Contact Us  |  Terms  |  Imprint  |  Privacy     
 Fast¬†¬†FIND      full search   tips    
  Specials  |  Listings:   Offered / Wanted / Both     |  Spare Parts Home     
Serving  Our Guest Log in    Register to speed trading
 MENU OF PRODUCT CATEGORIES    View    Search-by-Specs   

FULL DESCRIPTION of Item 236999

in Other Semiconductor Manufacturing Equipment
Item ID: 236999

Offered 5 lot Offered at Best Price


ESEC 2008 Die Bonder Scrap

GT&HAZE Line scrap,FCOS datacon L14 scrap:

ESEC2008 DIE BONDER 5 sets

Internal Equipment ID :E2-011/E2-031/E2-061/E2-071/ E2-081

 

Unit Price Unstated
Number of Units
(in lot)
5
Condition Poor
Year of Manufacture 2003

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment