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in Automatic Flip Chip Bonders
Item ID: 213293

Offered 1 Offered at Best Price

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch


- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

- excluding Loader



ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch
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Unit Price Unstated
Number of Units 1
Manufacturer ASM
Model Siplace CA4
Description SIPLACE CA4 incl. 4 Siplace Wafer Systems 8"

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Chiller Cooling System

Vacuumpump X-Series

Other Information 

Never used within serial production. Samples and product evaluation only.

Condition Excellent
Year of Manufacture 2014
CE Marked YES
Exterior Dimensions 
  Width 93.701  in  (238.0 cm)
  Depth 151.181  in  (384.0 cm)
  Height 73.228  in  (186.0 cm)
Weight 10,163  lb  (4,610 kg)
Shipping  Weight lb  kg 

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.


100% downpayment