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Offered at
Best Price

EVG Bonder
- EFB01
- 1) full automated production wafer bond system GEMINI with two Kawasaki robots up to 200m wafer with mini environment class 1;
- 2) SmartView NT2 Align module with customized additional center to center alignment and different chucks (edge grip, 6 inch), alignment typically < 1µm
- 3) Bond module for max 200mm wafer up to 550°C and 10kN, flag pulling mechanism; piston force up to 20kN, overprs 3bar absolute, vacuum < 1x10e-5mbar
- 4) cleaning module: jet nozzle, megasonic, 2 chemistry lines, N2 nozzle,dry spin
- 5) lowTemp Plasma activation module; 100-200mm wafer,3 Gaslines, high frequency / low frequency RF Generator to 200W, Turbo molecular Pump for vac system
- 6) IR Inspection station with sorting option
- 7) Chiller
The Equipment is nearly new - meaning unused. It was only used for tests.
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