Item ID: 226539

**1 Offered at Best Price**

EVG Bonder

EFB01

1) full automated production wafer bond system GEMINI with two Kawasaki robots up to 200m wafer with mini environment class 1;
2) SmartView NT2 Align module with customized additional center to center alignment and different chucks (edge grip, 6 inch), alignment typically < 1µm
3) Bond module for max 200mm wafer up to 550°C and 10kN, flag pulling mechanism; piston force up to 20kN, overprs 3bar absolute, vacuum < 1x10e-5mbar
4) cleaning module: jet nozzle, megasonic, 2 chemistry lines, N2 nozzle,dry spin
5) lowTemp Plasma activation module; 100-200mm wafer,3 Gaslines, high frequency / low frequency RF Generator to 200W, Turbo molecular Pump for vac system
6) IR Inspection station with sorting option
7) Chiller

The Equipment is nearly new - meaning unused. It was only used for tests.

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Unit Price	Unstated
Number of Units	1
Manufacturer	EVG
Model	Gemini Automated Production Wafer Bonding System
Wafer Size Range
Minimum	150 mm
Maximum	200 mm
Set Size	200 mm
Cassette to Cassette	YES
Accessories	We sell the tool with all Accessoires. Spareparts included. Manuals existing.
Other Information	Tool is crated in wooden boxes.
Condition	Like New
Year of Manufacture	2017
CE Marked	YES
Serial Number(s)	S170155

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

Payment:

100% downpayment

FULL DESCRIPTION of Item 226539

1 Offered at Best Price

EVG Bonder

**1 Offered at Best Price**