 further tools of this kind and could sell all four as a package even if the release dates are different. All four tools are located in Kulim/Malaysia. We would appreciate a quick sale and de-installation.
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1
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232221
|
DISCO CORPORATION |
DISCO DFD660 |
in Dicing Tools
DICER_DISCO DFD660:DICER_DISCO DFD660
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1
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N* |
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232222
|
DISCO CORPORATION |
DISCO DFD660 |
in Dicing Tools
DICER_DISCO DFD660:DICER_DISCO DFD660
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1
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N* |
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232223
|
DISCO CORPORATION |
DISCO DFD670 |
in Dicing Tools
DICER_DISCO DFD670:DICER_DISCO DFD670
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1
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N* |
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219804
|
Ergospeed2 Loadport |
in ALL CATEGORIES
Ergospeed2 Loadport:~5 Years old full functional
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1
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€ 5,999.00 |
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213366
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:| ESEC 3088 Wire Bonder | PO5627 | | ESEC 3088 Wire Bonder | PO5627 | | ESEC 3088 Wire Bonder | Transfer AG | | ESEC 3088 Wire Bonder | 200810209;transfer in from IFAG | | ESEC 3088 Wire Bonder | PO NO 200410327 BNE NO 20040009W | | ESEC 3088 Wire Bonder | Transfer AG | | ESEC 3088 wirebonder | 8500043290;transfer from IFAG;661001544 |
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7
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217537
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:9F392100030150ESEC 3088 Wire BonderPO56279F399100039170ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W LOCATION: Wuxi
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2
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200489
|
ESEC |
ESEC3088 |
in Wire Bonders
ESEC3088 WireBonder 2 sets:ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823 LOCATION: Wuxi
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2
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225014
|
Evatec BAP 801 |
in Evaporation Tools
Evatec BAP 801:BAP7 Evaporation tool with 2 E-Guns
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1
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225314
|
Evatec BAP 801 |
in Evaporation Tools
Evatec BAP 801:BAP8 Evaporation tool with 2 E-Guns
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1
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226539
|
EVG |
Gemini Automated Production Wafer Bonding System |
in Wafer Fabrication Equipment
EVG Bonder:- EFB01
- 1) full automated production wafer bond system GEMINI with two Kawasaki robots up to 200m wafer with mini environment class 1;
- 2) SmartView NT2 Align module with customized additional center to center alignment and different chucks (edge grip, 6 inch), alignment typically < 1µm
- 3) Bond module for max 200mm wafer up to 550°C and 10kN, flag pulling mechanism; piston force up to 20kN, overprs 3bar absolute, vacuum < 1x10e-5mbar
- 4) cleaning module: jet nozzle, megasonic, 2 chemistry lines, N2 nozzle,dry spin
- 5) lowTemp Plasma activation module; 100-200mm wafer,3 Gaslines, high frequency / low frequency RF Generator to 200W, Turbo molecular Pump for vac system
- 6) IR Inspection station with sorting option
- 7) Chiller
The Equipment is nearly new - meaning unused. It was only used for tests.
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1
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202692
|
EVG820 Dry Film Lamination System |
in ALL CATEGORIES
EVG820 Dry Film Lamination System:The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.
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1
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$ 55,000.00 |
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210404
|
Suss MicroTec |
Falcon Polyimid Developer |
in Photoresist Develop Track Systems
Fairchild Developer Ent3C:Developer with 2 chambers for spray developing.
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1
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232226
|
FET/TEST,INC MADE IN |
3602E |
in Device Testers
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1
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N* |
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221096
|
BESI Holland |
MK-1 |
in ALL CATEGORIES
FICO, Auto Mold System (AMS 24) 2p, MK-1:Functioning
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1
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$ 54,000.00 |
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221743
|
Mitutoyo |
QVT1-X606P1L-D |
in Optical Test & Measurement Equipment
For Sale! Mitutoyo CNC Vision Measuring Machine :In use until October 2020, when it was phased out from production. Since then, it's stored in a dry and heated environment. Besides minor marks and scratches caused by trolleys, it's in an excellent condition. It was maintained regularly by site maintenance, and went through yearly inspection by OEM, including calibration. Standard machine, with special adapter plates used at Infineon. It's with software for series production, able to measure multiple modules in row. Saves date to local CSV file format and writing measurement data to Orbit system., Possibility to upgrade tactile measuring function!
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1
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€ 55,000.00 |
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203804
|
Heraeus Oven & Oven Table |
in Wire Bonders
Heraeus Oven & Oven Table:Heraeus Oven & Oven Table | 10002755 Oven | | 10004959 Oven Table |
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2
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lot
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¥ 31,003.00 |
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214949
|
HMI E SCANLIGHT - EBEAM |
in Metrology Equipment
HMI E SCANLIGHT - EBEAM:200/300mm Bridge Tool, Last audit health status report available
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1
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227087
|
Axcelis Technologies |
Optima HD |
in Ion Implantation Equipment
IMPLANTER Axcelis Optima HD: The tool has to leave the cleanroom very soon. Therefore we would appreciate a fast sale, if possible next week. A de-installation service from a third party is possible.
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1
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F* |
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202596
|
INGERSOLL RAND heat reactivated regenerative air dryers |
in ALL CATEGORIES
INGERSOLL RAND heat reactivated regenerative air dryers:INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846 LOCATION: Wuxi
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1
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¥ 391,740.00 |
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230848
|
Meyer Burger (Nether |
JETx-S Inkjet Printer PiXDRO cluster |
in Lithography Equipment
Ink Jet Printer:FOTP16-01 Last time in production 08/22
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1
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N* |
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226443
|
Inline VI WorkStation |
in Semiconductor / Hybrid Assembly Equipment
Inline VI WorkStation:line 1 K2 Inline VI station instead by the AOI
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1
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225961
|
Inliner Machine |
in Automatic Test Equipment
Inliner Machine:| 9F617 | 10007755 | 0 | Inliner Machine | 8500047459;transfer from IFMY;6JM/00995 | | 9F617 | 10007755 | 1 | Freight: Inliner Machine | 8500047459;transfer from IFMY;6JM/00995 |
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1
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223734
|
Inliner Machine |
in Automatic Test Equipment
Inliner Machine:| 10005956 | 0 | Inliner Machine | 201010232;Mal transfer DS line;inv# 6JM/00637 | | 10005956 | 1 | Inliner Machine | 201010232;Mal transfer DS line;inv# 6JM/00637 | | 10005956 | 2 | Inliner Machine | 201010232;Mal transfer DS line;inv# 6JM/00637 | | 10005956 | 3 | Inliner Machine | 201010232;Mal transfer DS line;inv# 6JM/00637 | | 10005956 | 4 | Inliner Machine | 201010232;Mal transfer DS line;inv# 6JM/00637 | | 10005984 | 0 | Inliner Machine | 8500008991;Mal transfer DS line;inv# 6JM/00930 | | 10005449 | 0 | clamp inliner | 200910267;transfer from IFMY | | 10005449 | 1 | freight :clamp inliner | 200910267;transfer from IFMY | | 10005449 | 2 | CI Centering Vision System | 8500014989;A-11-3040-37-D051-A-01;inv#M11020-8020 | | 10005449 | 3 | Intape Vision System | 8500023687/23665/23054;11-37-D051-A-01;M1108-8098 | | 10005449 | 4 | 60 angel vision system | 8500036696/94/56/57;A-12-3040-37-D038-A-01;212315 | | 10005449 | 5 | Reverse Prevent Set | 8500037059/36655;A-12-3040-37-D038-A-01;0287854/5, | | 10006068 | 0 | clamp inliner | 201010011;Mal transfer DS line;inv# 6JM/00772 | | 10006068 | 1 | freight :clamp inliner | 201010011;Mal transfer DS line;inv# 6JM/00772 | | 10006068 | 2 | CI Centering Vision System | 8500014989;A-11-3040-37-D051-A-01;inv#M11020-8020 | | 10006068 | 3 | Intape Vision System | 8500023687/23665/23054;11-37-D051-A-01;M1108-8098 | | 10006068 | 4 | 60 angel vision system | 8500036696/94/56/57;A-12-3040-37-D038-A-01;212315 | | 10006068 | 5 | Reverse Prevent Set | 8500037059/36655;A-12-3040-37-D038-A-01;0287854/5, | | 10005856 | 0 | clamp inliner | 201010007;A-10-3040-37-D002-T-05;Inv#6JM/00653 | | 10005856 | 1 | CI Centering Vision System | 8500021554/21919/21547/23054/23665;11-D017;2369528 | | 10005856 | 2 | 60 angel vision system | 8500036696/94/56/57;A-12-3040-37-D038-A-01;212315 | | 10006846 | 0 | CLAMP INLINER | 8500032637;Tansfer from IFMY;6JM/00532 | | 10006846 | 1 | 60 angel vision system | 8500036696/94/56/57;A-12-3040-37-D038-A-01;212315 | | 10006846 | 2 | Reverse Prevent Set | 8500037059/36655;A-12-3040-37-D038-A-01;0287854/5, | | 10006846 | 3 | hookup: CLAMP INLINER | 8500032637;Tansfer from IFMY;6JM/00532 | | 10006846 | 4 | auto replacement system | A-15-3040-37-D007-A-01;8500066037;21392187-88 |
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6
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217557
|
Inliner Machine |
in Automatic Test Equipment
Inliner Machine:| 9F572 | 10005734 | 0 | Inliner Machine | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 9F572 | 10005734 | 1 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 9F572 | 10005734 | 2 | freight : Inliner Machine | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 9F572 | 10005838 | 0 | Inliner Machine | 201010229;A-10-3040-37-D008-T-07;Inv#6JM/00638 |
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2
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217534
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Inliner Machine |
in Semiconductor / Hybrid Assembly Equipment
Inliner Machine:| 9F587 | 10007477 | 0 | Inliner Machine | 8500043739;transfer from IFMY; 6JM/00486 | | 9F587 | 10007477 | 1 | fright: Inliner Machine | 8500043739;transfer from IFMY; 6JM/00486 |
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1
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212377
|
INLINER MACHINE,Trim & Form Machine |
in Automatic Test Equipment
INLINER MACHINE,Trim & Form Machine:| 10007053 | 0 | INLINER MACHINE | 8500035930;transfer asset from IFMY; 6JM/00922 | | 10007053 | 1 | freight: INLINER MACHINE | 8500035930;transfer asset from IFMY; 04011117 | | 10007053 | 2 | CIQ fee and freight: INLINER MACHINE | 8500035930;transfer asset from IFMY; 6JM/00922 | | 10004706 | 0 | Trim & Form Machine | Transfer MY | | 10004706 | 1 | Trim & Form Machine | 0 | | 10004706 | 2 | Cut & Bending Tool | Transfer MY | | 10006652 | 0 | TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 | | 10006652 | 1 | customs duty: TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 | | 10006652 | 2 | hookup: TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 |
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3
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221102
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BESI |
X-Eye SF160 SL |
in ALL CATEGORIES
KETECA, X-Eye SF160 SL, A-SFS16FDAL170N2D735, XRAY:Function , needed motor vacuum to up this machine |
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1
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$ 22,800.00 |
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222539
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Brown & Sharpe |
Reflex 454 |
in Test & Measurement Equipment
KMG Brown & Sharpe Reflex 454:Coordinate measuring machine Measuring area 457x508x406mm, additional measure Equipment available (measure head Renishaw MH8 and feeler TP2). Including printer, table, cabinet and documentations. German describtion: Taktiles Messgerät für Messbereich 457x508x406mm, mit Messzubehör (Messkopf Renishaw MH8 und Messtaster TP2), inkl. Nadeldrucker, inkl. Tischgestell und Unterschrank, inkl. deutsche Dokumentation (Bedienungsanleitung, Installationshandbuch, Software-Handbuch)
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1
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226452
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LAM Research Corp. |
RST304 |
in Wet Processing Equipment
LAM SEZ RST304:SP304 - SN0947 300mm / 12" Equipment Chuck STD Brooks ATM407 w Flip-Module Medium1
used for HF HouseSupply,
able to mix DHF
Mix-Tank,
Buffer-Tank (10ml BP) for HF,
PW for DI
Single-Hex Medium2
used for DSP from CBM
able to mix DHF
NO Mixtank !
Buffer.Tank (10ml) HF (not used)
PW for DI
Double-Hex Medium3
used for SED HouseSupply
NO Mixtank
Buffer-Tank(10ml) HF
Double-Hex CBM
3 BufferTanks (H2SO4/H2O2/HF)
1 PW (DI) Ozon-DIW
Modul is not functional, components removed/defective
- O3-generator removed
- O3-contactor defective
- ctrl-cabinet some parts(solenoid block) Tool is located in Dresden, Germany. Planned de-installation date is 1st September 2022.
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1
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204631
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Lauffer Mold Press |
in Semiconductor / Hybrid Assembly Equipment
Lauffer Mold Press :Lauffer Mold Press/100050250 Mold-Die, 5% Mark up from MY/100050251 CURING OVEN/100050260
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2
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¥ 2,526,419.44 |
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204582
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Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine |
in ALL CATEGORIES
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1
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F* |
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220811
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LH800 Wafer Transfer Machine |
in ALL CATEGORIES
LH800 Wafer Transfer Machine:WPL2 LongHill Wafer Packing Machine for 6 and 8 inch Wafer.
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1
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219376
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Accretech EUROPE Gmb |
MHF 300L |
in Wafer Probers
Manipulater for Accretech:Manipulator for Accretech UF200A Prober
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1
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197054
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Mannual Detaping Machine |
in Production Equipment
Mannual Detaping Machine:The EQ is damaged can not be repaired
LOCATION: Wuxi
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1
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€ 0.00 |
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205912
|
Matrix Corp |
Matrix X3 |
in Metrology Equipment
Matrix X3 X-Ray System:high speed X-Ray system
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1
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224568
|
Mechatronic 300mm Sorter |
in Wafer Fabrication Equipment
Mechatronic 300mm Sorter:Sort-05 Mechatronic Sorter for 200 and 300mm With bernoulli Aligner for 8 and 12 inch and IOSS Camera. And greenlight inspection. With 4 Synfoniy 300mm Loadports, 2 on the front side and 2 on the backside.
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1
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224956
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Mechatronic 300mm Sorter |
in Wafer Fabrication Equipment
Mechatronic 300mm Sorter:Sort-07 Mechatronic Sorter for 200 and 300mm With bernoulli Aligner for 8 and 12 inch and IOSS Camera. With 4 Synfoniy 300mm Loadports, 2 on the front side and 2 on the backside.
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1
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226714
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MECO |
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in ALL CATEGORIES
Meco Deflash Line:›Pressure range 50 to 500bar
›4 Rotating jets. 60mm circular coverage
›2 predip cells with 1 tank each
›2 cells for electrolytic treatment, with flexible supply out of 2 tanks
›Flow meters for each cell
›Conductivity measure for each rinse
›Digital alarms for filters Tool still in production, available 05-07/2022
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1
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226713
|
MECO |
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in ALL CATEGORIES
Meco Innovation Plating Line :Innoline Characteristics ›NiNiPPdAu process
›NiPdAu process
›NiNiP process
›2nd cell NiP (Space for other plating electrolytes e.g. silver or tin) Only manual loading Tool still in production, available 04/2022
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1
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155055
|
Hitachi |
VP-1500 |
in Laboratory Equipment
MONOCHROME COPIER:MONOCHROME COPIERMONOCHROME COPIERLOCATION: Malacca SERIAL NUMBER(S): TA0101513
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1
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€ 2,662.70 |
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207180
|
Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
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1
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€ 50,000.00 |
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203189
|
NexGen Technologies |
Nexgen Prober 2013 Model |
in Wafer Probers
NEXGEN SEMI AUTOMATIC PROBER:NexGen semi-automatic proberfor 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.More information available below and on the enclosed flyer : Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec ZStage/Chuck - Range : 0.200" (other configurations available) - Speed : 11 ms Loader (Wafer Handler)- Cassette capacity : 2 Standard; 1 sender, 1 receiver - Wafer handling : Belt and vacuum arm - Fine alignment : CCD Image Processing - Hard Disk Drive : 60 -250 gig - Disk Drives : USB, CD/RW, DVD Writer - Display : 22" Color Screen Monitor - Power consumption (included) : 1.5 KVA Facilities Required- Air : 75 PSI @ 3 CFM - Vacuum : 25in/hg - Dimensions | Inches | Cm | | 48"w x 32"d x 60"h | 115 (L) x 80 (l) x 140 (h) |
- Weight
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1
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226712
|
Nitto Denko |
HR8500 |
in Dicing Tools
Nitto Detaper HR8500:20mm detaper; dual cassette station; Aligner unit, UV unit; Wafer table removing station UV controller for integrated UV-Unit (last picture)
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1
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226709
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ODY TRAILER (FOR TOWING TRUCK) |
in ALL CATEGORIES
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1
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192280
|
Over Head Transport System (OHT) SRC320 |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320:
A high quantity of SRC 320 parts.
- SRC320 Vehicles (~50 pc.)
- SRC320 SCPS-ZCU
- SRC320 ICC
- SRC320 PDU
- SRC320 Rail parts
- Foup Handler Stocker
Please get in touch with the Equipment Trade Category Manager to get more information or price lists.
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1
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209425
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500049:P500049 4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos
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1
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204583
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Process Photonics LaserDrilling/Cutting Tool |
in ALL CATEGORIES
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1
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204584
|
PPI Systems Inc. |
FP-C2 |
in ALL CATEGORIES
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1
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220859
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Schiller FoupStocker 1 |
in ALL CATEGORIES
Schiller FoupStocker 1:Schiller Foup Stocker with many shelfs.
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1
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220858
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Schiller FoupStocker 2 |
in ALL CATEGORIES
Schiller FoupStocker 2:Schiller Foup Stocker with many shelfs.
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1
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226444
|
scrap 2x D&F |
in Semiconductor / Hybrid Assembly Equipment
scrap 2x D&F:| 10004813 | 0 | Buffer | Transfer AG, PO#200710494 | | 10003920 | 0 | Muhlbauer CME3010 Dam/Fill | PO NO 200410327 BNE NO 20040009W | | 10003920 | 1 | MUHLBAUER CME3010 SERVICE | PO 200410378 BNE 20040013W | | 10003920 | 2 | MUHLBAUER CME3010 SERVICE discount | PO NO 200410378 BNE NO 20040013W | | 10003920 | 3 | TAX FOR MUHLBAUER CME3010 SERVICE | 0 | | 10005130 | 0 | Buffer | 200733389;07-37-C027-A-01;WanHeTe#00443077 | | 10003921 | 0 | Muhlbauer TI2260 Thickness Inspection | PO NO 200410327 BNE NO 20040009W | | 10003988 | 0 | Buffer | PO NO 200410423 BNE NO A-04-3040-41-T017-T-01 | | 10005757 | 0 | Temperature control system | 8500001467;A-10-3040-37-C004-A-05; inv#10-3537 |
| 10004866 | 0 | Buffer | Transfer AG, PO#200710013 | | 10002992 | 0 | Muhlbauer CME3010 Dam/Fill | PO5629 | | 10004687 | 0 | Buffer | Transfer AG, PO#200710013 | | 10004682 | 0 | Buffer | Transfer AG, PO#200710013 | | 10002991 | 0 | Muhlbauer TI2260 Thickness Inspection | PO5629 | | 10005759 | 0 | Temperature control system | 8500001467;A-10-3040-37-C004-A-07; inv#10-3537 | | 10005759 | 1 | tariff for Temperature control system GT Line 09 | 8500001467;A-10-3040-37-C004-A-07; inv#10-3537 |
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2
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218857
|
Rapiscan Systems |
620XR-W |
in Semiconductor Manufacturing Facilities Equipment
Security X-ray scanning machine:Rapiscan® Systems Hand luggage X-ray solutions for the most difficult baggage and parcel inspection.
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1
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209409
|
Rucker & Kolls |
680A |
in Wafer Probers
SEMI AUTOMATIC PROBE STATION 6" RUCKER&KOLLS: Wafer Size:6"Probe station, 6"
Ni-plated vacuum chuck
Automatic stepping
Motorized X-Y stage
stereo zoom microscope
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1
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219066
|
Shibaura |
CDE300 |
in Cluster Plasma Tools
Shibaura CDE300 :CDE301 Plasma Etch Tool for SI Grieß, SNIT, Imid, Titan, Tungsten
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1
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217318
|
SHINKAWA ACB35 &ACB400 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 &ACB400 WIRE BOND:| SHINKAWA WIRE BOND ACB400 | 8500040046;transfer from IFMY; 6JM/00109 | | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | | SHINKAWA ACB400 | 8500035681;transfer asset from IFMY; 6JM/00852 | | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | | SHINKAWA ACB35 WIRE BOND | 200810444;transfer in from IFMY | | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup | | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup | | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup | | SHINKAWA ACB35 WIRE BOND | 200810323;IFMAL#6JM/00360;10% markup |
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12
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218841
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SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:| 9F570 | 10005437 | 0 | SHINKAWA ACB35 WIRE BOND | 200910266;transfer assets from IFMY | | 9F570 | 10005438 | 0 | SHINKAWA ACB35 WIRE BOND | 200910266;transfer assets from IFMY |
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2
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222839
|
SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:| 10005437 | 0 | SHINKAWA ACB35 WIRE BOND | 200910266;transfer assets from IFMY | | 10005438 | 0 | SHINKAWA ACB35 WIRE BOND | 200910266;transfer assets from IFMY | | 10006040 | 0 | SHINKAWA ACB35 WIRE BOND | 8500007255;Mal transfer DS line;inv# 6JM/00884 | | 10006040 | 1 | ELECTRIC FLAME OFF UNIT EFU-14 | 8500025737;A-12-3040-37-D003-A-01;16689322-329 | | 10006041 | 0 | SHINKAWA ACB35 WIRE BOND | 8500007255;Mal transfer DS line;inv# 6JM/00884 | | 10006041 | 1 | ELECTRIC FLAME OFF UNIT EFU-14 | 8500025737;A-12-3040-37-D003-A-01;16689322-329 | | 10005749 | 0 | SHINKAWA ACB35 Wire Bond | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | | 10005749 | 1 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | | 10005749 | 2 | Conversion key3(Wire clamp CL-42Dt) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | | 10005749 | 3 | Conversion key3(Wire clamp CL-42Dt) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | | 10005749 | 4 | Copper wire forming kit & Gas control module syste | 8500010081;A-11-3040-37-D010-A-01;inv#14100311 | | 10005750 | 0 | SHINKAWA ACB35 Wire Bond | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | | 10005750 | 1 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | | 10005750 | 2 | Conversion key3(Wire clamp CL-42Dt) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | | 10005750 | 4 | Copper wire forming kit & Gas control module syste | 8500010081;A-11-3040-37-D010-A-01;inv#14100311 |
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4
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207381
|
SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F371 | 10006475 | SHINKAWA ACB35 WIRE BOND | 8500018759;transfer from IFMY;inv# 6JM/00925 | 108 1F ASSY | F0-36534 S23 |
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1
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¥ 932,760.30 |
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204719
|
SHINKAWA ACB35 Wire Bond |
in Wire Bonders
SHINKAWA ACB35 Wire Bond:| 100060530 | SHINKAWA ACB35 Wire Bond | | 100068240 | VISUAL INSPECTION SYSTEM | | 100068241 | hookup: VISUAL INSPECTION SYSTEM | | 100073050 | VISION INSPECTION MACHINE |
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3
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¥ 1,368,926.41 |
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199782
|
Shinkawa |
ACB35 |
in Ball Bonders
SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi
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4
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203821
|
Shinkawa |
ACB400 |
in Wire Bonders
SHINKAWA ACB400 WIRE BOND:SHINKAWA WIRE BOND ACB400 10007322 WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT LOCATION: Wuxi
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1
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¥ 953,057.50 |
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210121
|
SHINKAWA WIRE BOND ACB35 |
in Wire Bonders
SHINKAWA WIRE BOND ACB35:| SHINKAWA WIRE BOND ACB35 | 8500045110;transfer from IFMY; 6JM/00582 | | COPPER WIRE KIT | 8500046709;A-12-3040-37-D035-A-01;17019553 |
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4
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210122
|
SHINKAWA WIRE BOND ACB400 |
in Wire Bonders
SHINKAWA WIRE BOND ACB400:| SHINKAWA WIRE BOND ACB400 | 8500033675;transfer asset from IFMY; 6JM/01022 | | COPPER WIRE KIT | 8500028533/31676/35022;A-12-3040-37-D006-A-01;2301 |
LOCATION: Wuxi
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4
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217317
|
SHINKAWA WIRE BOND ACB400 |
in Wire Bonders
SHINKAWA WIRE BOND ACB400:| 9F371 | 10007321 | 0 | SHINKAWA WIRE BOND ACB400 | 8500040046;transfer from IFMY; 6JM/00109 | | 9F371 | 10007321 | 1 | WIRE CLAMPER | 8500042621;A-12-3040-37-D035-A-03;17594392 | | 9F371 | 10007321 | 2 | TRANSDUCER UST-200-1 | 8500042621;A-12-3040-37-D035-A-02;17594395/96 | | 9F371 | 10007321 | 3 | COPPER WIRE KIT | 8500028533/31676/35022;A-12-3040-37-D006-A-01;2301 |
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1
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203807
|
SIENMENS Backside Laser Machine |
in ALL CATEGORIES
SIENMENS Backside Laser Machine:| SIENMENS Backside Laser Machine 10004655 |
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1
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¥ 554,552.00 |
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207181
|
EKRA |
E4 |
in ALL CATEGORIES
Solder Paste Printer Ekra E4:Solder Paste Printer Ekra E4
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