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Item ID |
Short Description |
Product Type / Details |
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Price |
Notes |
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Model |
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253726
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15 sets TOSOK DBD4000 DIE BOND scrap |
in ALL CATEGORIES
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15
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255419
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ESEC |
2007 ESEC |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacture | | 205940 | 2007 | ESEC |
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1
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255584
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ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacturer | | 208424 | 2007 | ESEC |
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1
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255585
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ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacturer | | 2007 | ESEC |
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1
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255586
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:| Serial Number | Model | Manufacturer | | 204882 | 2007 | ESEC |
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1
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255587
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ESEC |
2007 |
in Flip Chip Bonders
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1
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255588
|
ESEC |
2007 |
in Flip Chip Bonders
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1
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256626
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:2007 ESEC Die Bonder
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1
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209845
|
200mm THIN WAFER Loader NSX |
in Test & Measurement Equipment
200mm THIN WAFER Loader NSX:200mm THIN WAFER Loader NSX “NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“
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1
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255416
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fujiwa |
250-70 |
in Semiconductor / Hybrid Assembly Equipment
250-70 FUJIWA / Mold Press:| Serial Number | Model | Manufacturer | | 2534 | 250-70 | FUJIWA |
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1
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257348
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AMAT |
DXZ/CXZ Chamber |
in Production Tools
3 DXZ/CXZ Chambers for Centura/P5000:3 DXZ/CXZ Chambers for Centura/P5000
Mainframe is transport rack
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1
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253291
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3 sets CLAMP INLINER MACHINE scrape |
in ALL CATEGORIES
3 sets CLAMP INLINER MACHINE scrape:| Asset | SNo. | Curr.net bk.val. | Asset name | | 304,008,003,531 | 0 | 0 | clamp inliner | | 304,008,003,531 | 1 | 0 | freight :clamp inliner | | 304,008,003,531 | 2 | 0 | CI Centering Vision System | | 304,008,003,531 | 3 | 0 | Intape Vision System | | 304,008,002,519 | 0 | 0 | CLAMP INLINER | | 304,008,002,519 | 1 | 0 | Incidental cost:CLAMP INLINER | | 304,008,002,519 | 4 | 0 | hookup: CLAMP INLINER | | 304,008,002,519 | 2 | 0 | 60 angel vision system | | 304,008,003,531 | 4 | 0 | 60 angel vision system | | 304,008,002,519 | 3 | 0 | Reverse Prevent Set | | 304,008,003,531 | 5 | 0 | Reverse Prevent Set | | 304,008,003,107 | 0 | 0 | CLAMP INLINER MACHINE | | 304,008,003,107 | 1 | 0 | CIQ& freight: CLAMP INLINER MACHINE | | 304,008,003,107 | 5 | 0 | CLAMP INLINER conversion kits(2017) | | 304,008,003,107 | 2 | 0 | Clamp Inliner conversion kits | | 304,008,003,107 | 3 | 0 | ?? for Clamp Inliner conversion kits | | 304,008,003,107 | 4 | 0 | CLAMP INLINER conversion kits(2017) |
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3
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256653
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Orthodyne |
360C |
in Wire Bonders
360C ORTHODYNE WIRE BONDER:360C ORTHODYNE WIRE BONDER
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1
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255589
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Orthodyne |
360C |
in Wire Bonders
360C ORTHODYNE Wire Bonder:360C ORTHODYNE Wire Bonder
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1
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247975
|
Nova |
SCAN-2040 |
in Metrology Equipment
4 x NOVA SCAN-2040 Measurement System:| NOVASCAN | SCAN-2040 | FILMTHICKNES | INSPECTION |
4 x Integriertes Ebara Measurement Systems and spare parts listed in file below
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1
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256655
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hull |
4216LP-D |
in Semiconductor / Hybrid Assembly Equipment
4216LP-D HULL_FINMAC DEFLASH:4216LP-D HULL_FINMAC DEFLASH
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1
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257112
|
Tesec |
4330IH |
in Wafer Testers
4330IH TESEC HOT & COLD TEST:4330IH TESEC HOT & COLD TEST
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1
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257113
|
Tesec |
4330IH |
in Wafer Testers
4330IH TESEC HOT & COLD TEST:4330IH TESEC HOT & COLD TEST
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1
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236797
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ACB35 scrap |
in ALL CATEGORIES
ACB35 scrap:S128-S131 machine Fix Asset scrap, based on OPC scrap plan,UTC5100 replace ACB35 machine
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4
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254741
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Veeco |
AFM-2 (METV44-1) |
in Wafer Manufacturing Metrology Equipment
AFM-2 (METV44-1) :Atomic Force Microscope (AFM)
An Atomic Force Microscope (AFM) measures topography, feature size, defects, and properties of solid surfaces. The Dimension X AFM provides depth metrology solutions.
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1
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256502
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LAM Research Corp. |
Allian |
in Cluster Plasma Tools
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1
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252024
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Applied Materials |
200mm Centura II |
in Cluster Plasma Tools
AMAT 200mm Centura II DXZx:Centura MF II Software: Vita Controller Indexer: Narrow Body / Tilt out mit Dummy Wafer Storage Robot: HP+ Chamber: A -> DPS+ B -> DPS+ C -> IPS D -> ASP+ E -> Single Cooldown F -> Orienter
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1
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239336
|
AMAT |
Centura EPI 8 inch |
in Epitaxial Reactors
AMAT Centura EPI 8 Zoll (#402):The system was completely overhauled by us with external service AMAT on site at that time!; Blower controls upgraded every 3 chambers; Approximately 4 years ago the Complete Gas Cabinet was upgraded from Legaty to Universal Gas Cabinet on site with the FA. AMAT upgraded costs €0.5 million; The facility has proprietary Modorized Lift 3x;
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1
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256746
|
AMAT |
HDP Centura |
in Production Tools
AMAT Centura HDP:Software: Win 10 OR 4000 WTM Controller 3x ENI Generator Racks Chiller INR-498-011D 2x Remote Monitor High Density Plasma Process Process Chambers: A,B,C Orienter chamber F
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1
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256339
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Varian |
|
in Ion Implantation Equipment
Amat E500:-Back end medium current Implanter - 100002956
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1
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259241
|
AMAT |
Back end Implanter Amat E500 |
in Ion Implantation Equipment
AMAT E500:| › Original Equipment Manufacturer? (Yes/No, if no please state the details ) | Yes | | › Exact Model Type? (Yes/No, if no please state the details ) | E500 EHP | | › OEM Serial ID? | ES193741 U2 | | › Completeness: Total/partial/Donor tool? Please list missing parts. | Total | | › Date of first usage? | NA | | › Technic special customized for Infineon? | NA | | › Correct maintained? | Yes | | › Any damages/deficits known? | No | | › Manuals existing? | No | | › Crated: If yes…/ professional with protocol / partly / simple? | No | | › Detailed Configuration/Specification of the tool | | | › Any upgrades / extensions? | Thin Wafer handling kit, Hydrogen implant, LX upgrade, Windown 7 OS | | › Useable for which products? | 8" Thin Taiko wafers | | › Wafer size (if applicable)? | 200mm | | › Any consumables at end of lifetime? | Yes (source, electrode) | | › Procured from OEM or from second hand? | From IR Singapore | | › Any refurbishments done? | No | | › Any doubts that the tool is failure free useable for the next three years? | Yes | | › Was there a significant system failure in the last three years? | No | | › Any contaminations known? | BF3, H2 | | › IFX inventory | 200016809 | | > Location | INFINEON KULIM FAB 2 LEVEL 3 PRODUCTION AREA CLEANROOM |
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1
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N* |
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204578
|
Orbotech |
Ultra Discovery VM |
in Metrology Equipment
AOI Orbotech Ultra Discovery VM:Simple, Intelligent, Powerful Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production. Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time. Benefits - High throughput and superior detection with minimal number of false calls
- Especially designed for inspection of the finest lines down to 10μm
- Quick set-up even for the most complicated jobs for higher productivity
- Automation ready
- Very high uptime
SIP TechnologyTM Push-to-Scan®: - A ‘no set-up’ process
- Top AOI results with minimal effort or training
- The easiest, user-friendly interface (GUI)
- Full ‘Step and Repeat’ functions
Visual Intelligence: Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want. Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects. Visual Intelligence: - Full panel understanding, context-based detection engine
- Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed
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1
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$ 24,900.00 |
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255422
|
Hewlett Packard |
AOT |
in Wafer Testers
AOT3 Bundle :-Tester AOT, Bundle sale preferred | AOT3-06 | AOT3-07 | AOT3-08 | AOT3-20 | | 3444A40234 | 3607A40332 | 3527A40287 | 30451 |
| AOT3-29 | AOT3-33 | AOT3-36 | AOT3-38 | | 30705 | 37978 | 40117 | 40128 |
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8
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lot
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255502
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Advance - OFENV06C:ASM Furnace Vertical - Advance 400 2 Reactors atmospheric
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1
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255500
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Vertical - OFENV01D:OFENV01D
Furnace with 2 Tubes 1x Reactor Dot. Poly Low Pressure 1x Reactor Atmosphere WET-OXID
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1
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255501
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Vertical - OFENV05C:ASM Furnace Vertical - Advance 400 2 Reactor atmospheric Robot defect and need service
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1
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255503
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Vertical OFENV06D:ASM Furnace Vertical - Advance 400 2x Reactor Dot. Poly Low Pressure
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1
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255504
|
ASM |
Advance 400 |
in Diffusion Furnaces
ASM Furnace Vertical OFENV07C:ASM Furnace Vertical 2 Reactor atmospheric Reactor 1 is missing heater cassette, Motor driver, Board and loader arm
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1
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250659
|
AUDIO PRECISION |
AUD-APX 525 B |
in Laboratory Equipment
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1
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250660
|
AUDIO PRECISION |
AUD-APX 525 B |
in Laboratory Equipment
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1
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252684
|
AXCELIS NV8200P |
in Ion Implantation Equipment
AXCELIS NV8200P:-MCINV8201 › Original Equipment Manufacturer? Axcelis › Exact Model Type? AXCELIS MEDIUM CURRENT NV8200 › OEM Serial ID? › Current Condition: Excellent/Very good/Good/poor/Very poor : Good. Just is the tool already cold steel. Power cut off to the tool. › Completeness: Total/partial/Donor tool? Please list missing parts. 95 percent complete. Only few items were taken example the turbo pump controllers. › Manufacturing date of the Equipment ? › Date of first usage? 2006 › Technic special customized for Infineon? We don’t use water cool for the platen. › Correct maintained? Yes. › Any damages/deficits known? No › Manuals existing? Yes. › Crated: If yes…/ professional with protocol / partly / simple? Not yet crated. Tool still not dissembled. › Any upgrades / extensions? No. › Useable for which products? 8 inch product › Wafer size (if applicable)? 8 inch › Any consumables at end of lifetime? Yes. Few pars already end of lifetime as per Manufacturer. › Procured from OEM or from second hand? Second hand. › Any refurbishments done? No. › Any doubts that the tool is failure free useable for the next three years? No. › Was there a significant system failure in the last three years? No. › Any contaminations known? No › IFX Inventory number? 100000605
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1
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252685
|
AXCELIS NV8200P |
in Ion Implantation Equipment
AXCELIS NV8200P:MCINV8202 › Original Equipment Manufacturer? Axcelis › Exact Model Type? AXCELIS MEDIUM CURRENT NV8200 › A pictures say more as 1.000 words. Any pictures available? Please provide as much as possible. › Current Condition: Excellent/Very good/Good/poor/Very poor : Good. Just is the tool already cold steel. Power cut off to the tool. › Completeness: Total/partial/Donor tool? Please list missing parts. 95 percent complete. Only few items were taken example the turbo pump controllers. › Date of first usage? 2006 › Technic special customized for Infineon? We don’t use water cool for the platen. › Correct maintained? Yes. › Any damages/deficits known? No › Manuals existing? Yes. › Crated: If yes…/ professional with protocol / partly / simple? Not yet crated. Tool still not dissembled. › Any upgrades / extensions? No. › Useable for which products? 8 inch product › Wafer size (if applicable)? 8 inch › Any consumables at end of lifetime? Yes. Few pars already end of lifetime as per Manufacturer. › Procured from OEM or from second hand? Second hand. › Any refurbishments done? No. › Any doubts that the tool is failure free useable for the next three years? No. › Was there a significant system failure in the last three years? No. › Any contaminations known? No › IFX Inventory number? 100001850
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1
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256469
|
Axcelis/Eaton |
NV8250HT |
in Ion Implantation Equipment
Axcelis NV8250HT #941:| Equipment Konfiguration: | | | Type: | NV8250HT | | Energy Config: | 0 - 250Kv Midcurrent | | Serialnumber: | 908 | | Build Year: | 2002 | | Date of first usage: | buyed new from vendor | | Current Condition: | Good | | CE-Conformity: | Yes | | Location: | greyroom | | Voltage: | 208V | | Cryo-Pumps: | 3x CTI/Edwards Onboard: OB-8 | | Cryo-Kompressor: | CTI 9650 Low-Voltage | | Turbo-Pumps: | Seiko/Edwards: STP1003C, STP-301C, STP-1003C | | Rough-Pumps: | Edwards: without QDP40, not included | | Endstation Rough-Pump: | not included | | Wafersize: | 8inch(200mm) | | Clamp-Type: | E-Chuck green with Non-µC Controller | | Wafer-Cooling: | Galden HT110 with Affinity PWC-020K-BE35CBD2 (R507) (condition unclear) | | Gasbox: | Modular 5-String, 4x 2,0L Size | | String1: | Argon Carriergas; MFC Unit-1662 2sccm BF3 | | String2: | BF3 SDS-Low-Pressure Type VCR 1/4"; MFC Unit-1662 2sccm BF3 | | String3: | condition unclear, Type VCR 1/4" MFC Unit-1662 2sccm BF3 | | String4: | AsH3 SDS-Low-Pressure Type VCR 1/2"; MFC Unit-1662 2sccm BF3 | | String5: | PH3 SDS-Low-Pressure Type VCR 1/2"; MFC Unit-1662 2sccm BF3 | | Beam-Profiler Type: | Belt-Drive | | Gear-Type's: | Scan: Planetary Tilt: Planetary | | Source-Type: | ELS4 IHC-Source without Vaporizer | | HV-Transformer: | Silicon-Oil | | Light-Tower: | red/yellow/green; no buzzer | | Main-Workstation | Solaris SUN AXI 3HE (Special case) | | Second-Workstation | Solaris SUN Sparc5 | | Software-Version: | 5.1.4.1 | | Network: | 24port 100MB Ethernet with Cisco Router-Kit | | Cell-Controller: | 177 Type | | Notes: | Upper-Rack Panel missing | | | Clean-Room Table missing on frontside | | | all 4 wheels on oil-isolation transformer are broken | | | Minor modifications on tool | | | No Manual-Set/ no Spares include | | | tool was used 24/7 full in production between 15 and 230kv Energy | | | If required, tool can be inspected on site, but no Power |
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1
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250598
|
Axcelis Technologies |
OPTIMA_HD |
in Ion Implantation Equipment
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1
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254465
|
Brooks EEPC Transponder RS232/Ethernet |
in ALL CATEGORIES
Brooks EEPC Transponder RS232/Ethernet:Brooks EEPC Transponder frequency: 13.56MHz TR5: 500mA (T) Interface: 1200 Bd - 57600 Bd Protocol: ASCII/SSEC/HSMS Protection: IP40 Impedance: 50 Ohm Interface: 10/100BaseT
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152
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256654
|
hull |
BT4216LP |
in Semiconductor / Hybrid Assembly Equipment
BT4216LP HULL_FINMAC DEFLASH:BT4216LP HULL_FINMAC DEFLASH
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1
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236798
|
Buffer controller LS19 scrap |
in ALL CATEGORIES
Buffer controller LS19 scrap:LINKING BUFFER SYSTEM LS19 scrap together with S128-S131 machine Fix Asset
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1
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241354
|
EDA Industries (Asia |
SM-24 FH150C |
in ALL CATEGORIES
Burn In Oven System:Burn In Oven System
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1
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244542
|
EDA Industries (Asia |
SM 24 FH 150 |
in ALL CATEGORIES
Burn In Oven System:Burn In Oven System
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1
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255044
|
Canon |
CAI518 |
in Production Equipment
CAI518 Canon FPA 3000 i5+:CAI Canon FPA 3000 i5+
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1
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259153
|
Canon |
CAI519 |
in Production Equipment
CAI519 Canon FPA 3000 i5+:Canon FPA 3000 i5+ General Configuration: - FPA 3000 - i5(+)
- Manufactured in June / 1997
- 8“ Wafer Chuck, Notch PA unit
- 6“ Nikon-type Reticle Changer
- Reticle Barcode-Reader = yes
- Cassette Barcode Reader = yes
- Pellicle Particle Checker = yes
- Online - ESPA = yes
- Interface type: right
- Standard flys eye lens
- Chamber type: CD80
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1
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N* |
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256627
|
Camtek |
Falcon 630 |
in Optical Inspection Equipment
Camtek Falcon 630 Wafer AOI:Location at Infineon Penang.
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1
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250700
|
Canon |
3000i4 |
in Wafer Steppers
Canon FPA 3000 i4 Stepper :Only for sale for an competetive price! Configuration: left inline system;
8" wafer chuck;
Nikon Type Reticle changer; 6" Reticle major hardware and software changes in control system: EWS type changed to HP B180, O/S changed to HP-UX 10.20, original X-Terminal replaced by a Windows PC + 17" touchscreen TFT Hg lamp will be removed prior shipping
Coolant will be removed prior shipping
Batteries will be removed prior shipping no UPS installed. No printer installed. No MO-drive EOL: optical parts Last Time in production: 05/24
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1
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250701
|
Canon |
3000i4 |
in Wafer Steppers
Canon FPA 3000 i4 Stepper :Configuration: left inline system;
8" wafer chuck;
Nikon Type Reticle changer; 6" Reticle major hardware and software changes in control system: EWS type changed to HP B180, O/S changed to HP-UX 10.20, original X-Terminal replaced by a Windows PC + 17" touchscreen TFT Hg lamp will be removed prior shipping
Coolant will be removed prior shipping
Batteries will be removed prior shipping no UPS installed. No printer installed. No MO-drive EOL: optical parts Last Time in production: 05/24
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1
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255826
|
CDE |
CDE80/2 Plasma Etch |
in Production Equipment
CDE80/2 Plasma Etch:The system was in production until February 2025.
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1
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255825
|
CDE |
CDE80/3 Plasma Etch |
in Production Equipment
CDE80/3 Plasma Etch:The system was in production until February 2025.
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1
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252763
|
INGERSOLL-RAND AIR |
2CV26MX3 |
in ALL CATEGORIES
Centrifugal Compressor:Centrifugal Compressor 11-1 & 11-2 320008009463
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2
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250877
|
CeraCon GmbH |
CeraTHERM stack M |
in ALL CATEGORIES
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1
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257675
|
Canon |
LITVC1-02 |
in Production Equipment
Cluster Tool: TEL ACT12 + Canon FPA- 5500iZ:TEL ACT12 - Double Block - 300mm + LITVC1-02
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1
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251189
|
Gardner Denver |
QUANTIMA Q52 |
in ALL CATEGORIES
Compressor 5-4:Compressor 5-4
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1
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207199
|
ASYS |
BC0 01 |
in ALL CATEGORIES
Conveyor ASYS BC0 01:Conveyor ASYS BC0 01
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1
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207200
|
ASYS |
BC0 02 |
in ALL CATEGORIES
Conveyor ASYS BC0 02:Conveyor ASYS BC0 02
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1
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207198
|
ASYS |
TRM02 |
in ALL CATEGORIES
Conveyor ASYS TRM02:Conveyor ASYS TRM02
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1
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253043
|
TEXUS CO., LTD. |
DBD-4010 |
in ALL CATEGORIES
DA_TOSOK DBD4010_TSD004:DA_TOSOK DBD4010_TSD004
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1
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254854
|
TEXUS CO., LTD. |
TOSOK DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4200_M33-DF10:DA_TOSOK DBD4200_M33-DF10
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1
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255636
|
TEXUS CO., LTD. |
DBD4200 |
in ALL CATEGORIES
DA_TOSOK DBD4200_M33-DF10:| DA_TOSOK DBD4200_M33-DF10 |
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1
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255637
|
TEXUS CO., LTD. |
DBD4200 |
in ALL CATEGORIES
DA_TOSOK DBD4200_M33-DF11:| DA_TOSOK DBD4200_M33-DF11 |
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1
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255390
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG103:DA_TOSOK DBD4600_TG103
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1
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255389
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG106:DA_TOSOK DBD4600_TG106
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1
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€ 176,197.60 |
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255388
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG107:DA_TOSOK DBD4600_TG107
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1
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€ 211,212.40 |
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255391
|
TEXUS CO., LTD. |
Texus DBD4600 |
in ALL CATEGORIES
DA_TOSOK DBD4600_TG109:DA_TOSOK DBD4600_TG109
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€ 239,129.50 |
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257576
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DEK International Gm |
DEK_HORIZON-OZI |
in ALL CATEGORIES
DEK PRESOLDER DEK_HORIZON-OZI:DEK PRESOLDER DEK_HORIZON-OZI
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254729
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Yushin |
Demount - 7 |
in Production Equipment
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1
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255039
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Yushin |
Demount-2 |
in Production Equipment
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1
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257579
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Despatch |
DESPATCH_LCC-14NV-2 |
in Ovens
DESPATCH EPOXY-CURE DESPATCH_LCC-14NV-2:DESPATCH EPOXY-CURE DESPATCH_LCC-14NV-2
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1
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257580
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Despatch |
DESPATCH_LCD2-14NV-3 |
in Ovens
DESPATCH EPOXY-CURE DESPATCH_LCD2-14NV-3:DESPATCH EPOXY-CURE DESPATCH_LCD2-14NV-3
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1
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257114
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Despatch |
LCC2-14NV-3 |
in Ovens
Despatch Oven:nearly in new condition currently installed and in production state
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1
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257574
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Despatch |
DESPATCH_LCD2-14N-5 |
in Ovens
DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5:DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5
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1
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257575
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Despatch |
DESPATCH_LV2N |
in Ovens
DESPATCH PASSIVATION-DRY DESPATCH_LV2N:DESPATCH PASSIVATION-DRY DESPATCH_LV2NDESPATCH PASSIVATION-DRY DESPATCH_LV2N
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1
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257120
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Despatch |
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in Ovens
Despatch Temper Oven:Tool is located in a external storage
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1
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256665
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Mitutoyo |
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in Test & Measurement Equipment
Dial gauge:Measure wafer/tape thickness. Location is at Infineon Penang.
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2
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250283
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BESI |
EVO2200 |
in ALL CATEGORIES
Die Bond Datacon 2200 evo:Model:EVO2200:Die Attach Bonder
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1
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€ 0.00 |
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256629
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Soft View Technology |
SVDS |
in Semiconductor / Hybrid Assembly Equipment
Die Sorter (Pick & Place):Transferring die from sawn wafer (mounted frame) to die plate or tape and reel. Location is at Infineon Penang.
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1
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254524
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Disco |
Disco 12 DFG850 |
in Grinders
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1
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254557
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Disco |
Disco 29 DTG8440 |
in Grinders
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1
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257578
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Disco |
DISCO_DFD6340 |
in Dicing Tools
DISCO WAFER SAW DISCO_DFD6340:DISCO WAFER SAW DISCO_DFD6340
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1
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239777
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Hiller GmbH |
DP484/11012/FD HILLER DECAPRESS DP |
in ALL CATEGORIES
DP484/11012/FD HILLER DECAPRESS DP: - Technic special customized for Infineon? no
- Any damages/deficits known? no
- Manuals existing? yes
- Last time in production/function? 2022
- Any upgrades / extensions? no
- Any consumables at end of lifetime? not known
- Any refurbishments done? no
- Was there a significant system failure in the last three years? no
- Used: only for test
- Any contaminations known? Siliciumdioxid
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1
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256632
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Exclusive Master |
DRIR 2000 |
in Optical Inspection Equipment
DRIR 2000:Die level inspection on tape & reel. Location at Infineon Penang.
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1
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247751
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Driverless transport system |
in ALL CATEGORIES
Driverless transport system:Manufacturer: ATAP-IHC, Model: CX-01 Manufacturing date: Jul 05 Condition: good, complete, no damages Sales incl. reflectors and spare package Dimensions 1,2x0,6x0,5m Weight: 192 kg Anschluss: 230V-L1-N-PE Strom:16A Sicherung: C16A Nutzlast: 90kg
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2
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236443
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DS-TEST 3sets X-Ray Machine scrap |
in ALL CATEGORIES
DS-TEST 3sets X-Ray Machine scrap:Based on VRFC2212 scraped plan, these machines already shortage for key parts and cannot support for normal production
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3
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250661
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DYNAUDIO |
EMIT50 |
in Laboratory Equipment
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1
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248130
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EKRA |
Serio4000 |
in Semiconductor / Hybrid Assembly Equipment
EKRA Serio 4000:- Equipment for automated stencil printing
- Designed for automated input and output
- Printing format min 80x50mm, max 510x510
- Not suitable for manual loading and unloading
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1
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257523
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AMAT |
AMAT EPI CENTURA |
in Epitaxial Reactors
EPI 39 - AMAT EPI CENTURA :Software Ver: B6.50 CB1 Amps: 300A Vita Controller Flow Point Model: Nano Valve Gas Panel Type: Configurable Wafer Size: 200mm (with conversion kit 150mm is possible) M-Monitor: CRT 3 Chambers ATM EPI With digital Flow-Control of the cooling systems with interlock and passphrase (Simens PLC) Standard pneumatic waferlift Center Finding System: OTF Buffer robot: HP+ Piezocon sensor: No VSB: Yes Wide Body LL Tool called "EPI39"
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257176
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AMAT |
EPI Centura ACP |
in Epitaxial Reactors
EPI Centura ACP 300mm "Yu Shan":Brand new and unused EPI Centura ACP 300 mm 4 Chambers; Chamber code RH3, Lamp type BNA8 R3
Mainframe Configuration E4 Single, 4 Facet SC ENP BLK2, Loadport AMAT Standard 300mm, EPI Water Module LT Design. Tool out of Project: "Yu Shan" The original rough IFX Equipment procurement value was 10,3 M€ Will be now sold for an attractive price. Equipment is... ...brand new ...never used ...original packaged and crated ...located in Asia ...complete and fully functional ...professional stored in Warehouse
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1
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255417
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ESEC |
ESEC 2007 |
in Flip Chip Bonders
ESEC 2007 DIE BONDER:| Serial Number | Model | Manufacturer | | 205940 | 2007 | ESEC |
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1
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257527
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257528
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS :ESEC DIE ATTACH ESEC_2100HS
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1
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257568
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257569
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257570
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257571
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257572
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257573
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ESEC |
ESEC_2100HS |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100HS:ESEC DIE ATTACH ESEC_2100HS
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1
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257526
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ESEC |
ESEC_2100XP |
in Epoxy Die Bonders
ESEC DIE ATTACH ESEC_2100XP:ESEC DIE ATTACH ESEC_2100XP
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1
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236878
|
ESEC3100 WIRE BONDER |
in ALL CATEGORIES
ESEC3100 WIRE BONDER:GT line scrap,9 sets of ESEC3100
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9
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Displaying 1-100 of 303 Page  1 2 3 4   |
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