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Item ID |
Short Description |
Product Type / Details |
#
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Price |
Notes |
| Make |
Model |
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253726
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15 sets TOSOK DBD4000 DIE BOND scrap |
in ALL CATEGORIES
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15
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253102
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THA Germany |
THA 1Temp Inliner_THA_1TIL-ST |
in ALL CATEGORIES
1TEMP INLINER_THA_1TEM002:1TEMP INLINER_THA_1TEM002
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1
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249543
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2 x Centrotherm Diffusion horizontal furnances (1990) |
in ALL CATEGORIES
2 x Centrotherm Diffusion horizontal furnances (1990):This horizontal batch-type process systems were built 1990 by Centrotherm. The current condition are bad (out of order), the systems are incomplete and could be used to exploit for spare parts. They were capable of processing up to Ø 150 mm wafers. The offer is only relate for the chassis (s.a. attached pictures), not for the vacuum pumps, displays or control cabinets. There is no documentation available. Both systems have no CE-marking.
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2
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209845
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200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
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1
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253291
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3 sets CLAMP INLINER MACHINE scrape |
in ALL CATEGORIES
3 sets CLAMP INLINER MACHINE scrape:| Asset | SNo. | Curr.net bk.val. | Asset name | | 304,008,003,531 | 0 | 0 | clamp inliner | | 304,008,003,531 | 1 | 0 | freight :clamp inliner | | 304,008,003,531 | 2 | 0 | CI Centering Vision System | | 304,008,003,531 | 3 | 0 | Intape Vision System | | 304,008,002,519 | 0 | 0 | CLAMP INLINER | | 304,008,002,519 | 1 | 0 | Incidental cost:CLAMP INLINER | | 304,008,002,519 | 4 | 0 | hookup: CLAMP INLINER | | 304,008,002,519 | 2 | 0 | 60 angel vision system | | 304,008,003,531 | 4 | 0 | 60 angel vision system | | 304,008,002,519 | 3 | 0 | Reverse Prevent Set | | 304,008,003,531 | 5 | 0 | Reverse Prevent Set | | 304,008,003,107 | 0 | 0 | CLAMP INLINER MACHINE | | 304,008,003,107 | 1 | 0 | CIQ& freight: CLAMP INLINER MACHINE | | 304,008,003,107 | 5 | 0 | CLAMP INLINER conversion kits(2017) | | 304,008,003,107 | 2 | 0 | Clamp Inliner conversion kits | | 304,008,003,107 | 3 | 0 | ?? for Clamp Inliner conversion kits | | 304,008,003,107 | 4 | 0 | CLAMP INLINER conversion kits(2017) |
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3
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247975
|
Nova |
SCAN-2040 |
in Metrology Equipment
4 x NOVA SCAN-2040 Measurement System:| NOVASCAN | SCAN-2040 | FILMTHICKNES | INSPECTION |
4 x Integriertes Ebara Measurement Systems and spare parts listed in file below
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1
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236797
|
ACB35 scrap |
in ALL CATEGORIES
ACB35 scrap:S128-S131 machine Fix Asset scrap, based on OPC scrap plan,UTC5100 replace ACB35 machine
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4
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252024
|
Applied Materials |
200mm Centura II |
in Cluster Plasma Tools
AMAT 200mm Centura II DXZx:Centura MF II Software: Vita Controller Indexer: Narrow Body / Tilt out mit Dummy Wafer Storage Robot: HP+ Chamber: A -> DPS+ B -> DPS+ C -> IPS D -> ASP+ E -> Single Cooldown F -> Orienter
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1
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230352
|
Applied Materials |
P16-072 |
in Wet Processing Equipment
Ancolyzer P16-072:3 x Dosage Additive 2 x Slipstreams with pump 2 x Dosing VMS incl. Bleed & Feed Bulk Fill Tanks additional doses of H2O2 und H2SO4 Scanner incl. software
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1
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204578
|
Orbotech |
Ultra Discovery VM |
in Metrology Equipment
AOI Orbotech Ultra Discovery VM:Simple, Intelligent, Powerful Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production. Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time. Benefits - High throughput and superior detection with minimal number of false calls
- Especially designed for inspection of the finest lines down to 10μm
- Quick set-up even for the most complicated jobs for higher productivity
- Automation ready
- Very high uptime
SIP TechnologyTM Push-to-Scan®: - A ‘no set-up’ process
- Top AOI results with minimal effort or training
- The easiest, user-friendly interface (GUI)
- Full ‘Step and Repeat’ functions
Visual Intelligence: Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want. Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects. Visual Intelligence: - Full panel understanding, context-based detection engine
- Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed
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1
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$ 24,900.00 |
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213293
|
ASM |
Siplace CA4 |
in Flip Chip Bonders
ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20 - excluding Loader
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1
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250659
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AUDIO PRECISION |
AUD-APX 525 B |
in Laboratory Equipment
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1
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250660
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AUDIO PRECISION |
AUD-APX 525 B |
in Laboratory Equipment
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1
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252684
|
AXCELIS NV8200P |
in Ion Implantation Equipment
AXCELIS NV8200P:-MCINV8201 -currently tool is still warm down
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1
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252685
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AXCELIS NV8200P |
in Ion Implantation Equipment
AXCELIS NV8200P:MCINV8202 Tool is currently under Warm down.
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1
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250598
|
Axcelis Technologies |
OPTIMA_HD |
in Ion Implantation Equipment
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1
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242851
|
Kufner |
Batch Etching Basin (KOH) |
in Wafer Cleaners
Batch Etching Basin (KOH):Complete dip acid etching unit manufactured by Kufner, Germany. The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing si-wafers after grinding (KOH). Delivery of additional accessories is possible. If there is a seriously buying interest, the technical specifications could be send
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1
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254465
|
Brooks EEPC Transponder RS232/Ethernet |
in ALL CATEGORIES
Brooks EEPC Transponder RS232/Ethernet:Brooks EEPC Transponder frequency: 13.56MHz TR5: 500mA (T) Interface: 1200 Bd - 57600 Bd Protocol: ASCII/SSEC/HSMS Protection: IP40 Impedance: 50 Ohm Interface: 10/100BaseT
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152
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N* |
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236798
|
Buffer controller LS19 scrap |
in ALL CATEGORIES
Buffer controller LS19 scrap:LINKING BUFFER SYSTEM LS19 scrap together with S128-S131 machine Fix Asset
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1
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241354
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EDA Industries (Asia |
SM-24 FH150C |
in ALL CATEGORIES
Burn In Oven System:Burn In Oven System
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1
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244542
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EDA Industries (Asia |
SM 24 FH 150 |
in ALL CATEGORIES
Burn In Oven System:Burn In Oven System
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1
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250700
|
Canon |
3000i4 |
in Wafer Steppers
Canon FPA 3000 i4 Stepper :Configuration: left inline system;
8" wafer chuck;
Nikon Type Reticle changer; 6" Reticle major hardware and software changes in control system: EWS type changed to HP B180, O/S changed to HP-UX 10.20, original X-Terminal replaced by a Windows PC + 17" touchscreen TFT Hg lamp will be removed prior shipping
Coolant will be removed prior shipping
Batteries will be removed prior shipping no UPS installed. No printer installed. No MO-drive EOL: optical parts Last Time in production: 05/24
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1
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250701
|
Canon |
3000i4 |
in Wafer Steppers
Canon FPA 3000 i4 Stepper :Configuration: left inline system;
8" wafer chuck;
Nikon Type Reticle changer; 6" Reticle major hardware and software changes in control system: EWS type changed to HP B180, O/S changed to HP-UX 10.20, original X-Terminal replaced by a Windows PC + 17" touchscreen TFT Hg lamp will be removed prior shipping
Coolant will be removed prior shipping
Batteries will be removed prior shipping no UPS installed. No printer installed. No MO-drive EOL: optical parts Last Time in production: 05/24
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1
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249646
|
Canon |
3000i4 |
in Wafer Steppers
Canon FPA 3000 i4 Stepper :Configuration: left inline system;
8" wafer chuck;
no transportation locks available; major hardware and software changes in control system: EWS type changed to HP B180, O/S changed to HP-UX 10.20, original X-Terminal replaced by a Windows PC + 17" touchscreen TFT (see pictures) no UPS installed. No printer installed. No MO-drive. EOL: optical parts
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1
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249647
|
Canon |
3000i4 |
in Wafer Steppers
Canon FPA 3000 i4 Stepper :Configuration: left inline system;
8" wafer chuck;
no transportation locks available; major hardware and software changes in control system: EWS type changed to HP B180, O/S changed to HP-UX 10.20, original X-Terminal replaced by a Windows PC + 17" touchscreen TFT (see pictures) no UPS installed. No printer installed. No MO-drive EOL: optical parts
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1
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253086
|
TEXUS CO., LTD. |
TOSOK_DBD4200 |
in ALL CATEGORIES
CAP BOND_TOSOK DBD4200R_CTS004:CAP BOND_TOSOK DBD4200R_CTS004
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1
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252763
|
INGERSOLL-RAND AIR |
2CV26MX3 |
in ALL CATEGORIES
Centrifugal Compressor:Centrifugal Compressor 11-1 & 11-2 320008009463
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2
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250877
|
CeraCon GmbH |
CeraTHERM stack M |
in ALL CATEGORIES
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1
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245179
|
NGK FILTECH |
MEGCON 2 |
in Wire Bonders
CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006:| CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006 |
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1
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245178
|
NGK FILTECH |
MEGCON 2 |
in Wire Bonders
CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003:| CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003 |
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1
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251189
|
Gardner Denver |
QUANTIMA Q52 |
in ALL CATEGORIES
Compressor 5-4:Compressor 5-4
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1
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207199
|
ASYS |
BC0 01 |
in ALL CATEGORIES
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
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1
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207200
|
ASYS |
BC0 02 |
in ALL CATEGORIES
Conveyor ASYS BC0 02:Conveyor ASYS BC0 02
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1
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207198
|
ASYS |
TRM02 |
in ALL CATEGORIES
Conveyor ASYS TRM02:Conveyor ASYS TRM02
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1
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253043
|
TEXUS CO., LTD. |
DBD-4010 |
in ALL CATEGORIES
DA_TOSOK DBD4010_TSD004:DA_TOSOK DBD4010_TSD004
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1
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254854
|
TEXUS CO., LTD. |
TOSOK DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4200_M33-DF10:DA_TOSOK DBD4200_M33-DF10
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1
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N* |
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253085
|
TEXUS CO., LTD. |
TOSOK DBD4200 |
in ALL CATEGORIES
DA_TOSOK DBD4200_TSD005:DA_TOSOK DBD4200_TSD005
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1
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244885
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
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1
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242288
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG106:DA_TOSOK DBD4600_TG106 Fluxdip
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1
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242289
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG107:DA_TOSOK DBD4600_TG107 Fluxdip
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1
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244630
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG109:DA_TOSOK DBD4600_TG109
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1
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242290
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG112:DA_TOSOK DBD4600_TG112 Fluxdip
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1
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244628
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG45:DA_TOSOK DBD4600_TG45
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1
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244627
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG76:DA_TOSOK DBD4600_TG76
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1
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244626
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG87:DA_TOSOK DBD4600_TG87
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1
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250283
|
BESI |
EVO2200 |
in ALL CATEGORIES
Die Bond Datacon 2200 evo:Model:EVO2200:Die Attach Bonder
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1
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€ 0.00 |
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242940
|
Kufner |
Batch Etching Basins |
in Wafer Cleaners
Dip-etch wet benchs:4x Dip-etch wet bench (1998) Complete dip acid etching unit manufactured by Kufner, Germany. The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing bonded si-wafers up to 80mm diameter. Delivery of additional accessories is possible. If there is a seriously buying interest, the technical specifications could be send.
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1
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239777
|
Hiller GmbH |
DP484/11012/FD HILLER DECAPRESS DP |
in ALL CATEGORIES
DP484/11012/FD HILLER DECAPRESS DP: - Technic special customized for Infineon? no
- Any damages/deficits known? no
- Manuals existing? yes
- Last time in production/function? 2022
- Any upgrades / extensions? no
- Any consumables at end of lifetime? not known
- Any refurbishments done? no
- Was there a significant system failure in the last three years? no
- Used: only for test
- Any contaminations known? Siliciumdioxid
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1
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247751
|
Driverless transport system |
in ALL CATEGORIES
Driverless transport system:Manufacturer: ATAP-IHC, Model: CX-01 Manufacturing date: Jul 05 Condition: good, complete, no damages Sales incl. reflectors and spare package Dimensions 1,2x0,6x0,5m Weight: 192 kg Anschluss: 230V-L1-N-PE Strom:16A Sicherung: C16A Nutzlast: 90kg
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2
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236443
|
DS-TEST 3sets X-Ray Machine scrap |
in ALL CATEGORIES
DS-TEST 3sets X-Ray Machine scrap:Based on VRFC2212 scraped plan, these machines already shortage for key parts and cannot support for normal production
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3
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250661
|
DYNAUDIO |
EMIT50 |
in Laboratory Equipment
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1
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251212
|
Eaton |
GSD200E/80 |
in Ion Implantation Equipment
Eaton GSD200E/80 Highcurrent:| Energy Config: | 0 - 80Kv Highcurrent | | Serialnumber: | 80517 | | Build Year: | 2000 | | Date of first usage: | begin of year 2001 | | Current Condition: | Good | | CE-Conformity: | Yes | | Cryo-Pumps: | CTI/Edwards Onboard; OB-8 + OB-10 fully refurbed included!! | | Cryo-Kompressor: | CTI 9650 Low-Voltage | | Turbo-Pumps: | Seiko STP A2203 fully refurbed included!! | | Terminal-Rough-Pump: | without (Edwards Config) | | Endstation Rough-Pump: | without (Edwards Config) | | Wafersize: | 200mm | | Disk-Type: | Si-coated Disk fully refurbed included!! | | Wafer-Cooling: | no Disk-Chiller included ! | | Gasbox: | 5-String, 4x Toxic-Low-Pressure | | String1: | PH3 SDS-Low-Pressure Type VCR 1/2"; MFC MKS-1640A; 5sccm-AsH3 | | String2: | BF3 SDS-Low-Pressure Type VCR 1/4"; MFC MKS-1640A; 5sccm-AsH3 | | String3: | AsH3 SDS-Low-Pressure Type VCR 1/2"; MFC MKS-1640A; 5sccm-AsH3 | | String4: | SIF4 Low-Pressure Type VCR 1/4"; MFC MKS-1640A; 5sccm-AsH3 | | String5: | Argon Carriergas; MFC Brooks GF120 10sccm-N2 | | Disk-Drive: | Direct-Drive | | Dose-Type: | Regular | | Source-Type: | ELS4 IHC-Source without Vaporizer | | Hghvoltage-Transformer: | dry | | Light-Tower: | red/yellow/green; no buzzer | | Main-Workstation | SUN Solaris AXI 3HE | | Second-Workstation | without | | Software-Version: | 6.13.5.1 (no license included) | | Network: | 24port 100MB Ethernet with Cisco Router-Kit | | Cell-Controller: | V6 Type | | Condition | tool run fully productive (24/7) between 15 and 80kv Energy until we switched it off on 07/2024 | | Availability | Immediately. Start of shipment at the earliest 8 weeks after receipt of payment due to decontamination, dismantling and packing of the tool. Depending on the availability of external service providers | | Notes: | slight corrosion spots on the frame, just a visual matter, see IMG_0810_n.jpg | | | Clean-Room Table on frontside not included | | | Original Lower Machine Front Panels not included (below the Table) | | | Rough-Pumps not included | | | Endstation Flowhood not included | | | Disk-Chiller not included | | | modified Plasma-Gun Power-Supply installed(TDK) | | | Minor modifications on tool | | | No Manual-Set/ no Spares | | | If required, tool can be inspected on site |
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1
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248130
|
EKRA |
Serio4000 |
in Semiconductor / Hybrid Assembly Equipment
EKRA Serio 4000:- Equipment for automated stencil printing
- Designed for automated input and output
- Printing format min 80x50mm, max 510x510
- Not suitable for manual loading and unloading
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1
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236878
|
ESEC3100 WIRE BONDER |
in ALL CATEGORIES
ESEC3100 WIRE BONDER:GT line scrap,9 sets of ESEC3100
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9
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253706
|
FC-05 scrap |
in ALL CATEGORIES
FC-05 scrap:FC-05 is the only MR1 old version mold type in DS, propose to scrap old version of FC-05.
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1
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221096
|
BESI Holland |
MK-1 |
in ALL CATEGORIES
FICO, Auto Mold System (AMS 24) 2p, MK-1:machine is Functioning
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1
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$ 54,000.00 |
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252846
|
Microcontrol |
Microcontrol 408 II |
in Production Equipment
Foil Peeling Tools / Detaper:Tools are under good condition. Tools are currently productive in Infineon Kulim. Bundle sale in 2 tools together = Euro 60k
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1
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€ 30,000.00 |
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248948
|
Webomatic |
System-4000 |
in ALL CATEGORIES
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1
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221743
|
Mitutoyo |
QVT1-X606P1L-D |
in Optical Test & Measurement Equipment
For Sale! Mitutoyo CNC Vision Measuring Machine :In use until October 2020, when it was phased out from production. Since then, it's stored in a dry and heated environment. Besides minor marks and scratches caused by trolleys, it's in an excellent condition. It was maintained regularly by site maintenance, and went through yearly inspection by OEM, including calibration. Standard machine, with special adapter plates used at Infineon. It's with software for series production, able to measure multiple modules in row. Saves date to local CSV file format and writing measurement data to Orbit system., Possibility to upgrade tactile measuring function!
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1
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€ 55,000.00 |
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253002
|
Delta Design |
MATRIX DM8880 |
in Device Handlers
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1
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244946
|
Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I04:HANDLER_ISMECA NX32W_T-I04
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1
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244947
|
Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I05:HANDLER_ISMECA NX32W_T-I05
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1
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244888
|
Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I06:HANDLER_ISMECA NX32W_T-I06
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1
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244893
|
Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I07:HANDLER_ISMECA NX32W_T-I07
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1
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253082
|
Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I11:HANDLER_ISMECA NX32W_T-I11
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1
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244890
|
Ismeca |
NX32W |
in ALL CATEGORIES
HANDLER_ISMECA NX32W_T-I12:| HANDLER_ISMECA NX32W_T-I12 |
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1
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252923
|
Multitest |
MT8589 |
in Device Handlers
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1
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252922
|
Multitest |
MT8589 |
in Device Handlers
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1
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252926
|
Rasco |
SO1000T |
in Device Handlers
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1
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252925
|
Rasco |
SO1800T |
in Device Handlers
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1
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252924
|
Rasco |
SO1800T |
in Device Handlers
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1
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249594
|
PVA |
MOV511 |
in Vacuum Process Equipment
Heat alloying system (1999):Complete alloying unit manufactured by PVA Vakuum Anlagenbau (Germany). The system is still in use, therefore there is the possibility for a sale on inspection. Delivery of additional accessories is possible. If there is a seriously buying interest, the technical specifications could be send.
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250829
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Heina TT2-1000/1000 |
in Production Equipment
Heina TT2-1000/1000:Two 100cm drums installed Last time in operation in 07/2024 No damages
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238643
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PVA TePla |
TWIN |
in Wafer Fabrication Equipment
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1
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253974
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INLINER MACHINE Scrap |
in ALL CATEGORIES
INLINER MACHINE Scrap:The capacity has been reduced from Oct’24 onwards.
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1
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248938
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Kardex |
Shuttle XP |
in ALL CATEGORIES
Kardex Shuttle Xp:Kardex Shuttle XP with many Trays
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1
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221102
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BESI |
X-Eye SF160 SL |
in ALL CATEGORIES
KETECA, X-Eye SF160 SL, A-SFS16FDAL170N2D735, XRAY:Function , needed motor vacuum to up this machine |
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$ 22,800.00 |
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242857
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KLA |
eS32 |
in Test & Measurement Equipment
KLA eS32 E-beam Wafer Inspection 200mm:eS32 is a top-of-the-line mask and wafer inspection equipment that is designed to meet the most stringent quality standards for semiconductor product manufacturing. This system provides comprehensive, high-resolution inspection of both masks and wafers with unparalleled accuracy. The unit uses a proprietary optical probe to scan masks and wafers to detect defects and irregularities with a resolution reaching down to 1 micron. This high-precision scanning allows for comprehensive inspection of the entire surface of both the mask and wafer. The machine also includes powerful image processing and analysis algorithms which automatically detect defects, categorize them, and track their locations. KLA eS32 also includes a suite of automated defect correction tools which can rapidly repair standard and complex defects. In addition to its exhaustive defect detection capabilities, this tool also allows for statistical process control (SPC) analysis to ensure production processes maintain consistent quality and accuracy over time. TENCOR ES 32 also includes a user-friendly interface that makes it easy to operate and manage the asset. This user interface is highly customizable, allowing users to quickly change model settings, view detailed inspection reports, and receive real-time notifications of detected defects. In summary, KLA ES 32 is a high-performance mask and wafer inspection equipment that offers superior detection accuracy, automated defect correction, comprehensive statistical process control (SPC) analysis, and an easy-to-use user interface. This system can be used to monitor production lines, resulting in improved manufacturing quality, increased yield, and cost savings.
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251862
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LAM Research Corp. |
SEZ203 |
in Wet Processing Equipment
LAM SEZ203:Completeness partial - Z80 missing - CDS not running - Tool is EOL
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1
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251863
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LAM Research Corp. |
SEZ203 |
in Wet Processing Equipment
LAM SEZ203:Completeness partial - Z80 missing - Tool is EOL
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1
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244197
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Hanmi Semiconductor |
Laser Cleaning 1.0 |
in ALL CATEGORIES
LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001:LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001
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244796
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Keteca |
KETECA PP200 |
in ALL CATEGORIES
LASER MARK_P&P KETECA PP200_LM07:| LASER MARK_P&P KETECA PP200_LM07 |
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242433
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Keteca |
Keteca PP200 |
in ALL CATEGORIES
LASER MARK_P&P KETECA PP200_LM08:| LASER MARK_P&P KETECA PP200_LM08 |
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1
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205912
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Matrix Corp |
Matrix X3 |
in Metrology Equipment
Matrix X3 X-Ray System:high speed X-Ray system
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1
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253046
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L & G Technology |
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in ALL CATEGORIES
Memmert Oven:Memmert Oven
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253059
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TCS Oberreuther AG |
MEMMERT_UFE800 |
in ALL CATEGORIES
Memmert Oven 800 SO:Memmert Oven 800 SO
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1
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253092
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BESI |
FICO_AMS11MR2 |
in ALL CATEGORIES
MOLD_BESI FICO AMS-11-MR2_MP44:MOLD_BESI FICO AMS-11-MR2_MP44
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1
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253091
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BESI |
FICO_AMS11MR |
in ALL CATEGORIES
MOLD_FICO FICO AMS-11-MR1_MP23:MOLD_FICO FICO AMS-11-MR1_MP23
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1
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207180
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Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
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1
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237930
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Nomura Micro Science |
NDB-3 |
in ALL CATEGORIES
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2
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223074
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Novellus Systems |
Concept Two SPEED |
in Chemical Vapor Deposition Equipment
Novellus Concept Two SPEED (shrink):1 Mainframe w/ 3 Chambers Damages/Deficites: Chamber Turbo Pumps & HF/LF Generators
EOL: Turbo Pumps no significant failures between last 3 years
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1
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243581
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Olympus |
Olympus BH-2II |
in Laboratory Equipment
OM Olympus BH-2II:completeness: partial
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243683
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Olympus |
BH2 |
in Laboratory Equipment
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1
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243582
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Zeiss |
Zeiss 475052 |
in Laboratory Equipment
OM Zeiss 475052:Completeness: Partial
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1
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253087
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L & G Technology |
MENMERT_ULP800 |
in ALL CATEGORIES
Oven Heraeus Heating & Drying Mdl:UT6060 - SOT223:Oven Heraeus Heating & Drying Mdl:UT6060 - SOT223
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1
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254478
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Oven-2 Scrap |
in ALL CATEGORIES
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1
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N* |
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192280
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Over Head Transport System (OHT) SRC320 |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320:
A high quantity of SRC 320 parts.
- SRC320 Vehicles (~50 pc.)
- SRC320 SCPS-ZCU
- SRC320 ICC
- SRC320 PDU
- SRC320 Rail parts
- Foup Handler Stocker
Please get in touch with the Equipment Trade Category Manager to get more information or price lists.
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242852
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KVA GmbH |
automatisierte Si-Pellets Ätzbank |
in Wafer Cleaners
Pellet Edge Batch Etch Tool:Automtic dip-etch bench (2014) Complete dip acid etching unit manufactured by KVA, Austria. The system is still in use, therefore there is the possibility for a sale on inspection. Capable of processing semiconductor devices (Diode, Thyristor) up to 58 mm, delivery of additional accessories is possible. If there is a seriously buying interest, the technical specifications could be send
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1
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254180
|
Pick and Place Scrap |
in ALL CATEGORIES
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1
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N* |
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246288
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Suki Technology Sdn. |
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in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI001:POST MOLD INSPECTION_SUKI TECH_PMI001
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