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	View All Offers Under Flip Chip Bonders » Switch Major Category		Click an item's ID# below for its full specifications , or: Group Offers into sub-categories under Flip Chip Bonders List all 2 product types under Flip Chip Bonders

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Item ID  Short Description Product Type / Details # Price Notes Make Model     213293 ASM   Siplace CA4  Automatic Flip Chip Bonders in Flip Chip Bonders ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch: SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems  - 4 LP-Kamera (TYP34) and bonding Head C+P20     1   232885 tosok   Texus DBD4600  Automatic Flip Chip Bonders in Flip Chip Bonders TOSOK DBD4600 DIE BONDER: TOSOK DBD4600 DIE BONDER 1   232886 tosok   Texus DBD4600  Automatic Flip Chip Bonders in Flip Chip Bonders TOSOK DBD4600 DIE BONDER: TOSOK DBD4600 DIE BONDER 1   232887 tosok   Texus DBD4600  Automatic Flip Chip Bonders in Flip Chip Bonders TOSOK DBD4600 DIE BONDER: TOSOK DBD4600 DIE BONDER 1   232899 tosok   TOSOK DBD4600  Automatic Flip Chip Bonders in Flip Chip Bonders TOSOK DBD4600 DIE BONDER: TOSOK DBD4600 DIE BONDER_FLUX DIP 2 sets to be offer out TG92, TG93 2   232900 tosok   TOSOK DBD4600  Automatic Flip Chip Bonders in Flip Chip Bonders TOSOK DBD4600 DIE BONDER: TOSOK DBD4600 DIE BONDER_FLUX DIP 4 sets to be offer out TG97, TG98, TG99, TG108 4   232901 tosok   TOSOK DBD4600  Automatic Flip Chip Bonders in Flip Chip Bonders TOSOK DBD4600 DIE BONDER: TOSOK DBD4600 DIE BONDER_FLUX DIP 3 sets to be offer out TG110, TG111, TG113 3

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
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  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.