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FULL DESCRIPTION of Item 204220

in Other Semiconductor Manufacturing Equipment
Item ID: 204220

Offered 2 Offered at Best Price


Cyberscan CT350T Dual non-contact double-sided optical profilometer

2 Tools

- DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE

Tools are still running in production. Available from May/June 2019

Inspection already possible!

The tools are pretty new and rarely used. Vintage 2018 and 2015 

The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken.

Please be invited to take a look at the pictures.

Cyberscan CT350T Dual non-contact double-sided optical profilometer
  Click to see additional image(s)... other images
Unit Price Unstated
Number of Units 2
Model ct 350
Description pretty new
Other Information 

The CT 350T is a non-contact double-sided optical
profilometer with a 300 mm x-/y- scanning stage.
The upper sensor is mounted on a highly accurate
z-axis with 100 mm range, while the lower sensor is
stationary inside the granite platform. Both sensors
collect height data synchronized with x-, y- encoder
signals and are aligned axially in order to ensure
accurate differential thickness measurements.
The software generates 2D profiles and 3D maps
simultaneously from the top and the bottom surface
and calculates the corresponding total thickness
profile or map.
The motion system uses fast and accurate magnetic
linear motors. By triggering the chromatic white
light sensors at a data rate of 4 kHz the inspection
time is minimized. The sensors are available with a
z-resolution down to 3 nm and a measurement range
up to 25 mm. With an adapter plate on the stage
aperture the system can be used as a standard optical
surface profilometer which makes the CT 350T the
most versatile surface and thickness measurement
system. The system is also available in a smaller
version as CT 250T with 200 mm travel ideally for 8”
wafers or substrates and solar wafers.

Technology

Fast and accurate dual scanning system
Measurement speed: 4 kHz
300 mm (200 mm) travel in x- and y-direction,
lateral resolution 50 nm, motorized z-axis
resolution 5 nm
2D profiles and 3D topographical maps and
3D thickness maps
Large scanning area
Maximum x-, y-, z-resolution up to the full
maximum travel of 300 mm (200 mm)
Chromatic white light sensors
Z-resolution down to 3 nm, measurement range
up to 25 mm
High resolution off-axis camera

 

Condition Like New
Year of Manufacture 2018
click to view document at right in new windowFurther details
Serial Number(s)

 

 


Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment