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  • 162 Offer(s) with a matching description:
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 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
203808
2 SET FICO AMS-11-MR MOLDING 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

2 SET FICO AMS-11-MR MOLDING:
FICO AMS-11-MR MOLDING 10005450/10006825

 

2 lot ¥ 8,775,312.00
203088
2 set of inline tester 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

2 set of inline tester:

2 set of inline tester

asset no:10005027 & 10005029


LOCATION: Wuxi
2 ¥ 5,787,004.00
209845
200mm THIN WAFER Loader NSX 

List all items of this typeTest & Measurement - Other

in Test & Measurement Equipment

200mm THIN WAFER Loader NSX:

200mm THIN WAFER Loader NSX

“NIDEC SANKYO Corporation” , Model: “SR8220-019”, SN. „FR00891253“

1 € 1,000.00
219376

Accretech EUROPE Gmb  

MHF 300L 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Manipulater for Accretech:

Manipulator for

Accretech UF200A Prober

 

1   N*
219371

Accretech EUROPE Gmb  

UF200A 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Accretech Prober:

TSK70

Accretech UF200A Prober

CPU Version: ADVME 7507A/MO

Z-Stage: High rigidity

Alignment Board: Cognex 8200

1   N*
219372

Accretech EUROPE Gmb  

UF200A 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Accretech Prober:

TSK129

Accretech UF200A Prober

CPU Version: ADVME 7507A/MO

Z-Stage: High rigidity

Alignment Board: Cognex 8200

1   N*
219373

Accretech EUROPE Gmb  

UF200A 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Accretech Prober:

TSK132

Accretech UF200A Prober

CPU Version: ADVME 7507A/MO

Z-Stage: High rigidity

Alignment Board: Cognex 8200

1   N*
219374

Accretech EUROPE Gmb  

UF200A 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Accretech Prober:

TSK87

Accretech UF200A Prober

CPU Version: ADVME 7507A/MO

Z-Stage: High rigidity

Alignment Board: Cognex 8200

1   N*
219375

Accretech EUROPE Gmb  

UF200A 

List all items of this typeAutomatic Wafer Probers

in Wafer Probers

Accretech Prober:

TSK86

Accretech UF200A Prober

CPU Version: ADVME 7507A/MO

Z-Stage: High rigidity

Alignment Board: Cognex 8200

1   N*
202651

Aixtron  

Aixtron AIX2800G4 

List all items of this typeEpitaxial Cluster Tools

in Epitaxial Reactors

EPI Aixtron G4:

With many spare parts.

1  
199832

Applied Materials  

P5000 

List all items of this typeChemical Vapor Deposition Equipment - Other

in Chemical Vapor Deposition Equipment

P5000 Deposition Tool:

P500047

4 Chambers
CVD standard Chambers 
SNIT

1  
209403

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

P5000 Depositiontool :

P500020

CVD Tool with 4 Chambers
2 Chambers Etch, 2 Chambers CVD
SILAN

1  
209423

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

P5000 Depositiontool P500045:

P500045

4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos

1  
209425

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

P5000 Depositiontool P500049:

P500049

4 Chambers
2 Chambers Etch, 2 Chambers CVD
Teos

1  
218746

Applied Materials  

P5000 

List all items of this typeChemical Vapor Deposition Equipment - Other

in Chemical Vapor Deposition Equipment

Amat P5000 CVD Tool:

P500048

8 inch tool with 4 CVD chambers.

1   F*
219065

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

P5000 Deposition Tool P500030:

P500030

Teos Prozess

We sell this tool without chambers.

1  
219220

Applied Materials  

P5000 

List all items of this typeCluster PECVD Tools

in Production Tools

Amat P5000 CVD Tool:

P500051

Tool with 2 Etch Chambers and 2 Teos Chambers

1  
208202

ASM  

Epsilon 3200 

List all items of this typeEpitaxial Cluster Tools

in Epitaxial Reactors

ASM Epsilon 3200 (Infineon EPI42):

ASM Epsilon 3200 build in 2010 with Asyst Handler

300mm tool in excellent condition

Still installed in a cleanroom in our site Villach/Austria. Full inspection possible.

Was used with Arsen and will decontaminated before de-Installation. 

This is one of two available tools

Please feel free to arrange an inspection date for both.

Infineon internal ID: EPI 42    Please note kindly the ET Item ID: 208202

Sale is offered on condition as and where is

 

1  
208203

ASM  

Epsilon 3200  

List all items of this typeEpitaxial Cluster Tools

in Epitaxial Reactors

ASM Epsilon 3200 (Infineon EPI44):

ASM Epsilon 3200 build in September 2011 with Spartan handler

300 mm tool in excellent condition

Still installed in a cleanroom in our site Villach/Austria. Full inspection possible

Was used with Arsen and will decontaminated before de-Installation

This is one of two available tools

Please feel free to arrange an inspection date for both

Infineon internal ID: EPI 44    Please note kindly the ET Item ID: 208203

Sale is offered on condition as and where is

1  
213293

ASM  

Siplace CA4 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

 

 

1  
207199

ASYS  

BC0 01 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS BC0 01:

Conveyor ASYS BC0 01

1  
207198

ASYS  

TRM02 

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in ALL CATEGORIES

Conveyor ASYS TRM02:

Conveyor ASYS TRM02

1  
216983
Automatic wafer sorter model 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Automatic wafer sorter model:
100069650Automatic wafer sorter model8500024818;A-12-3040-37-D001-A-02
1  
216493

Branson  

Benchmark 1216-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Flux Clean Machine:

Solder Flux Cleaner

1  
216494

Branson  

Benchmark 1216-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Flux Cleaner:

Solder Flux Cleaner

1  
210272

Bruker  

Fabline D8 

List all items of this typeXray Fluorescence Spectrometers

in Spectrometers

Bruker Fabline D8 :

Röntgendiffraktometer zur Messung hochauflösender Röntgenbeugung und Röntgenreflektion mit CU-KA Anode für 6" und 8" Wafer

 

X-Ray Diffractometer for measuring high resolution X-ray Diffraction and Reflection applications with a Cu-kA Anode for 6 and 8 inch wafers

Still in production. Ready for inspection.

1  
216477

CANON EUROPA NV  

FPA-5500iZa 

List all items of this typeI-Line Wafer Stepper

in Wafer Steppers

Canon Stepper FPA-5500iZa:
  • Tool in good condition
  • Inspected by OEM, Inspection report attached (see below)
  • Lense need repair
  • Serialnumber: 5057004
  • Tool build up in cleanroom, ready for inspection
  • Pictures represent current build up status of the tool
1 € 549,000.00 F*R*
219075

CORBEST  

6P9AS-MC 

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Trim/Form/Singulation System Mechanical Press (CORBEST):

Maker: CORBEST Trim/Forming/Singulation System, Capacity: 1.5-2.5tons mechanical press, Date Manufactured: June 2018, Model#:  6P9AS-MC

1 $ 123,914.42
204220
Cyberscan CT350T Dual non-contact double-sided optical profilometer 

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in ALL CATEGORIES

Cyberscan CT350T Dual non-contact double-sided optical profilometer:

2 Tools

- DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE

Tools are still running in production. Available from May/June 2019

Inspection possible!

The tools are pretty new and rarely used. Vintage 2018 and 2015 

The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken.

Please be invited to take a look at the pictures.

2   F*
219475

delvotek  

G5-2 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Aluminum Wire Bonder:

Aluminum Wedge Bonder

1   N*
216503

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd optical inspection

1  
216504

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands-Free Inspection Station:

Used for 3rd Optical Inspection

1  
216505

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd Optical Inspection

1  
216507

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd Optical Inspection Station

1  
216508

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd Optical Inspection

1  
216509

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd Optical Inspection

1  
216510

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd Optical Inspection

1  
216511

dias  

IS-5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Hands Free Inspection Station:

Used for 3rd Optical Inspection

1  
216497

dias  

LD-838 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Paste Dispenser:

Used for dispensing either solder paste or potting material.

1  
195189
Drilling machine bernhard steinel 

List all items of this typeMixed Lots of Lab and Other Technical Equipment

in Laboratory Equipment

Drilling machine bernhard steinel:

Already damaged loses function, was unable to repair.
LOCATION: Wuxi

1 € 0.00
207727

ECA Advance Automati  

EC328FP 

List all items of this typeSMD Handlers

in Device Handlers

1  
207181

EKRA  

E4 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Solder Paste Printer Ekra E4:

Solder Paste Printer Ekra E4

1  
207182

EKRA  

Solder Paste Printer Ekra X5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Solder Paste Printer Ekra X5:

Solder Paste Printer Ekra X5

1  
216495

EO Technics  

BM364 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Laser Marker:

Manual feed Laser Marker

1  
216496

EO Technics  

BM364 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Laser Marker:

Manual Feed Laser Marker

1  
219804
Ergospeed2 Loadport 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

Ergospeed2 Loadport:

~5 Years old 

full functional

1 € 5,999.00 N*
200489

ESEC  

ESEC3088 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2  
213366
ESEC 3088 Wire Bonder 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC 3088 Wire Bonder:
ESEC 3088 Wire BonderPO5627
ESEC 3088 Wire BonderPO5627
ESEC 3088 Wire BonderTransfer AG
ESEC 3088 Wire Bonder200810209;transfer in from IFAG
ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W
ESEC 3088 Wire BonderTransfer AG
ESEC 3088 wirebonder8500043290;transfer from IFAG;661001544

 

7  
217537
ESEC 3088 Wire Bonder 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC 3088 Wire Bonder:
9F392100030150ESEC 3088 Wire BonderPO56279F399100039170ESEC 3088 Wire BonderPO NO 200410327 BNE NO 20040009W
LOCATION: Wuxi
2  
202692
EVG820 Dry Film Lamination System 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

EVG820 Dry Film Lamination System:

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.

1 $ 55,000.00
206584
Fico AMS-11-MR Molding 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Fico AMS-11-MR Molding:
AssetAsset nameAsset name2Physical LocationSerial no.
10004762Inline VI WorkStationTransfer AGCC LINE 21VIF-19
10004924Fico AMS-11-MR MoldingTransfer AG, PO#200710494CC LINE 21INF6312182
10005047Buffer200710495;A-07-3040-37-C017-T-01;IFAG#633451493CC LINE 21BF-048
10004763Inline VI WorkStationTransfer AGCC LINE 21VIB-19

 

4 ¥ 4,052,063.00 F*
207622
FICO AMS-11-MR MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING:
AssetSNo.Asset nameAsset name2Physical LocationSerial no.
100060730FICO AMS-11-MR MOLDING201010012;Mal transfer DS line;inv#6JM/00883108 1FASSY5133182FC18
1 ¥ 4,910,590.66
210403
FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING & FICO AMS-11-MR2 MOLDING:
100052340FICO AMS-11-MR MOLDING200810208;IFMAL#6JM/00360;with NBV transferin
100052341Fico Mold Die201010233;Mal transfer DS line;inv#6JM/00771
100053430FICO AMS-11-MR2 MOLDING200810443;transfer in from IFMY
100073251FICO MOLD DIE8500040046;transfer from IFMY; 6JM/00109
100073252CIQ & Freight: FICO AMS-11-MR2 MOLDING8500040046;transfer from IFMY; 6JM/00109
100057320FICO AMS-11-MR MOLDING201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057321Fico Mold Die201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057322CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057323CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100057324SCD80 M2 FICO Molding-upgrade SOT343201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
100075920FICO AMS-11-MR MOLDING8500045354;transfer from IFMY; 6JM/00645
100075921Fico Mold Die8500045354;transfer from IFMY; 6JM/00645
100075922CURING OVEN8500045354;transfer from IFMY; 6JM/00645
100075923CIQ & freight: FICO AMS-11-MR MOLDING8500045354;transfer from IFMY; 6JM/00645

 

4  
212157

Fico Besi  

AMS-11-MR 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
212408

Fico Besi  

AMS-11-MR 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
211897

Fuji Seiki  

ECB 10016 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
219470

fujiwa  

TEP 250-70SD 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Manual Transfer Mold:

Single Plunger Mold, 250 tonnes

1   N*
219471

fujiwa  

TEP 250-70SD 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Manual Transfer Mold Press:

Manual Mold Press, 250 Tonnes

1   N*
208137

Hanmi Semiconductor  

SPLITTING SYSTEM 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
203804
Heraeus Oven & Oven Table 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot ¥ 31,003.00
155055

Hitachi  

VP-1500 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

MONOCHROME COPIER:
MONOCHROME COPIER

MONOCHROME COPIER
LOCATION: Malacca
SERIAL NUMBER(S): TA0101513
1 € 2,662.70
214949
HMI E SCANLIGHT - EBEAM 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

HMI E SCANLIGHT - EBEAM:

200/300mm Bridge Tool, Last audit health status report available

1  
204380

Infineon  

Bruchless Motor bench 

List all items of this typeTest & Measurement - Other

in Test & Measurement Equipment

Bruchless Motor bench:

Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).

For more informations please refer to the enclosed diagram and the motor description below. 

Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)

This three-phase motor works with the Kelly controller (described below)

• Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts)

• Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center.

• This is a 4 pole motor (8 magnets).

• The Phase to Phase winding resistance is 0.013 Ohms.

• The maximum recommended rotor speed is 5000 RPM.

• Voltages from 0 to 96 VDC input to the control.

• Torque constant of 0.15 Nm per Amp

• The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase.

• Armature Inertia is 45 Kg Cm Squared.

• Continuous current of 125 Amps AC (180 Amps DC into the motor control).

• Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control).

• Weight of 35 pounds.

• Peak Stall Torque of 90 Nm (66 ft).

• This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise).

 

Kelly KBL72301,24-72V,300A,BLDC Controller/With Regen

Kelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control.

Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily.

Features:

• Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency.

• Electronic reversing.

• Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V.

• Current sense on all 3 motor phases.Current control loop.

• Hardware over current protection.Hardware over voltage protection.

• Support torque mode, speed mode, and balanced mode operation.

• Configurable limit for motor current and battery current.

• Low EMC.LED fault code.

• Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage.

• Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal.

• Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.

1 lot  
208163

Ingenious Equipment  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

100% VI Station:

Motorized Indexer for  100%VI Station after Taping + PLC Controller

1  
208164

Ingenious Equipment  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

100% VI Station:

Motorized Indexer for  100%VI Station after Taping + PLC Controller

1  
208165

Ingenious Equipment  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

100% VI Station:

Motorized Indexer for  100%VI Station after Taping + PLC Controller

1  
202596
INGERSOLL RAND heat reactivated regenerative air dryers 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

INGERSOLL RAND heat reactivated regenerative air dryers:

INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846

 

 


LOCATION: Wuxi
1 ¥ 391,740.00
217557
Inliner Machine 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

Inliner Machine:
9F572100057340Inliner Machine201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
9F572100057341CIQ inspect fee in Malacca201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
9F572100057342freight : Inliner Machine201010228;A-10-3040-37-D008-T-06; inv#6JM/00520
9F572100058380Inliner Machine201010229;A-10-3040-37-D008-T-07;Inv#6JM/00638

 

2  
217534
Inliner Machine 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Inliner Machine:
9F587100074770Inliner Machine8500043739;transfer from IFMY; 6JM/00486
9F587100074771fright: Inliner Machine8500043739;transfer from IFMY; 6JM/00486
1  
212377
INLINER MACHINE,Trim & Form Machine 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

INLINER MACHINE,Trim & Form Machine:
100070530INLINER MACHINE8500035930;transfer asset from IFMY; 6JM/00922
100070531freight: INLINER MACHINE8500035930;transfer asset from IFMY; 04011117
100070532CIQ fee and freight: INLINER MACHINE8500035930;transfer asset from IFMY; 6JM/00922
100047060Trim & Form MachineTransfer MY
100047061Trim & Form Machine0
100047062Cut & Bending ToolTransfer MY
100066520TRIM&FORM MACHINE8500029675;transfer from IFMY;INV# 6JM/00192
100066521customs duty: TRIM&FORM MACHINE8500029675;transfer from IFMY;INV# 6JM/00192
100066522hookup: TRIM&FORM MACHINE8500029675;transfer from IFMY;INV# 6JM/00192

 

3  
207724

Iwashita Instruments  

IWASHITA MG Inline 3030 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
204631
Lauffer Mold Press  

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 ¥ 2,526,419.44
204582
Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   F*
217059

LPE  

PE3061D 

List all items of this typeEpitaxial Cluster Tools

in Epitaxial Reactors

Epi LPE PE3061D:

Epi43

Epi tool for Epi Layers from 0 until 120µ thickness

One Chamber for 5 Wafers

Spares in value of ~49k$ included

1 $ 395,000.00 F*R*
205912

Matrix Corp  

Matrix X3 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

Matrix X3 X-Ray System:

high speed X-Ray system 

1  
212158

Memmert Gmbh+Co  

ULP800 

List all items of this typeOvens - Other

in Ovens

1  
212159

Memmert Gmbh+Co  

ULP800 

List all items of this typeOvens - Other

in Ovens

1  
217535

Multitest  

MT 2168 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Test Handler:

Automatic Pick n Place Handler

> soak capacity for JEDEC trays
> temperature accuracy +/- 1.0º C
> scalable configuration

1  
217532

Multitest  

MT 2168 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Test Handler:

Automatic Pick n Place Tester Handler:

> soak capacity for JEDEC trays
> temperature accuracy +/- 1.0º C
> scalable configuration

1  
217533

Multitest  

MT 2168 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Test Handler:

Automatic Pick n Place Handler

> soak capacity for JEDEC trays
> temperature accuracy +/- 1.0º C
> scalable configuration

1  
200892

Multitest  

MT2168 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Test Tool ABC development project:


Test Tool from multitest was rarely used for development project ABC

- Excellent Condition (Basically new)

- Complete (no missing parts) 
- No Damages

LOCATION: Tijuana Mexico


Description: 

- Fully testing COOLiR2DIE at high current and voltage presents challenges for a test system and handler
> Test team chose the LEMSYS test solution
> Tester capability:  2000A/2000V for static and 2000A/1500V for dynamic testing
- The handler choice was limited due to the package size and exposed die
- Multitest with vertically docked pick & place handlers
> A custom manipulator from ESMO was required to provide a working interface on a “headless” LEMSYS tester




1 $ 98,000.00
147228

Multitest  

MT8502 

List all items of this typeDIP Handlers

in Device Handlers

Multitest MT8502 TriTemp gravity Handler:
Multitest MT8502 TriTemp gravity Handler

Multitest MT8502 TriTemp gravity Handler
LOCATION: MchC
SERIAL NUMBER(S): na
1   F*
209427

Multitest  

MT8589 

List all items of this typeSMD Handlers

in Device Handlers

1   F*
209428

Multitest  

MT8589 

List all items of this typeSMD Handlers

in Device Handlers

1  
207180
Nanofocus µsprint 3d inspection system with Baumann Handler 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

1 € 50,000.00
203189

NexGen Technologies  

Nexgen Prober 2013 Model 

List all items of this typeProbe Equipment - Other

in Wafer Probers

NEXGEN SEMI AUTOMATIC PROBER:

NexGen semi-automatic prober

for 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.

More information available below and on the enclosed flyer :

Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec

ZStage/Chuck 

- Range : 0.200" (other configurations available)

- Speed : 11 ms

Loader (Wafer Handler)

- Cassette capacity : 2 Standard; 1 sender, 1 receiver

- Wafer handling : Belt and vacuum arm

- Fine alignment : CCD Image Processing

- Hard Disk Drive : 60 -250 gig

- Disk Drives : USB, CD/RW, DVD Writer

- Display : 22" Color Screen Monitor

- Power consumption (included) : 1.5 KVA

Facilities Required

- Air : 75 PSI @ 3 CFM

- Vacuum : 25in/hg

- Dimensions 

InchesCm
48"w x 32"d x  60"h115 (L) x 80 (l) x 140 (h)

 - Weight 

LbKg
700317
1  
216483

Nikon  

L200 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

High Power Microscope:

Used for wafer incoming inspection.

1  
216484

Nikon  

L200 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

High Power Microscope:

Used for wafer incoming inspection.

1  
216485

Nikon  

L200 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

High Power Microscope:

Used for wafer incoming inspection.

1  
202453

Nitto Denko  

Nitto MSA840 

List all items of this typeWafer Production Equipment - Other

in Production Equipment

Nitto MSA840 Mounting Machine 10004095:

Nitto MSA840 Mounting Machine

1 € 53,281.00
204578

Orbotech  

Ultra Discovery VM 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

AOI Orbotech Ultra Discovery VM:

Simple, Intelligent, Powerful

Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production.

Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time.

Benefits

  • High throughput and superior detection with minimal number of false calls
  • Especially designed for inspection of the finest lines down to 10μm
  • Quick set-up even for the most complicated jobs for higher productivity
  • Automation ready
  • Very high uptime
  • SIP TechnologyTM

    Push-to-Scan®:

    • A ‘no set-up’ process
    • Top AOI results with minimal effort or training
    • The easiest, user-friendly interface (GUI)
    • Full ‘Step and Repeat’ functions

    Visual Intelligence:

    Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want.

    Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects.

    Visual Intelligence:

    • Full panel understanding, context-based detection engine
    • Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed

       

 

1 $ 24,900.00
219472

OTC  

DIP 30LD Deculler 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Mold Degator:

Separates molded parts from the runner.

1   N*
219473

OTC  

DIP Mold Frame loader 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Auto Mold Frame Loader:

Automating Frame Loader for Manual Mold Press.

1   N*
219477

OTC  

Mold Deculler 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Mold Deculler:

Mold Deculler for SDx

1   N*
192280
Over Head Transport System (OHT) SRC320 

List all items of this typeSemiconductor Facilities Equipment - Other

in Semiconductor Manufacturing Facilities Equipment

Over Head Transport System (OHT) SRC320:



A high quantity of SRC 320 parts.

  • SRC320 Vehicles (~50 pc.)
  • SRC320 SCPS-ZCU
  • SRC320 ICC
  • SRC320 PDU
  • SRC320 Rail parts
  • Foup Handler Stocker

 

 

Please get in touch with the Equipment Trade Category Manager to get more information or price lists.

 

1  
166465

Oxford Instruments  

CMI 950 

List all items of this typeXray Fluorescence Spectrometers

in Spectrometers

CMI 950 - Xray fluorescence spectrometer:
X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc.
Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag).

System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
1   F*
212160

P & P Tech  

NA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
211895

P&P TECH  

PP.103 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

1  
211896

P&P TECH  

PP.103 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

1  
213168

Peter-Wolters  

Gemini P200 

List all items of this typeCMP Polishers

in Chemical Mechanical Planarization Equipment

Peter Wolters Gemini P200:

8" Wafersize; Cleanertype: SSEC, different upgrades (e.g. McMillan Flowcontroller instead Slurrypump)

Last Process: Tungsten-Polish

 

1   F*
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  F* if the item is specially featured
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