Item ID: 213293 1 Offered at Best Price ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch SIPLACE CA4:- High Volume Chip Assembly- 4 Portal Microchip / SMD Hybrid Assembly system- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion- 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20- excluding Loader ... other image Unit Price Unstated Number of Units 1 Manufacturer ASM Model Siplace CA4 Description SIPLACE CA4 incl. 4 Siplace Wafer Systems 8" Accessories Vakuum Tooling Singletransport Chuck Chiller Cooling System Vacuumpump X-Series Other Information Never used within serial production. Samples and product evaluation only. Condition Excellent Year of Manufacture 2014 CE Marked YES Exterior Dimensions Width 93.701 in (238.0 cm) Depth 151.181 in (384.0 cm) Height 73.228 in (186.0 cm) Weight 10,163 lb (4,610 kg) Shipping Weight lb kg Shipping & Handling:All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment. Payment:100% downpayment Make OFFERSend QUESTIONS
SIPLACE CA4:
- High Volume Chip Assembly
- 4 Portal Microchip / SMD Hybrid Assembly system
- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion
- 4 Wafer Transfer Systems
- 4 LP-Kamera (TYP34) and bonding Head C+P20
- excluding Loader
Vakuum Tooling Singletransport Chuck
Chiller Cooling System
Vacuumpump X-Series
Never used within serial production. Samples and product evaluation only.
All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment.
ALL CATEGORIES Semi / Hybrid Assy Die Bonders Flip Chip Bonders
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