Added |
 |
Item ID |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
Make |
Model |
|
|
|
|
Sep 17 |
 |
261600
|
Tel |
Mercury |
in Wafer Cleaners
WET MERCURY 8":Glass cleaning
|
1
|
|
|
N* |
|
Sep 11 |
 |
261410
|
Teradyne |
Teradyne A565 |
in ALL CATEGORIES
Teradyne A565:Tester is functioning.
|
1
|
|
|
N* |
|
Sep 11 |
 |
261409
|
Teradyne |
Teradyne A565 |
in ALL CATEGORIES
Teradyne A565:Tester is functioning.
|
1
|
|
|
N* |
|
Sep 11 |
 |
261408
|
Teradyne |
Teradyne A565 |
in ALL CATEGORIES
Teradyne A565:Tester is functioning
|
1
|
|
|
N* |
|
Sep 3 |
 |
261083
|
Accretech |
TSK |
in Wafer Manufacturing Metrology Equipment
TSK Prober UF200A Bundle:Several TSK Probers for sale. Preferred as package sale.
| TSK-114 | TSK-075 | TSK-125 | TSK-134 | TSK-088 | TSK-072 | Probertyp | UF200A | UF200A | UF200A | UF200A | UF200A | UF200A | Inventar Nr. | IFAT 230409 | IFAT 229610 | IFAT 230644 | IFAT 230849 | IFAT 230161 | IFAT 229803 | Serial Nr. | F12041CA | F120134GY | F12012EA | F12028GA | F12008GZ | F12047EY | Hinge Manipulator | Yes | Yes | No | No | No | No | Type of tester head plate | Agilent | Agilent | Microflex | MMCi Standard | MMCi Standard | MMCi Standard | Prober power supply rate | 230V | 230V | 230V | 230V | 230V | 230V | Chuck Type (Nickel, Gold, etc.) | Gold, Ring Pattern, Stagepin Bernoulli, Low Noise | Gold, Ring Pattern, Stagepin Bernoulli, Low Noise | Gold, Ring Pattern, Stagepin Bernoulli | Gold, Ring Pattern, Stagepin Bernoulli | Gold, Ring Pattern, Stagepin Bernoulli | Gold, Ring Pattern, Stagepin Bernoulli |
|
6
|
|
|
N* |
|
Sep 1 |
 |
261047
|
BTU INTERNATIONAL |
PYRAMAX 100N |
in Ovens
|
1
|
|
|
N* |
|
Sep 1 |
 |
261046
|
KINERGY |
Taping & Array Cut Machine |
in Marking Tools
|
1
|
|
|
N* |
|
Sep 1 |
 |
261045
|
Accretech EUROPE Gmb |
AD3000T |
in Dicing Tools
|
1
|
|
|
N* |
|
Sep 1 |
 |
261044
|
ACA Integration |
AQN2D2 |
in Semiconductor / Hybrid Assembly Equipment
|
1
|
|
|
N* |
|
Sep 1 |
 |
261043
|
Ismeca |
NX32W |
in Device Handlers
|
1
|
|
|
N* |
|
Sep 1 |
 |
261042
|
Infineon Ag (In-Hous |
MMCI |
in Device Testers
|
1
|
|
|
N* |
|
Sep 1 |
 |
261041
|
Incal |
I9472 |
in Device Testers
|
1
|
|
|
N* |
|
Aug 31 |
 |
261033
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261032
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261031
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261030
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261029
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261028
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261027
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261026
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261025
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261024
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261023
|
tosok |
DBD4600 |
in Epoxy Die Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261022
|
Shinkawa |
ACB-3000 |
in Wire Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261021
|
Shinkawa |
ACB-3000 |
in Wire Bonders
|
1
|
|
|
N* |
|
Aug 31 |
 |
261020
|
Shinkawa |
ACB-3000 |
in Wire Bonders
|
1
|
|
|
N* |
|
Aug 18 |
 |
260582
|
Trikon Tech Ltd. |
Sigma FxP200 RevA |
in Production Equipment
Trikon Sigma FxP200 RevA mit MX800 Platform:It´s a Trikon Sigma FxP200 with 4 Std RevA DEP Chambers, 1 RevA HSE (not complete), 1 MKII Heat Chamber. Brooks MX800 Platform with 2 Swing Out VCE6 Loadlocks. The Platform is upgradet from T5 Controller (MX800) to GTM with PC104 Controller. All DEP Chambers HSE and Transport has CTI Onboard 8F Cryos and 2 9600 Cryo Compressor. No Forline Pumps
|
1
|
|
|
N* |
|
Aug 11 |
 |
260357
|
PVA SPA Waferscale WS300 (MET902-03) |
in Wafer Manufacturing Metrology Equipment
PVA SPA Waferscale WS300 (MET902-03):Waferscale for 8" STD / 8" Taiko / 12" STD/ 12" Taiko
|
1
|
|
|
N* |
|
Aug 11 |
 |
260356
|
PVA SPA Waferscale WS200 (MET902-02) |
in Wafer Manufacturing Metrology Equipment
PVA SPA Waferscale WS200 (MET902-02):Waferscale for 8" Wafer STD
|
1
|
|
|
N* |
|
Aug 11 |
 |
260355
|
PVA SPA Waferscale WS200 (MET902-01) |
in Wafer Manufacturing Metrology Equipment
PVA SPA Waferscale WS200 (MET902-01):Waferscale for 8" Wafer STD + Taiko
|
1
|
|
|
N* |
|
Aug 7 |
 |
260094
|
ZwickRoell |
Materialprüfmaschine Z005 TN |
in ALL CATEGORIES
ZWICK-Roell Z005 TN:Two force transducer w1 kN/each Dosierno.: DO669032 last calibration: 11/2018 Stress Range: 1000mm
|
1
|
|
|
N* |
|
Jul 28 |
 |
259661
|
Tel |
ACT12 |
in Lithography Equipment
TEL ACT12 Track 12 Zoll:two process blocks ACT 12 PIQ with 16 HCH Plates, 4 PCT´s 2 DEV Units, 1 WEE last time in production: 07.08.2024
|
1
|
|
|
N* |
|
Jul 28 |
 |
259649
|
Canon |
5500iz |
in Lithography Equipment
CANON 5500iZ - Stepper:'- 12" Standard Wafer Chuck and 12" wafer handling system - SMIF type reticle loading ports and reticle changer unit - Pellicle Particle checker installed - Hg-lamp will be rmoved prior shipping - Coolant will be removed prior shipping - all batteries will be removed prior shipping
|
1
|
|
|
N* |
|