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FULL DESCRIPTION of Item 251292

in Other Semiconductor Manufacturing Equipment
Item ID: 251292

Offered 6 Offered at Best Price


TSSOP10 SHINKAWA ACB35 WIRE BOND SCRAP

AssetInventory NumberAsset name
304008003535010006085SHINKAWA ACB35 WIRE BOND
304008003536010006086SHINKAWA ACB35 WIRE BOND
304008003537010006087SHINKAWA ACB35 WIRE BOND
304008003538010006088SHINKAWA ACB35 WIRE BOND
304008003539010006089SHINKAWA ACB35 WIRE BOND
304008003540010006090SHINKAWA ACB35 WIRE BOND
TSSOP10 SHINKAWA ACB35 WIRE BOND SCRAP
Unit Price Unstated
Number of Units 6
Condition Poor
Year of Manufacture 2000

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment