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in Other Semiconductor Manufacturing Equipment
Item ID: 202692

Offered 1 Offered at $ 55,000.00

EVG820 Dry Film Lamination System

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.

EVG820 Dry Film Lamination System
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Unit Price $ 55,000.00
Number of Units 1
Wafer Size Range 
  Minimum 200 mm
  Maximum 300 mm
Condition Good
Year of Manufacture 2007
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Serial Number(s)



Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.


100% downpayment