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FULL DESCRIPTION of Item 202692

in Other Semiconductor Manufacturing Equipment
Item ID: 202692

Offered 1 Offered at Best Price


EVG820 Dry Film Lamination System

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.
Unit Price Unstated
Number of Units 1
Wafer Size Range 
  Minimum 200 mm
  Maximum 300 mm
Condition Good
Year of Manufacture 2007
Serial Number(s)

 

 


Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment