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in Other Wafer Fabrication Equipment
Item ID: 226539

Offered 1 Offered at Best Price

EVG Bonder

  • EFB01
      • 1) full automated production wafer bond system GEMINI with two Kawasaki robots up to 200m wafer with mini environment class 1;
      • 2) SmartView NT2 Align module with customized additional center to center alignment and different chucks (edge grip, 6 inch), alignment typically < 1µm
      • 3) Bond module for max 200mm wafer up to 550°C and 10kN, flag pulling mechanism; piston force up to 20kN, overprs 3bar absolute, vacuum < 1x10e-5mbar
      • 4) cleaning module: jet nozzle, megasonic, 2 chemistry lines, N2 nozzle,dry spin
      • 5) lowTemp Plasma activation module; 100-200mm wafer,3 Gaslines, high frequency / low frequency RF Generator to 200W, Turbo molecular Pump for vac system
      • 6) IR Inspection station with sorting option
      • 7) Chiller

The Equipment is nearly new - meaning unused. It was only used for tests.

EVG Bonder
  Click to see additional image(s)... other images
Unit Price Unstated
Number of Units 1
Manufacturer EVG
Model Gemini Automated Production Wafer Bonding System
Wafer Size Range 
  Minimum 150 mm
  Maximum 200 mm
  Set Size 200 mm
Cassette to Cassette YES

We sell the tool with all Accessoires.

Spareparts included.

Manuals existing.

Other Information 

Tool is crated in wooden boxes.

Condition Like New
Year of Manufacture 2017
CE Marked YES
Serial Number(s)S170155

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.


100% downpayment