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FULL DESCRIPTION of Item 253705

in Other Semiconductor Manufacturing Equipment
Item ID: 253705

Offered 5 Offered at Best Price


SHINKAWA ACB35&ACB400 WIRE BOND scrap

The capacity of  S132-S135 S226 have been reduced from Oct’24 onwards.

SHINKAWA ACB35&ACB400 WIRE BOND scrap
Unit Price Unstated
Number of Units 5
Condition Poor
Year of Manufacture 2000

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment