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Item ID |
Short Description |
Product Type / Details |
#
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Price |
Notes |
| Make |
Model |
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208163
|
Ingenious Equipment |
NA |
in ALL CATEGORIES
100% VI Station:Motorized Indexer for 100%VI Station after Taping + PLC Controller
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1
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208164
|
Ingenious Equipment |
NA |
in ALL CATEGORIES
100% VI Station:Motorized Indexer for 100%VI Station after Taping + PLC Controller
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1
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208165
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Ingenious Equipment |
NA |
in ALL CATEGORIES
100% VI Station:Motorized Indexer for 100%VI Station after Taping + PLC Controller
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1
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212160
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P & P Tech |
NA |
in ALL CATEGORIES
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1
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203808
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2 SET FICO AMS-11-MR MOLDING |
in ALL CATEGORIES
2 SET FICO AMS-11-MR MOLDING:| FICO AMS-11-MR MOLDING 10005450/10006825 |
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2
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lot
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¥ 8,775,312.00 |
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203088
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2 set of inline tester |
in Automatic Test Equipment
2 set of inline tester:2 set of inline tester asset no:10005027 & 10005029 LOCATION: Wuxi
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2
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¥ 5,787,004.00 |
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209845
|
200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
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1
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€ 1,000.00 |
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203803
|
Shinkawa |
ACB35 |
in Wire Bonders
3 sets of SHINKAWA ACB35 WIRE BOND:SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052
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3
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lot
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¥ 2,443,263.00 |
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204578
|
Orbotech |
Ultra Discovery VM |
in Metrology Equipment
AOI Orbotech Ultra Discovery VM:Simple, Intelligent, Powerful Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production. Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time. Benefits - High throughput and superior detection with minimal number of false calls
- Especially designed for inspection of the finest lines down to 10μm
- Quick set-up even for the most complicated jobs for higher productivity
- Automation ready
- Very high uptime
SIP TechnologyTM Push-to-Scan®: - A ‘no set-up’ process
- Top AOI results with minimal effort or training
- The easiest, user-friendly interface (GUI)
- Full ‘Step and Repeat’ functions
Visual Intelligence: Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want. Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects. Visual Intelligence: - Full panel understanding, context-based detection engine
- Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed
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1
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$ 24,900.00 |
F* |
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208202
|
ASM |
Epsilon 3200 |
in Epitaxial Reactors
ASM Epsilon 3200 (Infineon EPI42):ASM Epsilon 3200 build in 2010 with Asyst Handler 300mm tool in excellent condition Still installed in a cleanroom in our site Villach/Austria. Full inspection possible. Was used with Arsen and will decontaminated before de-Installation. This is one of two available tools Please feel free to arrange an inspection date for both. Infineon internal ID: EPI 42 Please note kindly the ET Item ID: 208202 Sale is offered on condition as and where is
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1
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208203
|
ASM |
Epsilon 3200 |
in Epitaxial Reactors
ASM Epsilon 3200 (Infineon EPI44):ASM Epsilon 3200 build in September 2011 with Spartan handler 300 mm tool in excellent condition Still installed in a cleanroom in our site Villach/Austria. Full inspection possible Was used with Arsen and will decontaminated before de-Installation This is one of two available tools Please feel free to arrange an inspection date for both Infineon internal ID: EPI 44 Please note kindly the ET Item ID: 208203 Sale is offered on condition as and where is
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1
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213293
|
ASM |
Siplace CA4 |
in Flip Chip Bonders
ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20
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1
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211895
|
P&P TECH |
PP.103 |
in Semiconductor / Hybrid Assembly Equipment
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1
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F* |
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211896
|
P&P TECH |
PP.103 |
in Semiconductor / Hybrid Assembly Equipment
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1
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205023
|
Axcelis Technologies |
Fusion PS3 |
in Lithography Equipment
Axcelis Fusion PS3: UV Bake, UV Harden / Photostabalizer With 2 Chambers UV bake.
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1
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€ 99,000.00 |
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204380
|
Infineon |
Bruchless Motor bench |
in Test & Measurement Equipment
Bruchless Motor bench:Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).For more informations please refer to the enclosed diagram and the motor description below. Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)This three-phase motor works with the Kelly controller (described below) • Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts) • Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center. • This is a 4 pole motor (8 magnets). • The Phase to Phase winding resistance is 0.013 Ohms. • The maximum recommended rotor speed is 5000 RPM. • Voltages from 0 to 96 VDC input to the control. • Torque constant of 0.15 Nm per Amp • The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase. • Armature Inertia is 45 Kg Cm Squared. • Continuous current of 125 Amps AC (180 Amps DC into the motor control). • Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control). • Weight of 35 pounds. • Peak Stall Torque of 90 Nm (66 ft). • This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise). Kelly KBL72301,24-72V,300A,BLDC Controller/With RegenKelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control. Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily. Features: • Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency. • Electronic reversing. • Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V. • Current sense on all 3 motor phases.Current control loop. • Hardware over current protection.Hardware over voltage protection. • Support torque mode, speed mode, and balanced mode operation. • Configurable limit for motor current and battery current. • Low EMC.LED fault code. • Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage. • Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal. • Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.
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1
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lot
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210272
|
Bruker |
Fabline D8 |
in Spectrometers
Bruker Fabline D8 :Röntgendiffraktometer zur Messung hochauflösender Röntgenbeugung und Röntgenreflektion mit CU-KA Anode für 6" und 8" Wafer X-Ray Diffractometer for measuring high resolution X-ray Diffraction and Reflection applications with a Cu-kA Anode for 6 and 8 inch wafers Still in production. Ready for inspection.
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1
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F* |
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166465
|
Oxford Instruments |
CMI 950 |
in Spectrometers
CMI 950 - Xray fluorescence spectrometer:X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc. Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag). System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
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1
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F* |
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216059
|
Dainippon Screen |
SC-80BW-AV |
in Photoresist Coater Tracks
Coater Dainippon Screen:B608 Coater with 2 Coater Units 4 Coolplates 7 Hotplates 2 HMDS Plates
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1
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N* |
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207199
|
ASYS |
BC0 01 |
in ALL CATEGORIES
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
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1
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207198
|
ASYS |
TRM02 |
in ALL CATEGORIES
Conveyor ASYS TRM02:Conveyor ASYS TRM02
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1
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204220
|
Cyberscan CT350T Dual non-contact double-sided optical profilometer |
in ALL CATEGORIES
Cyberscan CT350T Dual non-contact double-sided optical profilometer:2 Tools - DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE Tools are still running in production. Available from May/June 2019 Inspection possible! The tools are pretty new and rarely used. Vintage 2018 and 2015 The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken. Please be invited to take a look at the pictures.
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2
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F* |
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215559
|
Dainippon Screen |
SD-80BW-AVPE |
in Photoresist Develop Track Systems
Developer Dainippon Screen:E609 Developer with 3 developer units, Hotplates, Coolplates and Edge Exposure Unit
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1
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N* |
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215693
|
Dainippon Screen |
SD-80BW-AVP |
in Photoresist Develop Track Systems
Developer Dainippon Screen:E619 Developer with 3 Developer Units, 9 Hotplates and 4 Coolplates.
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1
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N* |
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211696
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
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1
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211698
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
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1
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211699
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
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1
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211697
|
tosok |
Tosok DBD3550R |
in Eutectic Die Bonders
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1
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195189
|
Drilling machine bernhard steinel |
in Laboratory Equipment
Drilling machine bernhard steinel:Already damaged loses function, was unable to repair.
LOCATION: Wuxi
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1
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€ 0.00 |
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207727
|
ECA Advance Automati |
EC328FP |
in Device Handlers
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1
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204177
|
ESEC |
ESEC 3006 |
in Wire Bonders
ESEC 3006 Wire Bonder:ESEC 3006 Wire Bonder_EW024
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1
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204178
|
ESEC |
ESEC 3006 |
in Wire Bonders
ESEC 3006 Wire Bonder:ESEC 3006 Wire Bonder_EW123
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1
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204179
|
ESEC |
ESEC 3006 |
in Wire Bonders
ESEC 3006 Wire Bonder:ESEC 3006 Wire Bonder_EW127
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1
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213366
|
ESEC 3088 Wire Bonder |
in Wire Bonders
ESEC 3088 Wire Bonder:| ESEC 3088 Wire Bonder | PO5627 | | ESEC 3088 Wire Bonder | PO5627 | | ESEC 3088 Wire Bonder | Transfer AG | | ESEC 3088 Wire Bonder | 200810209;transfer in from IFAG | | ESEC 3088 Wire Bonder | PO NO 200410327 BNE NO 20040009W | | ESEC 3088 Wire Bonder | Transfer AG | | ESEC 3088 wirebonder | 8500043290;transfer from IFAG;661001544 |
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7
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200489
|
ESEC |
ESEC3088 |
in Wire Bonders
ESEC3088 WireBonder 2 sets:ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823 LOCATION: Wuxi
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2
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202692
|
EVG820 Dry Film Lamination System |
in ALL CATEGORIES
EVG820 Dry Film Lamination System:The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.
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1
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$ 55,000.00 |
|
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210404
|
Suss MicroTec |
Falcon Polyimid Developer |
in Photoresist Develop Track Systems
Fairchild Developer Ent3C:Developer with 2 chambers for spray developing.
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1
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206584
|
Fico AMS-11-MR Molding |
in ALL CATEGORIES
Fico AMS-11-MR Molding:| Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 10004762 | Inline VI WorkStation | Transfer AG | CC LINE 21 | VIF-19 | | 10004924 | Fico AMS-11-MR Molding | Transfer AG, PO#200710494 | CC LINE 21 | INF6312182 | | 10005047 | Buffer | 200710495;A-07-3040-37-C017-T-01;IFAG#633451493 | CC LINE 21 | BF-048 | | 10004763 | Inline VI WorkStation | Transfer AG | CC LINE 21 | VIB-19 |
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4
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¥ 4,052,063.00 |
F* |
|
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207622
|
FICO AMS-11-MR MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING:| Asset | SNo. | Asset name | Asset name2 | Physical Location | Serial no. | | 10006073 | 0 | FICO AMS-11-MR MOLDING | 201010012;Mal transfer DS line;inv#6JM/00883 | 108 1FASSY | 5133182FC18 |
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1
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¥ 4,910,590.66 |
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210403
|
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING |
in Semiconductor / Hybrid Assembly Equipment
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING:| 10005234 | 0 | FICO AMS-11-MR MOLDING | 200810208;IFMAL#6JM/00360;with NBV transferin | | 10005234 | 1 | Fico Mold Die | 201010233;Mal transfer DS line;inv#6JM/00771 | | 10005343 | 0 | FICO AMS-11-MR2 MOLDING | 200810443;transfer in from IFMY | | 10007325 | 1 | FICO MOLD DIE | 8500040046;transfer from IFMY; 6JM/00109 | | 10007325 | 2 | CIQ & Freight: FICO AMS-11-MR2 MOLDING | 8500040046;transfer from IFMY; 6JM/00109 | | 10005732 | 0 | FICO AMS-11-MR MOLDING | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 1 | Fico Mold Die | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 2 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 3 | CIQ inspect fee in Malacca | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10005732 | 4 | SCD80 M2 FICO Molding-upgrade SOT343 | 201010228;A-10-3040-37-D008-T-06; inv#6JM/00520 | | 10007592 | 0 | FICO AMS-11-MR MOLDING | 8500045354;transfer from IFMY; 6JM/00645 | | 10007592 | 1 | Fico Mold Die | 8500045354;transfer from IFMY; 6JM/00645 | | 10007592 | 2 | CURING OVEN | 8500045354;transfer from IFMY; 6JM/00645 | | 10007592 | 3 | CIQ & freight: FICO AMS-11-MR MOLDING | 8500045354;transfer from IFMY; 6JM/00645 |
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4
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F* |
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207724
|
Iwashita Instruments |
IWASHITA MG Inline 3030 |
in ALL CATEGORIES
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1
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211897
|
Fuji Seiki |
ECB 10016 |
in ALL CATEGORIES
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1
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F* |
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212062
|
Kokusai |
DD-853V |
in LPCVD Furnaces
Furnance Hitachi Vertron III:Ofen V24D Hitachi Kokusai Vertron III Phosdep Process Tool still in production. Coming out around September 2020!
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1
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212048
|
Kokusai |
DD-853V |
in LPCVD Furnaces
Furnance Vertron III Hitachi Kokusai:Ofen V17D Hitachi Kokusai Vertron III Phosdep Process Tool still in production. Coming out around September 2020!
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1
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211992
|
Kokusai |
DJ-835V |
in LPCVD Furnaces
Furnance Vertron V Hitachi Kokusai:Ofen V16D Hitachi Kokusai Vertron V Doped Poly Process Tool still in production. Coming out around September 2020!
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1
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203804
|
Heraeus Oven & Oven Table |
in Wire Bonders
Heraeus Oven & Oven Table:Heraeus Oven & Oven Table | 10002755 Oven | | 10004959 Oven Table |
|
2
|
lot
|
¥ 31,003.00 |
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214949
|
HMI E SCANLIGHT - EBEAM |
in Metrology Equipment
HMI E SCANLIGHT - EBEAM:200/300mm Bridge Tool, Last audit health status report available
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1
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N* |
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202596
|
INGERSOLL RAND heat reactivated regenerative air dryers |
in ALL CATEGORIES
INGERSOLL RAND heat reactivated regenerative air dryers:INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846 LOCATION: Wuxi
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1
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¥ 391,740.00 |
|
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212377
|
INLINER MACHINE,Trim & Form Machine |
in Automatic Test Equipment
INLINER MACHINE,Trim & Form Machine:| 10007053 | 0 | INLINER MACHINE | 8500035930;transfer asset from IFMY; 6JM/00922 | | 10007053 | 1 | freight: INLINER MACHINE | 8500035930;transfer asset from IFMY; 04011117 | | 10007053 | 2 | CIQ fee and freight: INLINER MACHINE | 8500035930;transfer asset from IFMY; 6JM/00922 | | 10004706 | 0 | Trim & Form Machine | Transfer MY | | 10004706 | 1 | Trim & Form Machine | 0 | | 10004706 | 2 | Cut & Bending Tool | Transfer MY | | 10006652 | 0 | TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 | | 10006652 | 1 | customs duty: TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 | | 10006652 | 2 | hookup: TRIM&FORM MACHINE | 8500029675;transfer from IFMY;INV# 6JM/00192 |
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3
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204631
|
Lauffer Mold Press |
in Semiconductor / Hybrid Assembly Equipment
Lauffer Mold Press :Lauffer Mold Press/100050250 Mold-Die, 5% Mark up from MY/100050251 CURING OVEN/100050260
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2
|
|
¥ 2,526,419.44 |
|
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204582
|
Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine |
in ALL CATEGORIES
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1
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F* |
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205912
|
Matrix Corp |
Matrix X3 |
in Metrology Equipment
Matrix X3 X-Ray System:high speed X-Ray system
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1
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212157
|
Fico Besi |
AMS-11-MR |
in ALL CATEGORIES
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1
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212408
|
Fico Besi |
AMS-11-MR |
in ALL CATEGORIES
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1
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155055
|
Hitachi |
VP-1500 |
in Laboratory Equipment
MONOCHROME COPIER:MONOCHROME COPIERMONOCHROME COPIERLOCATION: Malacca SERIAL NUMBER(S): TA0101513
|
1
|
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€ 2,662.70 |
|
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209427
|
Multitest |
MT8589 |
in Device Handlers
|
1
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F* |
|
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209428
|
Multitest |
MT8589 |
in Device Handlers
|
1
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F* |
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208162
|
FICO |
AMS-11-MR2 |
in Semiconductor / Hybrid Assembly Equipment
Multiplunger AMS-11-MR2 :Multiplunger AMS-11-MR2
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1
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147228
|
Multitest |
MT8502 |
in Device Handlers
Multitest MT8502 TriTemp gravity Handler:Multitest MT8502 TriTemp gravity HandlerMultitest MT8502 TriTemp gravity HandlerLOCATION: MchC SERIAL NUMBER(S): na
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1
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F* |
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198620
|
Nabertherm Furnance |
in ALL CATEGORIES
Nabertherm Furnance:Furnance PLC controlled with touch screen
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1
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207180
|
Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
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1
|
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€ 50,000.00 |
F* |
|
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203189
|
NexGen Technologies |
Nexgen Prober 2013 Model |
in Wafer Probers
NEXGEN SEMI AUTOMATIC PROBER:NexGen semi-automatic proberfor 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.More information available below and on the enclosed flyer : Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec ZStage/Chuck - Range : 0.200" (other configurations available) - Speed : 11 ms Loader (Wafer Handler)- Cassette capacity : 2 Standard; 1 sender, 1 receiver - Wafer handling : Belt and vacuum arm - Fine alignment : CCD Image Processing - Hard Disk Drive : 60 -250 gig - Disk Drives : USB, CD/RW, DVD Writer - Display : 22" Color Screen Monitor - Power consumption (included) : 1.5 KVA Facilities Required- Air : 75 PSI @ 3 CFM - Vacuum : 25in/hg - Dimensions | Inches | Cm | | 48"w x 32"d x 60"h | 115 (L) x 80 (l) x 140 (h) |
- Weight
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1
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202453
|
Nitto Denko |
Nitto MSA840 |
in Production Equipment
Nitto MSA840 Mounting Machine 10004095:Nitto MSA840 Mounting Machine
|
1
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€ 53,281.00 |
|
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192280
|
Over Head Transport System (OHT) SRC320 / SRC300 / LIM |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320 / SRC300 / LIM :
A high quantity of straigths, curves, course taker and other tracks
Please get in touch with the Equipment Trade Commodity Manager to get more information or price lists.
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1
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199832
|
Applied Materials |
P5000 |
in Chemical Vapor Deposition Equipment
P5000 Deposition Tool:4 Chambers
CVD standard Chambers
SNIT
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1
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209403
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool :CVD Tool with 4 Chambers
2 Chambers Etch, 2 Chambers CVD
SILAN
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1
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209423
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500045:4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos
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1
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209425
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500049:4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos
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1
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209426
|
Applied Materials |
P5000 |
in Production Tools
P5000 Depositiontool P500052:3 Chambers
A,B and D, CVD Universal Chambers
SNIT
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1
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213168
|
Peter-Wolters |
Gemini P200 |
in Chemical Mechanical Planarization Equipment
Peter Wolters Gemini P200:8" Wafersize; Cleanertype: SSEC, different upgrades (e.g. McMillan Flowcontroller instead Slurrypump) Last Process: Tungsten-Polish
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1
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211627
|
Ultimate Technology |
Enercon / Dyne-A-Mite IT |
in Plasma Processing Equipment
|
1
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|
€ 29,514.17 |
F* |
|
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212158
|
Memmert Gmbh+Co |
ULP800 |
in Ovens
|
1
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212159
|
Memmert Gmbh+Co |
ULP800 |
in Ovens
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1
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204583
|
Process Photonics LaserDrilling/Cutting Tool |
in ALL CATEGORIES
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1
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204584
|
PPI Systems Inc. |
FP-C2 |
in ALL CATEGORIES
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1
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208138
|
Sanyo |
MDF-U5411 |
in ALL CATEGORIES
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1
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209409
|
Rucker & Kolls |
680A |
in Wafer Probers
SEMI AUTOMATIC PROBE STATION 6" RUCKER&KOLLS: Wafer Size:6"Probe station, 6"
Ni-plated vacuum chuck
Automatic stepping
Motorized X-Y stage
stereo zoom microscope
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1
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158359
|
Shinkawa |
ACB35 |
in Ball Bonders
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1
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158364
|
Shinkawa |
ACB35 |
in Ball Bonders
|
1
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F* |
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207381
|
SHINKAWA ACB35 WIRE BOND |
in Wire Bonders
SHINKAWA ACB35 WIRE BOND:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F371 | 10006475 | SHINKAWA ACB35 WIRE BOND | 8500018759;transfer from IFMY;inv# 6JM/00925 | 108 1F ASSY | F0-36534 S23 |
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1
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¥ 932,760.30 |
|
|
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204719
|
SHINKAWA ACB35 Wire Bond |
in Wire Bonders
SHINKAWA ACB35 Wire Bond:| 100060530 | SHINKAWA ACB35 Wire Bond | | 100068240 | VISUAL INSPECTION SYSTEM | | 100068241 | hookup: VISUAL INSPECTION SYSTEM | | 100073050 | VISION INSPECTION MACHINE |
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3
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¥ 1,368,926.41 |
|
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|
199782
|
Shinkawa |
ACB35 |
in Ball Bonders
SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi
|
4
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|
203821
|
Shinkawa |
ACB400 |
in Wire Bonders
SHINKAWA ACB400 WIRE BOND:SHINKAWA WIRE BOND ACB400 10007322 WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT LOCATION: Wuxi
|
1
|
|
¥ 953,057.50 |
|
|
|
210121
|
SHINKAWA WIRE BOND ACB35 |
in Wire Bonders
SHINKAWA WIRE BOND ACB35:| SHINKAWA WIRE BOND ACB35 | 8500045110;transfer from IFMY; 6JM/00582 | | COPPER WIRE KIT | 8500046709;A-12-3040-37-D035-A-01;17019553 |
|
4
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210122
|
SHINKAWA WIRE BOND ACB400 |
in Wire Bonders
SHINKAWA WIRE BOND ACB400:| SHINKAWA WIRE BOND ACB400 | 8500033675;transfer asset from IFMY; 6JM/01022 | | COPPER WIRE KIT | 8500028533/31676/35022;A-12-3040-37-D006-A-01;2301 |
LOCATION: Wuxi
|
4
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203807
|
SIENMENS Backside Laser Machine |
in ALL CATEGORIES
SIENMENS Backside Laser Machine:| SIENMENS Backside Laser Machine 10004655 |
|
1
|
|
¥ 554,552.00 |
|
|
|
209844
|
Applied Materials |
Centura Polygen |
in Diffusion Furnaces
SiN (Polygen Chamber, AMAT Centura):SiN (Polygen Chamber, AMAT Centura) with 1 complete chamber, but not working do to "water leak detect" - cooling water leak 1 gas cabinet 1 remote cabinet
|
1
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F* |
|
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207181
|
EKRA |
E4 |
in ALL CATEGORIES
Solder Paste Printer Ekra E4:Solder Paste Printer Ekra E4
|
1
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207182
|
EKRA |
Solder Paste Printer Ekra X5 |
in ALL CATEGORIES
Solder Paste Printer Ekra X5:Solder Paste Printer Ekra X5
|
1
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207356
|
SPEA Tester |
in ALL CATEGORIES
SPEA Tester:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F405 | 10004286 | SPEA C320MX Tester | PO 200510501 BNE A-05-3040-41-P005-T-02 | CC FCOS | RAE074CC | | 9F405 | 10004379 | SPEA C320MX Tester | 200610235 a-06-3040-37-c004-a-01 | CC FCOS | RAG087CC | | 9F405 | 10004379 | freight for SPEA comptest 320-MX-32 | 200610235 a-06-3040-37-c004-a-01 | CC FCOS | 0 | | 9F405 | 10004602 | SPEA C320MX Tester | Transfer AG, PO#200710213 | CC FCOS | RAE076CC | | 9F405 | 10004646 | SPEA C320MX Tester | Transfer AG | CC FCOS | RAE077CC |
|
4
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|
¥ 7,488,255.14 |
|
|
|
208137
|
Hanmi Semiconductor |
SPLITTING SYSTEM |
in ALL CATEGORIES
|
1
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202601
|
Teradyne |
J971-61 SML 256CH1TH |
in Device Testers
Teradyne J971:Tool in good condition. Stored in Warehouse. Tool will be released from Infineon for sale by end of 2020.
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1
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209422
|
Terradyne |
CAT-004 |
in Test & Measurement Equipment
Terradyne Catalyst Tester:CAT-004 Catalyst Mixes Signal Tool still continuously running in production After the tester was not in use 2015 (1-yr cold steel), it was refurbished at ATP. For Details please take a look to the pictures
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1
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206570
|
TEST EQUIPMENT(QS) OQA related |
in ALL CATEGORIES
TEST EQUIPMENT(QS) OQA related:| Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 10003427 | 4395A-RS/RF TESTER | PO 200210136 BNE 20020006W | 117 1F OQA ROOM | 0 | | 10008752 | ITC55100 Avalanche Tester | 8500065361;6JM/00741 | DS 117 1F OQA | 10113 | | 10006360 | RF/RS 2-TEST EQUIPMENT(QS) (OLD)4195A | 8500013980;transfer line from IFMY;inv#6JM/00859 | 117 1F OQA ROOM | 2904J01823 | | 10006305 | Test Fixture (OLD) | 8500016782;TRANSFER FROM IFMY;inv# 6JM/00494-496 | 117 1F OQA ROOM | DS-TSFP4-CL |
|
4
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|
¥ 1,661,793.74 |
|
|
|
200892
|
Multitest |
MT2168 |
in ALL CATEGORIES
Test Tool ABC development project:
Test Tool from multitest was rarely used for development project ABC
- Excellent Condition (Basically new) - Complete (no missing parts)
- No Damages
LOCATION: Tijuana Mexico
Description: - Fully testing COOLiR2DIE at high current and voltage presents challenges for a test system and handler > Test team chose the LEMSYS test solution > Tester capability: 2000A/2000V for static and 2000A/1500V for dynamic testing - The handler choice was limited due to the package size and exposed die - Multitest with vertically docked pick & place handlers > A custom manipulator from ESMO was required to provide a working interface on a “headless” LEMSYS tester
|
1
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|
$ 98,000.00 |
|
|
|
207382
|
TOSOK DBD 3280/3310 Die Bond |
in Eutectic Die Bonders
TOSOK DBD 3280/3310 Die Bond:| Cost ctr. | Asset | Asset name | Asset name2 | Physical Location | Serial no. | | 9F371 | 10005747 | TOSOK DBD3280 Die Bond. | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | CIQ inspect fee in Malacca | 201010234;A-10-3040-37-D008-T-09; inv#6JM/00518 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key1(X-Y wafer holder unit) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key2(Mushroom) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F371 | 10005747 | Conversion key4(loader-unloader) | 8500011184;A-11-3040-37-D014-A-01;inv#07613299/300 | 108 1F ASSY | 169 T13 | | 9F375 | 10006006 | TOSOK DBD3310 Die Bond . | 8500008995;Mal transfer DS line;inv# 6JM/00057/65 | 108 1F ASSY | 295 T25 | | 9F375 | 10006006 | Ceramic heater(NRQ00010R) | 8500015375;A-11-3040-37-D030-A-01;inv#EG20110606 | 108 1F ASSY | 295 T25 | | 9F375 | 10005536 | TOSOK DBD3310 Die Bond . | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | | 9F375 | 10005536 | CIQ import inspection charge for TOSOK DBD3310 Die | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | | 9F375 | 10005536 | freight: TOSOK DBD3310 Die Bond 161 T26. | PO#201010006/Inv:6JM/00232 | 108 1F ASSY | 161 T26 | | 9F570 | 10006036 | TOSOK DBD3310 DIE BOND | 8500007255;Mal transfer DS line;inv# 6JM/00884 | 108 2F ASSY | 182-T86 |
|
4
|
|
¥ 8,799,723.91 |
|
|
|
192458
|
tosok |
|
in Eutectic Die Bonders
TOSOK DBD3200 Die Bond 161 T38 Training:Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38
|
1
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|
204630
|
TOSOK DBD3310 3280 DIE BOND |
in Eutectic Die Bonders
TOSOK DBD3310 3280 DIE BOND:TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748
|
4
|
|
¥ 6,569,652.00 |
|
|
|
210405
|
TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND |
in Eutectic Die Bonders
TOSOK DBD3310 DIE BOND &TOSOK DBD3310 DIE BOND:| 10004115 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | | 10004116 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | | 10004117 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | | 10004118 | 0 | TOSOK DBD3310 DIE BOND | PO 200510184 BNE A-05-3040-41-D004-T-05 | | 10005524 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | | 10005525 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | | 10005526 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | | 10005527 | 0 | TOSOK DBD3310 DIE BOND | PO#201010016/Inv:6JM/00231 | | 10005330 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | | 10005331 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | | 10005332 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | | 10005332 | 3 | Freight fee | 200810444;transfer in from IFMY | | 10005333 | 0 | TOSOK DBD3310 DIE BOND | 200810444;transfer in from IFMY | | 10006005 | 0 | TOSOK DBD3310 DIE BOND | 8500008995;Mal transfer DS line;inv# 6JM/00057/65 | | 10006005 | 1 | Ceramic heater(NRQ00010R) | 8500015375;A-11-3040-37-D030-A-01;inv#EG20110606 | | 10007405 | 0 | TOSOK DIE BOND DBD4200 | 8500041396;transfer from IFMY;INV# 6JM/00233 |
|
14
|
|
|
F* |
|
|
199781
|
tosok |
3310 |
in Epoxy Die Bonders
TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi
|
4
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