 |
Item ID |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
| Make |
Model |
| |
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256642
|
FUSEI |
FMTM250-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM250-7HS-32P FUSEI MOLD PRESS:FMTM250-7HS-32P FUSEI MOLD PRESS
|
1
|
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256643
|
FUSEI |
FMTM250-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM250-7HS-32P FUSEI MOLD PRESS:FMTM250-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
 |
|
 |
256645
|
FUSEI |
FMTM250-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS:FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS
|
1
|
|
|
 |
|
 |
256649
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI MOLD PRESS:FMTM300-7HS-32P FUSEI MOLD PRESS
|
1
|
|
|
 |
|
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256650
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI MOLD PRESS:FMTM300-7HS-32P FUSEI MOLD PRESS
|
1
|
|
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 |
|
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256651
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI MOLD PRESS:FMTM300-7HS-32P FUSEI MOLD PRESS
|
1
|
|
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 |
|
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256648
|
FUSEI |
FMTM300-7HS-32P |
in Semiconductor / Hybrid Assembly Equipment
FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS:FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS
|
1
|
|
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|
 |
252846
|
Microcontrol |
Microcontrol 408 II |
in Production Equipment
Foil Peeling Tools / Detaper:Tools are under good condition. Tools are currently productive in Infineon Kulim. Bundle sale in 2 tools together = Euro 60k
|
1
|
|
€ 30,000.00 |
 |
|
 |
248948
|
Webomatic |
System-4000 |
in ALL CATEGORIES
|
1
|
|
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|
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255151
|
Fusion Systems Inc. |
200 PCU |
in Production Equipment
FUSION 150/3D:Fusion Semiconductor- die Anlage war bis zur Deinstallation Jänner 25 in Produktion.
|
1
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|
|
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|
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255180
|
Fusion Systems Inc. |
200 PCU |
in Production Equipment
FUSION 150/7D:Die Anlage war bis zur Deinstallation in Jänner 2024 in Produktion.
|
1
|
|
|
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|
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263274
|
Fusion Systems Inc. |
200MCU |
in Production Equipment
FUSION 200M/1D:Die Anlage war bis zur Deinstallation im Dezember in Produktion.
|
1
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|
|
N* |
|
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262335
|
HANDLER_ISMECA NX32W_T-I14 |
in ALL CATEGORIES
|
1
|
|
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|
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252923
|
Multitest |
MT8589 |
in Device Handlers
|
1
|
|
|
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|
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252922
|
Multitest |
MT8589 |
in Device Handlers
|
1
|
|
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|
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252925
|
Rasco |
SO1800T |
in Device Handlers
|
1
|
|
|
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|
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252924
|
Rasco |
SO1800T |
in Device Handlers
|
1
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|
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250829
|
Heina TT2-1000/1000 |
in Production Equipment
Heina TT2-1000/1000:Two 100cm drums installed Last time in operation in 07/2024 No damages
|
1
|
|
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|
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238643
|
PVA TePla |
TWIN |
in Wafer Fabrication Equipment
|
1
|
|
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|
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256920
|
Varian |
Viision 200+ |
in Ion Implantation Equipment
Implanter Varian Viision 200+:200 mm Implanter in very good condition Price net 982k$ based on Incoterm FCA, as is without warranty
|
1
|
|
$ 982,000.00 |
 |
|
 |
255371
|
Suss MicroTec |
ACS200 Gen3 |
in Wafer Fabrication Equipment
InkJet Printer (Süss ACS200):Süss Micro Tec ACS200 Gen 3
|
1
|
|
|
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|
 |
259333
|
Insidix |
Compact II |
in Metrology Equipment
Insidix Compact II:currently in use available mid of 2026
|
1
|
|
|
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|
 |
254733
|
IVS |
IVS120 |
in Production Equipment
IVS-1:The IVS120 is an automatic metrology system designed for measuring critical dimensions (CD´s).
|
1
|
|
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|
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248938
|
Kardex |
Shuttle XP |
in ALL CATEGORIES
Kardex Shuttle Xp:Kardex Shuttle XP with many Trays
|
1
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|
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|
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221102
|
BESI |
X-Eye SF160 SL |
in ALL CATEGORIES
KETECA, X-Eye SF160 SL, A-SFS16FDAL170N2D735, XRAY:Function , needed motor vacuum to up this machine |
|
1
|
|
$ 22,800.00 |
 |
|
 |
255052
|
Ismeca |
KGD01 |
in Production Equipment
|
1
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|
|
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|
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255056
|
Ismeca |
KGD02 |
in Production Equipment
|
1
|
|
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|
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255041
|
KLA Tencor |
2367 |
in Microscope Inspection Tools
KLA 2367 "Escape" Bright Field Inspection Tool:BrightField Inspektionstool 25 cassette HW 200mm GEM/SECS and HSMS Model Enable .12 , .62, .39 Picels ORS Upgrade done Tool currently full installed at cleanroom (estimated time depending on areaneed)
|
1
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|
|
 |
|
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242857
|
KLA |
eS32 |
in Test & Measurement Equipment
KLA eS32 E-beam Wafer Inspection 200mm:eS32 is a top-of-the-line mask and wafer inspection equipment that is designed to meet the most stringent quality standards for semiconductor product manufacturing. This system provides comprehensive, high-resolution inspection of both masks and wafers with unparalleled accuracy. The unit uses a proprietary optical probe to scan masks and wafers to detect defects and irregularities with a resolution reaching down to 1 micron. This high-precision scanning allows for comprehensive inspection of the entire surface of both the mask and wafer. The machine also includes powerful image processing and analysis algorithms which automatically detect defects, categorize them, and track their locations. KLA eS32 also includes a suite of automated defect correction tools which can rapidly repair standard and complex defects. In addition to its exhaustive defect detection capabilities, this tool also allows for statistical process control (SPC) analysis to ensure production processes maintain consistent quality and accuracy over time. TENCOR ES 32 also includes a user-friendly interface that makes it easy to operate and manage the asset. This user interface is highly customizable, allowing users to quickly change model settings, view detailed inspection reports, and receive real-time notifications of detected defects. In summary, KLA ES 32 is a high-performance mask and wafer inspection equipment that offers superior detection accuracy, automated defect correction, comprehensive statistical process control (SPC) analysis, and an easy-to-use user interface. This system can be used to monitor production lines, resulting in improved manufacturing quality, increased yield, and cost savings.
|
1
|
|
|
 |
|
 |
257563
|
Kokusai Furnace Vertron Revolution (Brand-New) |
in Ovens
Kokusai Furnace Vertron Revolution (Brand-New):Brand-New and absolute unused Kokusai large batch deposition equipment Useable for
|
1
|
|
|
 |
|
 |
255827
|
LAM Research Corp. |
2300 Kiyo |
in Cluster Plasma Tools
Lam Kiyo Chamber L2301-B:Semiconductor ETC Chamber with RF Cart Incl. Gasbox and Rocker Valve in production until January 2023
|
1
|
|
|
 |
|
 |
263261
|
LAM Research Corp. |
L4500/7D |
in Cluster Plasma Tools
LAM Rainbow 4500 Etch Tool:LAM Rainbow 4500 Etch ToolLAM 45xx/7D Tool for isotropic and Oxyd etch processes.
|
1
|
|
|
N* |
|
 |
259305
|
LAM Research Corp. |
TCP 9600 |
in Cluster Plasma Tools
LAM Research TCP 9600:- without UI Computer - Envision, ESC, Fixed Gap
|
1
|
|
|
 |
|
 |
244197
|
Hanmi Semiconductor |
Laser Cleaning 1.0 |
in ALL CATEGORIES
LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001:LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001
|
1
|
|
|
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|
 |
261046
|
KINERGY |
Taping & Array Cut Machine |
in Marking Tools
|
1
|
|
|
 |
|
 |
242433
|
Keteca |
Keteca PP200 |
in ALL CATEGORIES
LASER MARK_P&P KETECA PP200_LM08:| LASER MARK_P&P KETECA PP200_LM08 |
|
1
|
|
|
 |
|
 |
256657
|
Despatch |
LCD2-14N-5 |
in Ovens
LCD2-14N-5 DESPATCH CURING OVEN:LCD2-14N-5 DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256656
|
Despatch |
LCD2-14NV-3 |
in Ovens
LCD2-14NV-3 DESPATCH CURING OVEN:LCD2-14NV-3 DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
255505
|
Leica |
INS-3 |
in Metrology Equipment
Leica Review Station INS-3:Review Microskop for 6 and 8"
|
1
|
|
|
 |
|
 |
256618
|
Longhill Industries |
LH-860 |
in Production Equipment
LH-860 LONGHILL MOUNTER :
|
1
|
|
|
 |
|
 |
256659
|
Despatch |
LND1-42-3 |
in Ovens
LND1-42-3 DESPATCH CURING OVEN:LND1-42-3 DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256745
|
Despatch |
LND1-42-3 |
in Ovens
LND1-42-3 DESPATCH CURING OVEN:LND1-42-3 DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256859
|
Despatch |
LND1-42-3 |
in Ovens
LND1-42-3 DESPATCH CURING OVEN:LND1-42-3 DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256857
|
Despatch |
LND1-42-3 |
in Ovens
LND1-42-3 DESPATCH CURING OVEN:LND1-42-3 DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256858
|
Despatch |
LND1-42-3A |
in Ovens
LND1-42-3A DESPATCH CURING OVEN:LND1-42-3A DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256658
|
Despatch |
LND1-42-3A |
in Ovens
LND1-42-3A DESPATCH CURING OVEN:LND1-42-3A DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256741
|
Despatch |
LND1-42-3A |
in Ovens
LND1-42-3A DESPATCH CURING OVEN:LND1-42-3A DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256742
|
Despatch |
LND1-42-3A |
in Ovens
LND1-42-3A DESPATCH CURING OVEN:LND1-42-3A DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256743
|
Despatch |
LND1-42-3A |
in Ovens
LND1-42-3A DESPATCH CURING OVEN:LND1-42-3A DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
256744
|
Despatch |
LND1-42-3A |
in Ovens
LND1-42-3A DESPATCH CURING OVEN:LND1-42-3A DESPATCH CURING OVEN
|
1
|
|
|
 |
|
 |
257562
|
Tazmo Co.,Ltd. |
Loadport for Tazmo |
in Dicing Tools
Loadport Tazmo:| | Tool Platform | Hersteller | Modelnummer | Konfiguration | | | | | | | | Loadport 1 | Tazmo | Tazmo | S048513B0001 | 12" | | | | | | | | Loadport 2 | Tazmo | Right MFG.co.Ltd | RP2500 | 8/12" | | | | | | | | Loadport 3 | Tazmo | Right MFG.co.Ltd | RP2500 | 8/12" | | | | | | | | Loadport 4 | Tazmo | Right MFG.co.Ltd | RP2500 | 8/12" | | | | | | | | Loadport 5 | Tazmo | Right MFG.co.Ltd | RP2500 | 8/12" | | | | | | | | Loadport 6 | Tazmo | Right MFG.co.Ltd | RP2500 | 8/12" | | | | | | | | Loadport 7 | Tazmo | Right MFG.co.Ltd | RP2500 | 8/12" | | | | | | |
|
1
|
|
|
 |
|
 |
257577
|
Longhill Industries |
LONGHILL_LH-860 |
in Dicing Tools
LONGHILL WAFER MOUNT LONGHILL_LH-860:LONGHILL WAFER MOUNT LONGHILL_LH-860LONGHILL WAFER MOUNT LONGHILL_LH-860
|
1
|
|
|
 |
|
 |
253046
|
L & G Technology |
|
in ALL CATEGORIES
Memmert Oven:Memmert Oven
|
1
|
|
|
 |
|
 |
254740
|
Tazmo Co.,Ltd. |
Mounter 2 Glass |
in Dicing Tools
|
1
|
|
|
 |
|
 |
207180
|
Nanofocus µsprint 3d inspection system with Baumann Handler |
in Optical Inspection Equipment
|
1
|
|
|
 |
|
 |
256294
|
Nexx Apollo PVD |
in Batch Sputtering Tools
Nexx Apollo PVD:The Nexx Apollo PVD system is a fully automated Physical Vapor Deposition (PVD) tool using a multiple wafer multiple chamber design. The system deposits thin metal films used in interconnect metallization on wafers. It uses a staged vacuum system that allow short pump down time to achieve ultra high vacuum. The multi chamber design allows for precise control over all process parameters.
|
1
|
|
|
 |
|
 |
254657
|
Nikon |
Nikon 23 Optiphot 200 |
in Wafer Manufacturing Metrology Equipment
Nikon 23 Optiphot 200:Microscope with Handler for 5" or 6" Wafer.
|
1
|
|
|
 |
|
 |
254656
|
Nikon |
Nikon 7 Optiphot 200 |
in Wafer Manufacturing Metrology Equipment
|
1
|
|
|
 |
|
 |
237930
|
Nomura Micro Science |
NDB-3 |
in ALL CATEGORIES
|
2
|
|
|
 |
|
 |
258121
|
Rudolph Technologies |
mWL 150/200 t |
in Metrology Equipment
|
1
|
|
|
 |
|
 |
192280
|
Over Head Transport System (OHT) SRC320 |
in Semiconductor Manufacturing Facilities Equipment
Over Head Transport System (OHT) SRC320:
A high quantity of SRC 320 parts.
- SRC320 Vehicles (~50 pc.)
- SRC320 SCPS-ZCU
- SRC320 ICC
- SRC320 PDU
- SRC320 Rail parts
- Foup Handler Stocker
Please get in touch with the Equipment Trade Category Manager to get more information or price lists.
|
1
|
|
|
 |
|
 |
255047
|
Applied Materials |
P5000 17 |
in Production Equipment
P5000 17:| Area | CVD | | Equ. Grp Code | 83404 | Workcenter (Equ. Grp. Name) | A_CV_SNIT_P5000_RS_8 | | Completeness fully/some parts missing/ many parts missing | Yes, fully complete | | Vendor | AMAT | | Tooltype | P5000 | Qty. of Chambers | 4 | Spares to sell | No | Wafer Diameter | 8 | Date of availability | available immdiately | | Status | De-installed |
|
1
|
|
|
 |
|
 |
255048
|
Applied Materials |
P5000 20 |
in Production Equipment
P5000 20:| Area | DEP | | Equ. Grp Code | 73401 | Workcenter (Equ. Grp. Name) | A_CV_SNIT_P5000_K_6 | | Completeness fully/some parts missing/ many parts missing | Yes, fully complete | | Vendor | AMAT | | Tooltype | P5000 | Qty. of Chambers | 4 | Spares to sell | No | Wafer Diameter | 6 | Date of availability | available immdiately | | Status | De-installed | | Storage location | Warehose |
|
1
|
|
|
 |
|
 |
255049
|
Applied Materials |
P5000 21 |
in Production Equipment
P5000 21:| Area | DEP | | Equ. Grp Code | 79402 | Workcenter (Equ. Grp. Name) | A_CV_SNIT_P5000_K_RS_6 | | Completeness fully/some parts missing/ many parts missing | Yes, fully complete | | Vendor | AMAT | | Tooltype | P5000 | Qty. of Chambers | 4 | Spares to sell | No | Wafer Diameter | 6 | Date of availability | available immdiately | | Status | De-installed |
|
1
|
|
|
 |
|
 |
255050
|
Applied Materials |
P5000 34 |
in Production Equipment
P5000 34:Toolcode sending site | P500034 | | IFX ET ID: | 255050 | | Area | PET | EqToolcode sending site | P500034 | | IFX ET ID: | 255050 | | Area | PET | | Equ. Grp Code | 78222 | Workcenter (Equ. Grp. Name) | P_AN_POL_P5000_K_6 | | Completeness fully/some parts missing/ many parts missing | Yes, fully complete | | Vendor | AMAT | | Tooltype | P5000-MXP | u. Grp Code | 78222 | Workcenter (Equ. Grp. Name) | P_AN_POL_P5000_K_6 | | Completeness fully/some parts missing/ many parts missing | Yes, fully complete | | Vendor | AMAT | | Tooltype | P5000-MXP |
|
1
|
|
|
 |
|
 |
263298
|
Applied Materials |
P5000 36 |
in Production Equipment
P5000 36:| | | | | Chamber Typ | Prozess | | CHAMBER A | | x | | MxP+ | Etch | | CHAMBER B | | x | | MxP+ | Etch | | CHAMBER C | | x | | MxP+ | Etch |
|
1
|
|
|
N* |
|
 |
255046
|
Applied Materials |
P5000 9 |
in Production Equipment
P5000 9:| Area | CVD | | Equ. Grp Code | 79404 | Workcenter (Equ. Grp. Name) | A_CV_SNIT_P5000_K_RS_GAN_6 | | Completeness fully/some parts missing/ many parts missing | Yes, fully complete | | Vendor | AMAT | | Tooltype | P5000 | Qty. of Chambers | 2 + 2 | Spares to sell | No | | Comments | Gora 2 | | Surplus Nr | 255046 | Wafer Diameter | 8 | Date of availability | available immdiately | | Status | De-installed |
|
1
|
|
|
 |
|
 |
263290
|
Applied Materials |
P500060 |
in Production Equipment
P500060 :| CHAMBER A | | x | | MxP+ | Etch | | CHAMBER B | | x | | MxP+ | Etch | | CHAMBER C | | x | | MxP+ | Etch |
|
1
|
|
|
N* |
|
 |
261819
|
Nitto |
PFM 3 |
in Production Equipment
PFM 3:Taper Nitto-DR - 8500
|
1
|
|
|
 |
|
 |
261818
|
Nitto |
PFM 9 DR3000 3 |
in Production Equipment
PFM 9:THWV12-01 - PFM9_n8_12_DR-3000 III Tape Laminator
|
1
|
|
|
 |
|
 |
255042
|
Nitto |
PFM2 |
in Production Equipment
|
1
|
|
|
 |
|
 |
261813
|
Nitto |
PFP 4 HR8500-2 |
in Production Equipment
PFP 4:NITTO HR 8500 / PFP4 film stripping machine
|
1
|
|
|
 |
|
 |
261816
|
Nitto |
PFP5 |
in Production Equipment
|
1
|
|
|
 |
|
 |
261815
|
Microcontrol |
PFP 6 |
in Production Equipment
|
1
|
|
|
 |
|
 |
254560
|
Heller Industries |
PFP-HOT |
in Production Equipment
|
1
|
|
|
 |
|
 |
246288
|
Suki Technology Sdn. |
|
in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI001:POST MOLD INSPECTION_SUKI TECH_PMI001
|
1
|
|
|
 |
|
 |
246289
|
Suki Technology Sdn. |
|
in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI002:POST MOLD INSPECTION_SUKI TECH_PMI002
|
1
|
|
|
 |
|
 |
246290
|
Suki Technology Sdn. |
|
in ALL CATEGORIES
POST MOLD INSPECTION_SUKI TECH_PMI003:POST MOLD INSPECTION_SUKI TECH_PMI003
|
1
|
|
|
 |
|
 |
239644
|
Ramgraber |
SST |
in Wafer Cleaners
Ramgraber SST:Used Configuration: Tank 1: EKC Tank 2: P1331 Tank 3 and 4: DMF Tank 5: IPA Known errors: Filter from tank 4 is leaking Heater 1 from tank 4 is broken Heater 3 from tank 4 is broken
|
1
|
|
|
F* |
|
 |
253284
|
RASCO SO1800_RC-SO1800 |
in ALL CATEGORIES
RASCO SO1800_RC-SO1800:HANDLER_RASCO SO1800T_RAS015
|
1
|
|
|
|
|
 |
253286
|
RASCO SO1800_RC-SO1800 |
in ALL CATEGORIES
RASCO SO1800_RC-SO1800:HANDLER_RASCO SO1800T RT_RAS012
|
1
|
|
|
|
|
 |
253287
|
RASCO SO1800_RC-SO1800 |
in ALL CATEGORIES
|
1
|
|
|
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|
 |
244510
|
ESSEM TEC |
Convection Reflow Oven |
in Ovens
REFLOW OVEN soldering station_essemtec RO06:REFLOW OVEN soldering station
|
1
|
|
€ 15,530.00 |
 |
|
 |
261047
|
BTU INTERNATIONAL |
PYRAMAX 100N |
in Ovens
|
1
|
|
|
 |
|
 |
241426
|
Rudolph Research |
Scale |
in Test & Measurement Equipment
|
1
|
|
|
 |
|
 |
235316
|
Scarp VOSTCH Salt Spray Chamber VSC450 |
in ALL CATEGORIES
Scarp VOSTCH Salt Spray Chamber VSC450:Not functioning
|
1
|
|
|
 |
|
 |
216407
|
Schmid |
Combi Line |
in ALL CATEGORIES
|
1
|
|
€ 50,000.00 |
 |
|
 |
235315
|
Scrap 3x mini buffers (10011500,10011501,10011502) |
in Semiconductor / Hybrid Assembly Equipment
Scrap 3x mini buffers (10011500,10011501,10011502):These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped 2: function isn't complete
|
3
|
|
|
F* |
|
 |
257486
|
Scrap for X-Ray10&12 |
in ALL CATEGORIES
|
2
|
|
|
 |
|
 |
262437
|
Scrap for 15x TOSOK DBD4000 DIE BOND |
in ALL CATEGORIES
|
15
|
|
|
N* |
|
 |
262908
|
Scrap for 2x CO2 |
in ALL CATEGORIES
|
2
|
|
|
N* |
|
 |
262289
|
Scrap for 8x VI |
in ALL CATEGORIES
Scrap for 8x VI:Scrap for VI-01/08/09/11/12/13/14/16
|
8
|
|
|
|
|
 |
261729
|
Scrap for Bowl to Tape Inliner |
in ALL CATEGORIES
|
1
|
|
|
 |
|
 |
262497
|
Scrap for CLAMP INLINER MACHINE |
in ALL CATEGORIES
Scrap for CLAMP INLINER MACHINE: LOCATION: Wuxi
|
1
|
|
|
N* |
|
 |
259009
|
Scrap for FC-29 and FC-34 |
in ALL CATEGORIES
|
2
|
|
|
 |
|
 |
255556
|
Scrap for INK-05 |
in ALL CATEGORIES
|
1
|
|
|
 |
|
 |
262498
|
Scrap for Lauffer VSKO 75 SOD323 MP-05 |
in ALL CATEGORIES
Scrap for Lauffer VSKO 75 SOD323 MP-05:Based on the warehouse plan in TCR2526, for EOL, SOD323 Mold- lauffer(1set) can go with scrap process.
|
1
|
|
|
N* |
|
 |
263271
|
Scrap for Printer |
in ALL CATEGORIES
|
1
|
|
|
N* |
|
 |
262909
|
Scrap for SAW-EX-01 |
in ALL CATEGORIES
|
1
|
|
|
N* |
|
 |
256639
|
fujiwa |
SD250 |
in Semiconductor / Hybrid Assembly Equipment
SD250 FUJIWA MOLD PRESS:SD250 FUJIWA MOLD PRESS
|
1
|
|
|
 |
|
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