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	View All Offers Under Semiconductor / Hybrid Assembly Equipment » Switch Major Category		Click an item's ID# below for its full specifications , or: Group Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment List all 51 product types under Semiconductor / Hybrid Assembly Equipment

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Item ID  Short Description Product Type / Details # Price Notes Make Model     213293 ASM   Siplace CA4  Automatic Flip Chip Bonders in Flip Chip Bonders ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch: SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems  - 4 LP-Kamera (TYP34) and bonding Head C+P20 - excluding Loader     1   245179 NGK FILTECH   MEGCON 2  Wire Bonding Equipment - Other in Wire Bonders CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006: CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006 1   245178 NGK FILTECH   MEGCON 2  Wire Bonding Equipment - Other in Wire Bonders CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003: CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003 1   248130 EKRA   Serio4000  Screen Printers in Semiconductor / Hybrid Assembly Equipment EKRA Serio 4000: Equipment for automated stencil printing  Designed for automated input and output Printing format min 80x50mm, max 510x510 Not suitable for manual loading and unloading 1   N* 235315 Scrap 3x mini buffers (10011500,10011501,10011502)  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Scrap 3x mini buffers (10011500,10011501,10011502): These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped  2: function isn't complete 3   F* 243278 EKRA   XM  Screen Printers in Semiconductor / Hybrid Assembly Equipment Screen & Stencil Printer Ekra (Asys Group): The XM is a manual screen and stencil printer dedicated to small batch size production and prototyping purposes. The sideways guided squeegee traverse and the adjustable squeegee pressure ensure a constant, high quality print. Simple operation and short set-up times all belong to the application oriented concept. Stiff as well as flexible materials such as PCBs, glass, ceramic or metal up to a thickness of 30 mm can be printed. Due to these characteristics the XM print system is the ideal application for small batch series and for prototyping. 1   245208 ASM Technology Singa   Xpress GoCu  Wire Bonding Equipment - Other in Wire Bonders Wire bond ASM IHAWK XPRESS GOCU: Wire bond ASM IHAWK XPRESS GOCU with heat tunnel 1 € 0.00 245209 Shinkawa   SKW_UTC2000  Wire Bonding Equipment - Other in Wire Bonders Wire Bond UTC2000: SW116:UTC2000:Gold wire bonder 1 € 0.00 245210 Shinkawa   SKW_UTC2000  Wire Bonding Equipment - Other in Wire Bonders Wire Bond UTC2000: SW122:UTC2000:Gold wire bonder 1 € 0.00 245207 ASM   Xpress GoCu  Wire Bonding Equipment - Other in Wire Bonders Wire bond Xpress GoCu: Wire bond ASM i-Hawk Xpress Go Cu: Heat Tunnel 1 € 0.00

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
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  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.